ONORM M 9121 Beib 1-1992 Machine tools - Acceptance conditions for machining centres with horizontal spindle - General terms in foreign languages《机床 卧式主轴加工中心的验收条件 一般术语外语》.pdf

相关资源

IRS 70778-2-2018 Recommendations for determining the carrying capacity and fatigue risks of existing metallic railway bridges.pdf

IRS 70712-2018 Rail defects.pdf

IRS 50596-6-2018 Conditions for coding intermodal loading units in combined transport combined transport lines and wagons.pdf

IRS 50596-5-2018 Transport of road vehicles on wagons-Technical Organisation-Conveyance of semi-trailers with P coding or N coding on recess wagons.pdf

IESNA TM-23-2017 Lighting Control Protocols.pdf

IESNA RP-2-2017 Recommended Practice for Retail Lighting.pdf

ITU-R RAPPORT M 766-2 FRENCH-1990 Feasibility of frequency sharing between the GPS and other services《全球定位系统和其他服务之间的频率共享的可行性》.pdf

ITU-R RAPPORT M 763-3 FRENCH-1990 Signal level variation due to multipath effects and blockage by ship-s superstructure in maritime mobile-satellite service lin.pdf

ITU-R RAPPORT M 739-1 FRENCH-1986 Interference due to intermodulation products in the land mobile service between 25 and 100 MHz《由于互调产物在陆地移动服务25和100 MHz之间产生的干扰》.pdf

ITU-R RAPPORT M 319-7 FRENCH-1990 Characteristics of equipment and principles governing the assignment of frequency channels between 25 and 100 MHz for land mob.pdf

猜你喜欢

KS C IEC 60747-6-2006 Semiconductor Devices－Discrete devices－Part 6：Thyristors《半导体器件 第6部分 晶闸管》.pdf

KS C IEC 60747-8-2002 Discrete devices－Part 8：Field－effect transistors《半导体器件 第8部分 场效应晶体管》.pdf

KS C IEC 60748-1-2002 Semiconductor devices－Integrated circuits－Part 1：General《半导体器件 集成电路 第1部分 总则》.pdf

KS C IEC 60748-2-2001 Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits《半导体器件 集成电路 第2部分 数字集成电路》.pdf

KS C IEC 60748-3-2002 Semiconductor devices－Integrated circuits Part 3：Analogue integrated circuits《半导体器件 集成电路 第3部分 模拟集成电路》.pdf

KS C IEC 60749-1-2006 Semiconductor devices－Mechanical and climatic test methods－Part 1：General《半导体器件 机械和气候试验方法 第1部分 总则》.pdf

KS C IEC 60749-14-2006 Semiconductor devices－Mechanical and climatic test methods－Part 14：Robustness of terminations(lead integrity)《半导体器件 机械和气候试验方法 第14部分 终端装置的坚固性(引线牢固性)》.pdf

KS C IEC 60749-16-2006 Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)《半导体器件 机械和气候试验方法 第16部分 粒子冲击噪声探测(PIND)》.pdf

KS C IEC 60749-17-2006 Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation《半导体器件 机械和气候试验方法 第17部分 中子辐照》.pdf