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5、ulated Microcircuits and Semiconductorsin Military, Aerospace and Other Rugged Applications NOTICEThis document has been taken directly from the original TechAmerica document and contains only minor editorial and format changes required to bring it into conformance with the publishing requirements o
6、f SAE Technical Standards. The release of this document is intended to replace the original with the SAE International document. Any numbers established by the original document remain unchanged.The original document was adopted as an SAE publication under the provisions of the SAE Technical Standar
7、ds Board (TSB) Rules and Regulations (TSB 001) pertaining to accelerated adoption of specifications and standards. TSB rules provide for (a) the publication of portions of unrevised specifications and standards without consensus voting at the SAE committee level, and (b) the use of the existing spec
8、ification or standard format.EIAENGINEERINGBULLETINGuidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged ApplicationsSSB-1-C(Revision of SSB-1-B) AUGUST 2000ELECTRONIC INDUSTRIES ALLIANCEGOVERNMENT ELECTRONICS ANDINFORMATION TECHNOLOGY ASS
9、OCIATION A SECTOR OF SSB-1-CNOTICEEIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchasers in selecting an
10、d obtaining with minimum delay the proper product for their particular needs. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of EIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existenc
11、e of such Standards and Publications preclude their voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by EIA in accordance with the American National Standards Institute (ANSI) patent polic
12、y. By such action, EIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication.Technical Publications are distinguished from EIA Standards or Interim Standards, in that they contain a compilation of engineering dat
13、a or information useful to the technical community and represent approaches to good engineering practices that are suggested by the formulating committee. This Bulletin is not intended to preclude or discourage other approaches that similarly represent good engineering practice, or that may be accep
14、table to, or have been accepted by, appropriate bodies. Parties who wish to bring other approaches to the attention of the formulating committee to be considered for inclusion in future revisions of this publication are encouraged to do so. It is the intention of the formulating committee to revise
15、and update this publication from time to time as may be occasioned by changes in technology, industry practice, or government regulations, or for other appropriate reasons.(From Project Number PN-4839, formulated under the cognizance of the GEIA G-12 Solid State Devices Committee) Published by ELECT
16、RONIC INDUSTRIES ALLIANCE 2000 Technology Strategy smaller package configurations allow higher circuit board packing density, therefore, reducing propagation delays x Unit price Unit prices are lower than ceramic parts because of high volume, high yield, and high quality automated manufacturing; cos
17、t benefits decrease with higher integration levels and pin counts due to the high price of die x Availability Devices are more readily available than hermetic devices due to market demand The uncontrolled use of plastic encapsulated microcircuits and semiconductors can introduce a number of technica
18、l risks in military and aerospace equipment applications that are not associated with hermetic packaged devices. These potential risks include: x Moisture ingress induced by humidity x Electrolytic / galvanic corrosion, delamination and crack propagation induced by combined effects of temperature cy
19、cling, humidity and bias conditions x Outgassing of volatile substances induced by vacuum x Device manufacturers characterize electrical performance over limited temperature ranges (e.g. Industrial Temperature Range: -40C to +85C) x “Popcorn” package cracks or in delamination induced by thermal effe
20、cts during soldering x Cumulative effects of mechanical and thermal stresses from assembly manufacturing, testing and service conditions on device long term reliability SSB-1iii To mitigate these risks, the military and aerospace electronics industries are adopting risk mitigation techniques impleme
21、nted by the Automotive and Commercial Air electronics industries. Traditional military part selection methods typically revolve around environmental standards for a general end-item equipment category. Military standard requirements for components were derived from these equipment level standards. M
22、any military and aerospace equipment applications do not require component performance at these traditional, military standard environmental conditions. The following table compares the military standard operating temperature range for microcircuits and semiconductors to other temperature ranges com
23、monly applied to device characterization. Standard Temperature Ranges Military: -55qC to +125qC Automotive: -40qC to +125qC Industrial: -40qC to +85qC Commercial: 0qC to +70qC A recent survey conducted by the Government Electronics and Information Technology Association1reveals that many military an
24、d aerospace applications could potentially use commercially available components designed and characterized to perform over commercial, industrial, or automotive temperature ranges. Fewer and fewer new products are introduced that are specified to perform to traditional military specification limits
25、 and assembled in hermetic packages. By selecting and evaluating components based on the specific application environment, original equipment manufacturers are not constrained by military standard requirements that may otherwise impede selecting the most suitable part for the application from both a
26、n equipment performance and economical perspective. 1Survey conducted in April 1999 by Task Group G99-03 of the G-12 Solid State Devices Committee SSB-1ivSSB-1v GUIDELINES FOR USING PLASTIC ENCAPSULATED MICROCIRCUITS AND SEMICONDUCTORS IN MILITARY, AEROSPACE AND OTHER RUGGED APPLICATIONSTABLE OF CON
27、TENTS ACKNOWLEDGMENT i INTRODUCTION ii 1 Scope . 1 2 Reference Documents . 1 3 Application 1 3.1 SSB-1.001: Qualification and Reliability Monitors 1 3.2 SSB-1.002: Environmental Tests and Associated Failure Mechanisms 2 3.3 SSB-1.003: Acceleration Factors 2 3.4 SSB-1.004: Failure Rate Estimating . 2
28、 3.5 SSB-1.00X: Untitled 2 4 Implementation Guidance 3 4.1 Quality Control System Evaluation . 3 4.1.1 Quality System Requirements . 3 4.1.2 Evaluation Process 3 4.2 Define Use Conditions 6 4.2.1 Service life . 9 4.2.2 Temperature (Operating and Storage) 9 4.2.3 Temperature Cycle 9 4.2.4 Relative Hu
29、midity. 9 4.2.5 Operating Duty Cycle. 9 4.3 Evaluation of Device Acceptability (failure rate estimating). . 11 4.3.1 Using the Arrhenius Model as an example. . 11 4.4 Evaluation 14 4.4.1 FIT does not meet expectations 14 4.4.2 Insufficient device hours 14 4.4.3 Failure rates not acceptable. . 14 4.4
30、.4 Example insufficient device hours. 14 4.4.5 Example FIT not acceptable. . 14 SSB-111 Scope This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the
31、 performance objective for potential use in many rugged, military, severe, or other environments. 2 Reference Documents The latest issue of the following documents form part of this document: SSB-1.001 Qualification and Reliability Monitors SSB-1.002 Environmental Tests and Associated Failure Mechan
32、isms SSB-1.003 Acceleration Factors SSB-1.004 Failure Rate Estimating SSB-1.XXX Annexes will be added as they are written and will be included in future updates of SSB-1 JESD47 Stress Test Driven Qualification of Integrated Circuits JESD69 Information Requirements for the Qualification of Silicon De
33、vices IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Solder Joints ANSI/EIA-599 National Electronic Process Certification Standard ISO 9000 Quality Management and Quality Assurance Standards AIAG QS9000 Quality System Requirements - Automotive Industry STACK 0001 General
34、Requirements for Integrated Circuits 3 Application This guideline provides guidance in selecting plastic encapsulated microcircuits and semiconductors based upon: 1. Understanding the potential failure mechanisms associated with end use application conditions 2. Understanding a specific device manuf
35、acturers methodology for improving device reliability by continually evaluating product against potential failure mechanisms 3. Evaluating device capability versus the specific application environment, circuit function and equipment level reliability requirements The user of this Bulletin and its an
36、nexes must determine the suitability of this guideline for a specific application. 3.1 SSB-1.001: Qualification and Reliability Monitors This annex recommends minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in
37、military and aerospace applications and should be used a guide in evaluating device manufacturer test flows. Device manufacturers may use this document as a guide to develop process flows to produce standard product for the above environments. “Best In Class“ suppliers can easily meet these criteria
38、 and can readily supply the necessary data to demonstrate compliance. SSB-12This annex does not include all of the tests typically included in device qualification and reliability monitoring, but focuses on those tests specifically designed to apply to (or have unique implications for) plastic encap
39、sulated microcircuits and semiconductors. The preferred approach is to select off-the-shelf product that, when evaluated to these guidelines, will meet the target application requirements without requiring supplementary qualification testing. In cases where design constraints preclude this preferred
40、 approach, this section should also be used to design supplemental device qualification test plans to establish the required confidence in expected device performance. 3.2 SSB-1.002: Environmental Tests and Associated Failure Mechanisms This annex provides more detailed information concerning the en
41、vironmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses. This information is intended to provide further insight needed to e
42、valuate a specific device manufacturers statistical reliability monitoring (SRM) approach. 3.3 SSB-1.003: Acceleration Factors This annex provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliab
43、ility monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications. This information is intended to provide the insig
44、ht needed to properly interpret a specific device manufacturers reliability data and, in turn, extrapolate performance under service life and storage conditions for the target application. 3.4 SSB-1.004: Failure Rate Estimating This annex provides reference information concerning methods commonly us
45、ed by the semiconductor industry to estimate failure rates from accelerated test results. These methods are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use appl
46、ications. 3.5 SSB-1.00X: Untitled Annexes will be added as they are written and will be included in future updates of SSB-1. For information on additional annexes consult the EIA Standards and Technology web site. SSB-134 Implementation Guidance This section will demonstrate a typical evaluation pro
47、cess using this document and the above annexes, showing how they are related to each other and how they work together. 4.1 Quality Control System Evaluation The supplier shall have an acceptable documented quality management system in order to be considered for the evaluation process of this guideli
48、ne. ISO 9000 and EIA 599 are among the most recognized quality management systems in the industry. The quality system used shall meet the minimum requirements of section 4.1.1, herein. See Figure 1. 4.1.1 Quality System Requirements As a minimum, suppliers quality system shall include the following
49、elements: 1. Failure Mode Effects Analysis (FMEA) 2. Process Control Outlines (PCO) 3. Statistical Reliability Monitoring, as identified in SSB-1.001 The Automotive Industry Action Group (AIAG) QS9000 and the STACK International Specification 0001 are good examples of satisfying these minimum requirements. ISO-9000 or EIA 599 have the key elements, but the minimum conditions must be verified as implemented on the device u
