NF Z87-019-25-1995 Equipment engineering (ee) Environmental conditions and environmental tests for telecommunication equipment Part 2-5 specification of environmental tests Ground.pdf

相关资源

IRS 70778-2-2018 Recommendations for determining the carrying capacity and fatigue risks of existing metallic railway bridges.pdf

IRS 70712-2018 Rail defects.pdf

IRS 50596-6-2018 Conditions for coding intermodal loading units in combined transport combined transport lines and wagons.pdf

IRS 50596-5-2018 Transport of road vehicles on wagons-Technical Organisation-Conveyance of semi-trailers with P coding or N coding on recess wagons.pdf

IESNA TM-23-2017 Lighting Control Protocols.pdf

IESNA RP-2-2017 Recommended Practice for Retail Lighting.pdf

ITU-R RAPPORT M 766-2 FRENCH-1990 Feasibility of frequency sharing between the GPS and other services《全球定位系统和其他服务之间的频率共享的可行性》.pdf

ITU-R RAPPORT M 763-3 FRENCH-1990 Signal level variation due to multipath effects and blockage by ship-s superstructure in maritime mobile-satellite service lin.pdf

ITU-R RAPPORT M 739-1 FRENCH-1986 Interference due to intermodulation products in the land mobile service between 25 and 100 MHz《由于互调产物在陆地移动服务25和100 MHz之间产生的干扰》.pdf

ITU-R RAPPORT M 319-7 FRENCH-1990 Characteristics of equipment and principles governing the assignment of frequency channels between 25 and 100 MHz for land mob.pdf

猜你喜欢

DIN EN 60172-2016 Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires (IEC 60172 2015) German version EN 60172 2015《测定漆包和带包绕组线.pdf

DIN EN 60188-2002 High-pressure mercury vapour lamps - Performance specifications (IEC 60188 2001) German version EN 60188 2001《高压汞蒸气灯 性能规范》.pdf

DIN EN 60191-1-2007 Mechanical standardization of semiconductor devices - Part 1 General rules for the preparation of outline drawings of discrete devices (IEC 60191-1 2007) German.pdf

DIN EN 60191-3 Bb 1-2006 Mechanical standardization of semiconductor devices - Part 3 General rules for the preparation of outline drawings of integrated circuits - Supplement 1 Ex.pdf

DIN EN 60191-3-2000 Mechanical standardization of semiconductor devices - Part 3 General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3 1999) Ger.pdf

DIN EN 60191-4-2014 Mechanical standardization of semiconductor devices - Part 4 Coding system and classification into forms of package outlines for semiconductor device packages (.pdf

DIN EN 60191-6-1-2002 Mechanical standardization of semiconductor devices - Part 6-1 General rules for the preparation of outline drawings of surface mounted semiconductor device p.pdf

DIN EN 60191-6-10-2004 Mechanical standardization of semiconductor devices - Part 6-10 General rules for the preparation of outline drawings of surface mounted semiconductor device.pdf

DIN EN 60191-6-12-2011 Mechanical standardization of semiconductor devices - Part 6-12 General rules for the preparation of outline drawings of surface mounted semiconductor device.pdf