SS 115-1995 Specification for cordials《兴奋性饮料的规范》.pdf

上传人:cleanass300 文档编号:1053850 上传时间:2019-03-29 格式:PDF 页数:22 大小:605.27KB
下载 相关 举报
SS 115-1995 Specification for cordials《兴奋性饮料的规范》.pdf_第1页
第1页 / 共22页
SS 115-1995 Specification for cordials《兴奋性饮料的规范》.pdf_第2页
第2页 / 共22页
SS 115-1995 Specification for cordials《兴奋性饮料的规范》.pdf_第3页
第3页 / 共22页
SS 115-1995 Specification for cordials《兴奋性饮料的规范》.pdf_第4页
第4页 / 共22页
SS 115-1995 Specification for cordials《兴奋性饮料的规范》.pdf_第5页
第5页 / 共22页
点击查看更多>>
资源描述

展开阅读全文
相关资源
猜你喜欢
  • BS EN 60172-2015 Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires《测定漆包和带包绕组线的温度指数的试验程序》.pdf BS EN 60172-2015 Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires《测定漆包和带包绕组线的温度指数的试验程序》.pdf
  • BS EN 60182-2-1991 Basic dimensions of winding wires - Specification for maximum overall diameters of enamelled round winding wires《线圈绕线基本尺寸 第2部分 漆包圆形线圈绕线最大直径规范》.pdf BS EN 60182-2-1991 Basic dimensions of winding wires - Specification for maximum overall diameters of enamelled round winding wires《线圈绕线基本尺寸 第2部分 漆包圆形线圈绕线最大直径规范》.pdf
  • BS EN 60188-2001 High-pressure mercury vapour lamps - Performance specifications《高压汞蒸气灯 性能规范》.pdf BS EN 60188-2001 High-pressure mercury vapour lamps - Performance specifications《高压汞蒸气灯 性能规范》.pdf
  • BS EN 60191-3-2000 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of integrated circuits《半导体装置的机械标准化 集成电路略图绘制的一般规则》.pdf BS EN 60191-3-2000 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of integrated circuits《半导体装置的机械标准化 集成电路略图绘制的一般规则》.pdf
  • BS EN 60191-4-2014 Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages《半导体器件的机械标准化.pdf BS EN 60191-4-2014 Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages《半导体器件的机械标准化.pdf
  • BS EN 60191-6-1-2002 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - .pdf BS EN 60191-6-1-2002 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - .pdf
  • BS EN 60191-6-10-2003 Mechanical standardization of semiconductor devices - Part 6-10 General rules for the preparation of outline drawings of surface mounted semiconductor device .pdf BS EN 60191-6-10-2003 Mechanical standardization of semiconductor devices - Part 6-10 General rules for the preparation of outline drawings of surface mounted semiconductor device .pdf
  • BS EN 60191-6-12-2011 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages DesL.pdf BS EN 60191-6-12-2011 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages DesL.pdf
  • BS EN 60191-6-13-2016 Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid A.pdf BS EN 60191-6-13-2016 Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid A.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1