1、 Collection of SANS standards in electronic format (PDF) 1. Copyright This standard is available to staff members of companies that have subscribed to the complete collection of SANS standards in accordance with a formal copyright agreement. This document may reside on a CENTRAL FILE SERVER or INTRA
2、NET SYSTEM only. Unless specific permission has been granted, this document MAY NOT be sent or given to staff members from other companies or organizations. Doing so would constitute a VIOLATION of SABS copyright rules. 2. Indemnity The South African Bureau of Standards accepts no liability for any
3、damage whatsoever than may result from the use of this material or the information contain therein, irrespective of the cause and quantum thereof. ISBN 978-0-626-22859-0 SANS 9455-17:2009Edition 1 ISO 9455-17:2002Edition 1SOUTH AFRICAN NATIONAL STANDARD Soft soldering fluxes Test methods Part 17: Su
4、rface insulation resistance comb test and electrochemical migration test of flux residues This national standard is the identical implementation of ISO 9455-17:2002 and is adopted with the permission of the International Organization for Standardization. Published by SABS Standards Division 1 Dr Lat
5、egan Road Groenkloof Private Bag X191 Pretoria 0001Fel: +27 12 428 7911 Fax: +27 12 344 1568 www.sabs.co.za SABS SANS 9455-17:2009 Edition 1 ISO 9455-17:2002 Edition 1 Table of changes Change No. Date Scope National foreword This South African standard was approved by National Committee SABS TC 1078
6、, Engineering materials Non-ferrous metals, in accordance with procedures of the SABS Standards Division, in compliance with annex 3 of the WTO/TBT agreement. This SANS document was published in September 2009. Reference numberISO 9455-17:2002(E)ISO 2002INTERNATIONAL STANDARD ISO9455-17First edition
7、2002-12-15Soft soldering fluxes Test methods Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues Flux de brasage tendre Mthodes dessai Partie 17: Essai au peigne et essai de migration lectrochimique de rsistance disolement de surface des rsidus de flu
8、x SANS 9455-17:2009This s tandard may only be used and printed by approved subscription and freemailing clients of the SABS .ISO 9455-17:2002(E) PDF disclaimer This PDF file may contain embedded typefaces. In accordance with Adobes licensing policy, this file may be printed or viewed but shall not b
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13、iso.org Published in Switzerland ii ISO 2002 All rights reservedSANS 9455-17:2009This s tandard may only be used and printed by approved subscription and freemailing clients of the SABS .ISO 9455-17:2002(E) ISO 2002 All rights reserved iiiContents Page Foreword iv 1 Scope 1 2 Normative references .
14、1 3 Principle . 1 4 Reagents 2 5 Apparatus. 2 6 Inspection of test coupons 6 7 Sample preparation. 7 8 Procedure. 9 9 Assessment . 13 10 Precision 14 11 Test report 14 Annex A (informative) SIR testing guidance 16 Annex B (informative) Surface insulation resistance comb test and electrochemical migr
15、ation test of flux residues Qualification test report . 18 Bibliography . 21 SANS 9455-17:2009This s tandard may only be used and printed by approved subscription and freemailing clients of the SABS .ISO 9455-17:2002(E) iv ISO 2002 All rights reservedForeword ISO (the International Organization for
16、Standardization) is a worldwide federation of national standards bodies (ISO member bodies). The work of preparing International Standards is normally carried out through ISO technical committees. Each member body interested in a subject for which a technical committee has been established has the r
17、ight to be represented on that committee. International organizations, governmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization. Internation
18、al Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2. The main task of technical committees is to prepare International Standards. Draft International Standards adopted by the technical committees are circulated to the member bodies for voting. Publication as
19、 an International Standard requires approval by at least 75 % of the member bodies casting a vote. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. ISO shall not be held responsible for identifying any or all such patent rights. IS
20、O 9455-17 was prepared by Technical Committee ISO/TC 44, Welding and allied processes, Subcommittee SC 12, Soldering and brazing materials. ISO 9455 consists of the following parts, under the general title Soft soldering fluxes Test methods: Part 1: Determination of non-volatile matter, gravimetric
21、method Part 2: Determination of non-volatile matter, ebulliometric method Part 3: Determination of acid value, potentiometric and visual titration methods Part 5: Copper mirror test Part 6: Determination and detection of halide (excluding fluoride) content Part 8: Determination of zinc content Part
22、9: Determination of ammonia content Part 10: Flux efficacy tests, solder spread method Part 11: Solubility of flux residues Part 12: Steel tube corrosion test Part 13: Determination of flux spattering Part 14: Assessment of tackiness of flux residues Part 15: Copper corrosion test Part 16: Flux effi
23、cacy tests, wetting balance method Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues SANS 9455-17:2009This s tandard may only be used and printed by approved subscription and freemailing clients of the SABS .INTERNATIONAL STANDARD ISO 9455-17:2002(E
24、) ISO 2002 All rights reserved 1Soft soldering fluxes Test methods Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues 1 Scope This part of ISO 9455 specifies a method of testing for deleterious effects that may arise from flux residues after solderin
25、g or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders (ISO 9453:1990, Class E).
26、NOTE This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer. 2 Normative references The following referenced documents are indispensable for the application of this document. For dat
27、ed references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. ISO 5725-2, Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and re
28、producibility of a standard measurement method ISO 9453:1990, Soft solder alloys Chemical compositions and forms ISO 12224-1:1997, Solder wire, solid and flux cored Specification and test methods Part 1: Classification and performance requirements IEC 61249-2-7:2002, Materials for printed boards and
29、 other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 60068-2-20, Environmental testing Part 2: Tests Test T: Soldering IPC-TM-6501), Test Methods Manual (TM 2.6.3.3
30、 Surface Insulation Resistance, Fluxes) (Test pattern IPC-B-24) 3 Principle The objective of this test method is to characterize fluxes by determining the degradation of electrical resistance and the electrochemical migration of rigid printed wiring coupon specimens after exposure to the specified f
31、lux. This test is carried out at high humidity and heat conditions under bias voltage. For fluxes which may leave undesirable residues and hence require cleaning, the results obtained from the test will depend on the characteristics of the flux residue, substrate, metallization, and also on the effe
32、ctiveness of the cleaning operation. 1) Obtainable from: IPC, 2215 Sanders Road, Northbrook, IL, 60062-6135. SANS 9455-17:2009This s tandard may only be used and printed by approved subscription and freemailing clients of the SABS .ISO 9455-17:2002(E) 2 ISO 2002 All rights reservedThe measurement of
33、 surface insulation resistance (SIR) makes use of a printed wiring coupon substrate having one or more conductive interleaved test patterns. Prior to being subjected to conditioning, the interleaved test patterns are fluxed, soldered or tinned, and cleaned (when required). The patterns are then expo
34、sed to a controlled environment for a specified time, with an applied voltage. The surface insulation resistance is measured using insulation test apparatus, at a suitable test voltage while the test coupons are in the controlled environment. 4 Reagents In the test use only reagents of recognized an
35、alytical grade or higher and only distilled, or deionized water, with a conductivity of less than 0,5 S/cm (resistivity W 2 MA.cm). 4.1 Propan-2-ol, (CH3)2CHOH or other suitable solvent. 4.2 Cleaning solvent (where required), recommended by the flux manufacturer as suitable for the removal of post s
36、oldering flux residues, or propan-2-ol. 5 Apparatus Equipment shall be capable of demonstrating repeatability in accordance with the gauge r and R methodology specified in ISO 5725-2. 5.1 Low profile container, e.g. a Petri dish or a watch glass. 5.2 Drying oven, suitable for use at up to 120 C 3 C.
37、 5.3 Insulated wire or cable, tin coated single copper conductor, 1 000 V general purpose wire, temperature rated to 150 C; primary insulation of radiation-crosslinked, extruded polyalkene; primary jacket of radiation-crosslinked, extruded polyvinylidene fluoride; configuration suitable for equipmen
38、t in use. 5.4 Connector, 64-position, glass filled polyester body with the following properties: 1,27 mm 10,67 mm (0,05 in 0,42 in) on 2,54 mm (0,10 in) centres; 32 tabs, gold plated over nickel plate over copper; 0,762 m (0,000 03 in) gold plated post/pin mating end; bifurcated beam contacts; for c
39、oupon thickness of 1,40 mm to 1,78 mm (0,055 in to 0,070 in); capable of withstanding temperatures up to 105 C. 5.5 Test coupon, conforming to IPC B-24, specified in IPC-TM-650 (see Figure 1). It shall be single sided copper clad epoxide woven glass fabric laminate conforming to IEC 61249-2-7 with n
40、ominal thickness of 1,5 mm, clad copper foil with a nominal thickness of 18 m. The final finish of the circuit conductors shall be bare copper (without preservative). This test substrate is referred to as the “test coupon” comprising four (4) “test patterns”. The dimensions of the test coupon shall
41、be 101,6 mm 114,4 mm (4,0 in 4,5 in). The connections of the test coupon (connectors with gold-to-gold mechanical contacts) shall be: 32 tabs, gold plated over nickel plate over copper; 1,27 mm 10,67 mm (0,05 in 0,42 in) on 2,54 mm (0,10 in) centres SANS 9455-17:2009This s tandard may only be used a
42、nd printed by approved subscription and freemailing clients of the SABS .ISO 9455-17:2002(E) ISO 2002 All rights reserved 3The test pattern shall be: 0,4 mm (0,016 in) width 0,5 mm (0,020 in) spacing 15,25 mm (0,6 in) overlap 34 overlapping spaces 1 040 squares (nominal) NOTE Spaces are determined b
43、y counting the number of overlapping areas per pattern. Squares are determined by the following formula: length of overlap number of spaces1040 squaresspacing width Figure 1 Resistor verification coupon (Reproduced with permission) 5.6 Soldering equipment. 5.6.1 Flux-cored solder wire, conforming to
44、 S-Sn60Pb40E/1.1.1 or S-Sn63Pb37E/1.1.1 of ISO 12224-1:1997. NOTE This wire consists of 60/40 or 63/37 tin/lead solder wire with a core of non-activated rosin (colophony) flux (classification 1.1.1, non-activated of ISO 9454-1:1990). SANS 9455-17:2009This s tandard may only be used and printed by ap
45、proved subscription and freemailing clients of the SABS .ISO 9455-17:2002(E) 4 ISO 2002 All rights reserved5.6.2 Wave solder system, comprising a wave soldering machine where the solder in the bath shall conform to grade S-Sn63Pb37E of ISO 9453:1990. The set point temperature shall be maintained to
46、5 C. 5.6.3 Static bath, containing solder to a depth of not less than 40 mm, conforming to grade S-Sn63Pb37E of ISO 9453:1990. The set point temperature shall be maintained to 5 C. 5.6.4 Reflow oven, with controllable temperature profiling. 5.6.5 Soldering iron. 5.7 Humidity chamber, capable of main
47、taining environments up to 90 C with temperature control of 2 C and relative humidity (RH) up to 95 % with control of 3 % at a specific RH set point when loaded with test coupons. The chamber shall be constructed with stainless steel inner surfaces and be well insulated. Some solid state sensors can
48、not tolerate high temperature and humidity. The temperature and humidity levels of the test chamber shall be recorded throughout the test, preferably with independent control sensors. NOTE If used, independent temperature and humidity sensors should be located in close proximity to the test coupons.
49、 Conformance with these conditions will ensure that uniform test conditions can be maintained while the chamber is under test load. 5.8 High resistance measurement system, capable of measuring surface insulation resistance (SIR) in the range of at least 106 to 1012 and with a test and bias voltage supply capable of providing a variable voltage from 10 V to 100 V dc ( 2 %) with a 1 M load. The sample selection system s
