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5、2-03 Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder NOTICE This document has been taken directly from the original TechAmerica document and contains only minor editorial and format changes required to bring it into conformance with the publishi
6、ng requirements of SAE Technical Standards. The release of this document is intended to replace the original with the SAE International document. Any numbers established by the original document remain unchanged. The original document was adopted as an SAE publication under the provisions of the SAE
7、 Technical Standards Board (TSB) Rules and Regulations (TSB 001) pertaining to accelerated adoption of specifications and standards. TSB rules provide for (a) the publication of portions of unrevised specifications and standards without consensus voting at the SAE committee level, and (b) the use of
8、 the existing specification or standard format. TechAmerica Standard Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder GEIA-STD-0005-1-REV A March 2012 GEIA-STD-0005-1-REVANOTICE TechAmerica Engineering Standards and Publications are designed to s
9、erve the public interest by eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standar
10、ds and Publications shall not in any respect preclude any member or nonmember of TechAmerica from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than TechAmeri
11、ca members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by TechAmerica in accordance with the American National Standards Institute (ANSI) patent policy. By such action, TechAmerica does not assume any liability to any patent owne
12、r, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This TechAmerica Standard is considered to have International Standardization implications, but the ISO/IEC activity has not progressed to the point where a valid comparison between the TechAmerica Standar
13、d and the ISO/IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the app
14、licability of regulatory limitations before its use. (Formulated under the cognizance of the TechAmerica (APMC) Avionics Process Management Committee and the (G-12) Solid State Devices Committee. This is a joint activity of the Aerospace Industries Association (AIA), Avionics Maintenance Conference
15、(AMC), and TechAmerica, to address aerospace issues related to the global elimination of lead from electrical and electronic equipment put on the market after July 1, 2006. Formed in 2004, this coalition includes all stakeholders (market segments, supply chain, geographic regions.) Published by 2012
16、 TechAmerica Standards however, it also may be applicable, at the discretion of the user, to other products with similar characteristics. These characteristics include low-volume, use in rugged environments, and requirements for high reliability, long lifetime, and reparability. An example would be
17、ground-based, mission-critical military electronics. Other industries may use this standard by substituting the name of their industry for the word “aerospace” in this standard. The Aerospace Industries Association (AIA), the Avionics Maintenance Conference (AMC), and Government Electronics and Info
18、rmation Technology Association (GEIA) formed the Pb-free Electronics in Aerospace Project Working Group (LEAP WG) to generate a series of industry standards and handbooks for the use and handling of Pb-free solder, piece parts and PBs in ADHP systems. This standard was prepared by the LEAP WG; and w
19、as balloted and approved by GEIA G-12 (Solid State Subcommittee) and the GEIA Avionics Process Management Committee. This standard is intended to work in concert with GEIA-HB-0005-1, GEIA-HB-0005-2, GEIA-HB-0005-3, GEIA-STD-0005-2, and GEIA-STD-0005-3. This standard may be referenced in proposals, r
20、equests for proposals, work statements, contracts, and other ADHP industry documents. Acknowledgments This document was revised by a team of subject matter experts (SMEs) from industry and the DoD. The core working group team members are: David Burdick Team Leader Boeing Dave Humphrey Honeywell Anth
21、ony Rafanelli Raytheon Thomas Eden Gables Engineering David Locker U.S. Army Frederic Relmy-Madinska Airbus Daniel K. Kaspari Rockwell Collins Louis Feinstein Textron Defense Systems Dr. William L. Procarione Boeing Dr. Stephen J. Meschter BAE Systems Joel Heebink Honeywell Robert Vanderwiel Lockhee
22、d Martin Steven Davidson Northrop Grumman Lloyd Condra Boeing GEIA-STD-0005-1-REV A iii Introduction The European Union (EU) has enacted two directives; 2002/95/EC Restriction of Hazardous Substances (RoHS) and 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) that restrict or eliminate th
23、e use of various substances in a variety of products that are put on the market after July 2006. These were later updated by directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic eq
24、uipment (recast). One of the key materials restricted is lead (Pb), which is widely used in electronic solder and electronic piece part terminations. These regulations may appear to affect only products for sale in the EU. However, due to the reduced market share of the ADHP industries, many of the
25、lower tier suppliers to those industries will change their products to serve their primary, non-ADHP markets. Additionally, several U.S. states have enacted similar “green” laws and many Asian electronics manufacturers have recently announced completely green product lines. Since ADHP is one of the
26、few major industrial sectors that still repair Circuit Card Assemblies (CCAs) and the Pb-free materials and processes are relatively immature and not fully understood, an aerospace-wide approach to their application is desired. ADHP companies may be developing and/or managing Pb-free electronics and
27、 whose products fall into one of the five categories below: 1. Products that have been designed and qualified with traditional tin-lead (SnPb) electronic piece parts, materials, and assembly processes, and that will need to be maintained in the SnPb configuration. 2. Products that have been designed
28、 and qualified with traditional SnPb electronic piece parts, materials and assembly processes, and have incorporated Pb-free electronic piece parts; 3. Products that have been designed and qualified with SnPb materials, and are re-designed and re-qualified with Pb-free materials; 4. Products that ha
29、ve been designed and qualified with Pb-free electronic piece parts, materials, and assembly processes, and that will need to be maintained in the Pb-free configuration. 5. Commercial-Off-The-Shelf (COTS) assemblies built with Pb-free materials. The risks with Pb-free technology include: 1. For some
30、service conditions, use of Pb-free solder may compromise electronic interconnection performance and, due to differences in fatigue characteristics under thermal cycling and vibration relative to traditional solders. 2. Use of Pb-free surface finishes such as pure tin can lead to the formation of tin
31、 whiskers which in turn can result in various levels of product and system failure. This page intentionally left blank.GEIA-STD-0005-1-REV A 1 1 Scope This standard defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electron
32、ic systems containing Pb-free solder, piece parts, and PBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. It is intended to communicate requirements for a Pb-free Control Plan (LFCP), here
33、inafter referred to as the Plan, and to assist the Plan Owners in the development of their own Plans. The Plan documents the Plan Owners processes that assure their customers, and all other stakeholders that the Plan Owners products will continue to meet their requirements, given the risks stated in
34、 the Introduction. This standard does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the ADHP industries that must be addressed by the processes. Pb-free risk management should be accomplished through
35、specific requirements added to the Plan Owners existing infrastructure of product management and control. This standard applies to the ADHP electronics system supply chain. The control of the Pb-free activities shall be accomplished by the Plan Owner addressing the requirements of their Customer. Th
36、ese activities include, but are not limited to, those performed by the System Integrator, the OEM, and their respective supply chains, to the lowest level possible. This must be done with the knowledge that, at the component level, the aerospace industry may not have a great influence over those sup
37、pliers. In such cases, the Plan Owner assumes responsibility. Some applications may have unique requirements that exceed the scope of this standard. The extended scope should be covered separately. The requirements of this standard may be tailored to address unique/specific program needs. If tailori
38、ng is performed, the user shall obtain documented customer concurrence. Annex A provides a tailoring template that may be used. GEIA-STD-0005-1-REV A 2 2 References 2.1 Normative ANSI/GEIA-649-A, National Consensus Standard for Configuration Management ASME Y14.100, Engineering Drawing Practices GEI
39、A-HB-649, Implementation Guide for Configuration Management GEIA-HB-0005-1, Program Managers Handbook for Managing the Transition to Lead-free Electronics, June 2006. GEIA-HB-0005-2, Technical Guidelines for Using Lead-free Solder in Aerospace, and High Performance Applications, November 2007. GEIA-
40、STD-0005-2, Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems, June 2006. GEIA-STD-0005-3, Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes, June 2008 GEIA-HB-0005-3, Rework/R
41、epair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems, September 2008. IPC/JEDEC J-STD-609, Marking and Labeling of Components, PBs and PB Assemblies to Identify Lead (Pb), Pb-Free and other Attributes. 2.2 Infor
42、mative IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. IPC/EIA J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires. IPC/EIA J-STD-0003, Solderability Tests for Printed Boards. IPC/EIA J-STD-005, Requirements for Soldering Pastes
43、. IPC/EIA J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices. IPC/EIA J-STD-028, Performance Stand
44、ard for FlipChip/Chip Scale Bumps. IPC/JEDEC J-STD-033, Standard for Handling, Packing, and Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices. ARINC Project Paper 671: Guidelines for Lead-free Soldering, Repair, and Rework, draft 1, 31 March 2005. IEC 60068-2, Environmental Testing
45、. IEC 61188-5, Design Guide for Printed Boards and Board Assemblies. IEC 61190-1, Attachment Materials for Electronic Assemblies. IEC 61191-1, Printed Circuit Board Assemblies. IEC 61192, Assembly Product Performance Requirements. IPC-SPV-WP-006, Round Robin Testing and Analysis Lead-free Alloys Tin
46、, Silver and Copper. IPC-9701, Performance Test Methods an Qualification Requirements for Surface Mount Solder GEIA-STD-0005-1-REV A 3 Attachments. IPC A-610, Acceptability of Electronic Assemblies. IPC-6012, Qualification and Performance Specifications for Rigid Printed Boards. IPC-6013, Qualificat
47、ion and Performance Specifications for Flexible Printed Boards. IPC-6015, Qualification and Performance Specifications for Organic Multichip Modules Mounting and Interconnecting Structures. IPC-2221, Generic Standard on Printed Board Design. IPC-2222, Sectional Standard on Rigid Organic Printed Boar
48、ds. IPC-2223, Sectional Design Standard for Flexible Printed Boards. IPC-2225, Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies. JESD-97, Marking, Symbols, Labels for Identification of Lead (Pb) Free Assemblies, Components, and Devices. GEIA-STD-0005-1-REV A 4 3 T
49、erms and Definitions For purposes of this standard, the following terms and definitions apply ANSI - American National Standards Institute Assemblies - are electronic items that require electrical attachments, including soldering of wires or component terminations; examples include circuit cards and wire harnesses. BGA Ball Grid Array Critical item or function - if defective, will result in the systems inability to retain
