1、SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirelyvoluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefro
2、m, is the sole responsibility of the user.”SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions.QUESTIONS REGARDING THIS DOCUMENT: (724) 772-8512 FAX: (724) 776-0243TO PLACE A DOCUMENT
3、 ORDER; (724) 776-4970 FAX: (724) 776-0790SAE WEB ADDRESS http:/www.sae.orgCopyright 1988 Society of Automotive Engineers, Inc.All rights reserved. Printed in U.S.A.SURFACEVEHICLE400 Commonwealth Drive, Warrendale, PA 15096-0001STANDARDSubmitted for recognition as an American National StandardJ1213/
4、2ISSUEDOCT88Issued 1988-10GLOSSARY OF RELIABILITY TERMINOLOGY ASSOCIATED WITH AUTOMOTIVE ELECTRONICSForewordThis Document has not changed other than to put it into the new SAE Technical Standards BoardFormat.This glossary has been compiled to assist, by serving as a reference, in the communication b
5、etween theautomotive electronics engineer and the reliability engineer.1. ScopeThis compilation of terms, acronyms and symbols was drawn from usage which should be familiar tothose working in automotive electronics reliability. Terms are included which are used to describe how items,materials and sy
6、stems are evaluated for reliability, how they fail, how failures are modeled and how failures areprevented. Terms are also included from the disciplines of designing for reliability, testing and failure analysisas well as the general disciplines of Quality and Reliability Engineering. This glossary
7、is intended to augmentSAE J1213, Glossary of Automotive Electronic Terms.2. References2.1 Applicable PublicationsThe following publications form a part of this specification to the extent specifiedherein. Unless otherwise indicated, the latest version of SAE publications shall apply.2.1.1 SAE PUBLIC
8、ATIONAvailable from SAE, 400 Commonwealth Drive, Warrendale, PA 15096-0001.SAE J1213Glossary of Automotive Electronic TermsSAE AE-9 1987Automotive Electronics Reliability Handbook2.2 Related PublicationsA listing of applicable military and other organizational reference documents, fromwhich many of
9、these terms and definitions were drawn, is provided as a source of alternate or relateddefinitions.MilitaryMIL-STD-105DSampling Procedures and Tables for Inspection by AttributesMIL-STD-202ETest Methods for Electronic and Electrical Component PartsMIL-HDBK-217DReliability Prediction of Electronic Eq
10、uipmentMIL-STD-280ADefinitions of Item Levels, Item Exchangeability, Models, and Related TermsMIL-STD-414Sampling Procedures and Tables for Inspection by Variables for Percent DefectiveMIL-STD-756BReliability Models and PredictionMIL-STD-781CReliability Design Qualification and Production Acceptance
11、 Tests ExperimentalCOPYRIGHT Society of Automotive Engineers, Inc.Licensed by Information Handling ServicesSAE J1213/2 Issued OCT88-2-MIL-STD-790BReliability Assurance Program for Electronic Parts SpecificationMIL-STD-810CEnvironmental Test MethodsMIL-STD-883BTest Methods and Procedures for Microele
12、ctronicsMIL-STD-1313Microelectronics Terms and DefinitionsMIL-Q-9858AQuality Program RequirementsAR-92Quality Program RequirementsMIL-S-195001Semiconductor Devices, General Specification forMIC M38510DMicrocircuits, General Specifications forMIL-STD-470Maintainability Program Requirements for System
13、s and EquipmentsMIL-STD-471AMaintainability Verification/Demonstration/EvaluationMIL-HDBK-472Maintainability PredictionMIL-STD-891Contractor Parts Control and Standardization ProgramMIL-STD-701Preferred and Guidance List of Semiconductor DevicesMIL-STD-198ASelection and Use of CapacitorsMIL-STD-199B
14、Selection and Use of ResistorsMIL-STD-1562List of Standard MicrocircuitsMIL-STD-976Certification Requirements for JAN MicrocircuitsEIAReliability Bulletin No. IA General Guide for Technical Reporting of Electronic Reliability MeasurementReliability Bulletin No. 4AReliability QualificationsReliabilit
15、y Bulletin No. 5Equipment Reliability Specification GuidelineReliability Bulletin No. 10Selection and Validation of Low Population and/or State of the Art PartsReliability Bulletin No. 9Failure Mode and Effects AnalysesReliability Bulletin No. 8Equipment Burn-InEngineering Bulletin No. 17User Guidel
16、ines for Quality and Reliability Assurance of LSI ComponentsEngineering Bulletin No. 11User Guidelines for Microelectronic Reliability EstimationJEDEC Standard No. 22Test Methods and Procedures for Solid State Devices Used in Transportation/Automotive ApplicationsOtherASQC 1973Glossary and Tables fo
17、r Statistical Quality ControlASQC Procurement Quality Control - 2nd EditionANSI/ASQC A3-1978Quality Systems TerminologyANSI/ASQC A2-1978Terms, Symbols and Definitions for Acceptance SamplingANSI/ASQC A1-1978Definitions, Symbols, Formulas and Tables for Control ChartsHow to Speak Fluent Quality- Nati
18、onal Semiconductor Co.RDH 376Reliability Design Handbook - Reliability Analysis CenterWPS-1Analysis Techniques for Mechanical Reliability - Reliability Analysis Center1987 Desk Manual- Microelectronic Manufacturing and TestingThe American Heritage Dictionary- 2nd College Edn. 1982 Houghton Mifflin C
19、o.3. Definitions3.1 Accelerated Life TestA life test under test conditions that are more severe than usual operating conditions.It is necessary that a relationship between test severity and the probability distribution of life be ascertainable.3.2 Acceleration Factora. The factor by which the failur
20、e rate can be increased by an increased environmental stress.b. The ratio between the times necessary to obtain the same portion of failure in two equal samplesunder two different sets of stress conditions, involving the same failure modes and mechanisms.COPYRIGHT Society of Automotive Engineers, In
21、c.Licensed by Information Handling ServicesSAE J1213/2 Issued OCT88-3-3.3 Accept/reject TestA test, the result of which will be the action to accept or reject something, for example, anhypothesis or a batch of incoming material.3.4 Acceptable Quality Level (AQL)The maximum percent defective which ca
22、n be considered satisfactory as aprocess average, or the percent defect whose probability of rejection is designated by .3.5 Acceptance NumberThe largest number of defects that can occur in an acceptance sampling plan and stillhave the lot accepted.3.6 Acceptance Sampling PlanAn accept/reject test w
23、hose purpose is to accept or reject a lot of items ormaterial.3.7 AccessibilityA measure of the relative ease of admission to the various areas of an item.3.8 Achieved ReliabilityThe reliability demonstrated at a given point in time under specified conditions of useand environment.3.9 Activation Ene
24、rgya. The energy level at which a specific microelectronic failure mechanism becomes active (in electron volts).b. The slope of the time temperature regression line in the Arrhenius equation (in electron volts).3.10 Active ElementA part that converts or controls energy, for example, transistor, diod
25、e, electron tube, relay.3.11 Active Element GroupAn active element and its associated supporting (passive) parts, for example, anamplifier circuit, a relay circuit, a pump and its plumbing and fittings.3.12 AgingThe effect whereby the probability density function of strength is changed (strength is
26、reduced) withtime.3.13 AllocationThe process of assigning reliability requirements to individual units to attain the desired systemreliability.3.14 Alpha Particle Induced Soft ErrorsIntegrated circuit memory transient errors due to emission of alphaparticles during radioactive decay of uranium or th
27、orium contamination in the IC packaging material.3.15 AmbientUsed to denote surrounding, encompassing, or local conditions. Usually applied to environments,for example, ambient temperature, ambient pressure.3.16 ApportionmentSynonym of Allocation.3.17 Arithmetic MeanThe arithmetic mean of n numbers
28、is the sum of the n numbers, divided n.3.18 Arrhenius ModelA mathematical representation of the dependence of failure rate on absolute temperatureand activation energy. The model assumes that degradation of a performance parameter is linear with time withthe failure rate a function of temperature st
29、ress. The temperature dependence is taken to be the exponentialfunction:COPYRIGHT Society of Automotive Engineers, Inc.Licensed by Information Handling ServicesSAE J1213/2 Issued OCT88-4-(Eq. 1)where:1 = mean time to failure at T12 = mean time to failure at T2T = junction temperature in KE = activat
30、ion energy in eVk = Boltzmans constant (8.617 105 eV/K)3.19 Arrhenius Acceleration FactorThe acceleration factor F is the factor by which the time to fail can bereduced by increased temperature.(Eq. 2)3.20 Assessmenta. A critical appraisal, including qualitative judgments about an item, such as impo
31、rtance of analysisresults, design criticality and failure effect.b. The use of test data and/or operational service data to form estimates of population parameters and toevaluate the precision of these estimates.3.21 AttributeA term used to designate a method of measurement whereby units are examine
32、d by noting thepresence (or absence) of some characteristic or attribute in each of the units in the group under considerationand by counting how many units do (or do not) possess it. Inspection by attributes can be of two kinds eitherthe unit of product is classified simply as defective or nondefec
33、tive, or the number of defects in the unit ofproduct is counted, with respect to a given requirement or set of requirements.3.22 Attribute TestingTesting to evaluate whether or not an item possesses a specified attribute.3.23 Automatic Test Equipment (ATE)Test equipment that contains provisions for
34、automatically performing aseries of pre programmed tests.3.24 Availability (Operational Readiness)The probability that at any point in time the system is either operatingsatisfactorily or ready to be placed in operation on demand when used under stated conditions.3.25 AverageA general term. It often
35、 means arithmetic mean, but can refer to s-expected value, median, mode,or some other measure of the general location of the data values.3.26 Average Outgoing Quality (AOQ)The average quality of outgoing product after 100% inspection of rejectedlots, with replacement by good units of all defective u
36、nits found in inspection.3.27 Average Outgoing Quality Limit (AOQL)The maximum average outgoing quality (AOQ) for a samplingplan.3.28 Bake-outTo subject an unsealed item to an elevated temperature to drive out moisture and unwanted gasesprior to other process or sealing.3.29 Bathtub CurveA plot of f
37、ailure rate of an item (whether repairable or not) vs. time. The failure rate initiallydecreases, then stays reasonably constant, then begins to rise rather rapidly. It has the shape of a bathtub.Not all items have this behavior.1 2 exp Ek()1 T2 1 T1()=F 1 2 Ek()1 T2 1 T2()exp=COPYRIGHT Society of A
38、utomotive Engineers, Inc.Licensed by Information Handling ServicesSAE J1213/2 Issued OCT88-5-3.30 Biasa. The difference between the s-expected value of an estimator and the value of the true parameter.b. Applied voltage.3.31 Binomial DistributionThe probability of r, or fewer successes in n independ
39、ent trials, given a probability ofsuccess p in a single trial, is given by the cumulative binomial distribution:(Eq. 3)3.32 Binomial FunctionThe probability of exactly x successes in n independent trials, given a probability ofsuccess p in a single trial, is given by the binomial probability functio
40、n:(Eq. 4)3.33 Bonda. An interconnection which performs a permanent electrical and/or mechanical function.b. To join with adhesives.3.34 Bond Lift OffThe failure mode whereby the bonded lead separates the surface to which it was attached.3.35 Bond StrengthIn wire bonding, the pull force at rupture of
41、 the bond interface.3.36 Breadboard ModelA preliminary assembly of parts to test the feasibility of an item or principle withoutregard to eventual design or form. Usually refers to a small collection of electronic parts.3.37 Burn-inThe initial operation of an item to stabilize its characteristics, a
42、nd to minimize infant mortality in thefield.3.38 Capabilitya. A measure of the ability of an item to achieve mission objectives given the conditions during themission.b. The spread of performance of a process in a state of statistical control; the amount of variation fromcommon causes identified aft
43、er all special causes of variation have been eliminated.3.39 C ChartControl chart for number of nonconformities observed in some specified inspection. The unitsshould be alike in size and in the apparent likelihood of the existence of the nonconformity, in order that thearea of opportunity for nonco
44、nformity be constant from unit to unit.3.40 Central LineThe line on a control chart that represents the average or median value of the items beingplotted. It is shown as a solid line.3.41 CheckoutTests or observations on an item to determine its condition or status.3.42 Coefficient Of VariationThe s
45、tandard deviation divided by the mean, multiplied by 100 and expressed as apercentage.3.43 Complexity LevelA measure of the number of active elements required to perform a specific systemfunction.Pr xr()F (r; p, n) nxpx 1p()nxx 0=r=xpn,;()nxpx 1p()nx x,= 0, 1, 2, n0 p 1=COPYRIGHT Society of Automoti
46、ve Engineers, Inc.Licensed by Information Handling ServicesSAE J1213/2 Issued OCT88-6-3.44 ComponentA self-contained combination of parts, subassemblies, or assemblies which perform a distinctivefunction in the overall operation of an equipment. Often used interchangeably with (electronic) part.3.45
47、 ConfidenceA specialized statistical term referring to the reliance to be placed in an assertion about thevalue of a parameter of a probability distribution.3.46 Confidence Coefficienta. A measure of assurance that a statement based upon statistical data is correct.b. The probability that an unknown
48、 parameter lies within a stated interval or is greater or less than somestated value.3.47 Confidence IntervalThe interval within which it is asserted that the parameter of a probability distributionlies.3.48 Confidence Level(Eq. 5)where:a = the risk (%)3.49 Confidence LimitA bound of a confidence in
49、terval.3.50 ConsistencyA statistical term relating to the behavior of an estimator as the sample size becomes verylarge. An estimator is consistent if it converges to the population value as the sample size becomes large.3.51 Constant Failure Ratea. A term characterizing the instantaneous failure rate in the middle, or “useful life“ period of the BathtubCurve model of item life.b. A term characterizing the hazard rate, h(t), of an item having an exponential reliability fu
