TIA-455-56-C-2009 Test Method For Evaluating Fungus Resistance of Optical Fiber and Cable《光纤光缆防霉性评估试验方法》.pdf

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1、 TIA-455-56-C July 2009 Test Method For Evaluating Fungus Resistance of Optical Fiber and Cable ANSI/TIA-455-56-C-2009 APPROVED: JULY 14, 2009 NOTICE TIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and p

2、urchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for their particular need. The existence of such Standards and Publications shall not in any respect preclude any member or non-member

3、of TIA from manufacturing or selling products not conforming to such Standards and Publications. Neither shall the existence of such Standards and Publications preclude their voluntary use by Non-TIA members, either domestically or internationally. Standards and Publications are adopted by TIA in ac

4、cordance with the American National Standards Institute (ANSI) patent policy. By such action, TIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This Standard does not purport to address all safety proble

5、ms associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 3-3272-RV3, formu

6、lated under the cognizance of the TIA TR-42 Telecommunications Cabling Systems, TR-42.12 Subcommittee on Optical Fiber and Cables.) Published by TELECOMMUNICATIONS INDUSTRY ASSOCIATION Standards and Technology Department 2500 Wilson Boulevard Arlington, VA 22201 U.S.A. PRICE: Please refer to current

7、 Catalog of TIA TELECOMMUNICATIONS INDUSTRY ASSOCIATION STANDARDS AND ENGINEERING PUBLICATIONS or call IHS, USA and Canada (1-877-413-5187) International (303-397-2896) or search online at http:/www.tiaonline.org/standards/catalog/ All rights reserved Printed in U.S.A. NOTICE OF COPYRIGHT This docum

8、ent is copyrighted by the TIA. Reproduction of these documents either in hard copy or soft copy (including posting on the web) is prohibited without copyright permission. For copyright permission to reproduce portions of this document, please contact TIA Standards Department or go to the TIA website

9、 (www.tiaonline.org) for details on how to request permission. Details are located at: http:/www.tiaonline.org/standards/catalog/info.cfm#copyright OR Telecommunications Industry Association Standards (b) there is no assurance that the Document will be approved by any Committee of TIA or any other b

10、ody in its present or any other form; (c) the Document may be amended, modified or changed in the standards development or any editing process. The use or practice of contents of this Document may involve the use of intellectual property rights (“IPR”), including pending or issued patents, or copyri

11、ghts, owned by one or more parties. TIA makes no search or investigation for IPR. When IPR consisting of patents and published pending patent applications are claimed and called to TIAs attention, a statement from the holder thereof is requested, all in accordance with the Manual. TIA takes no posit

12、ion with reference to, and disclaims any obligation to investigate or inquire into, the scope or validity of any claims of IPR. TIA will neither be a party to discussions of any licensing terms or conditions, which are instead left to the parties involved, nor will TIA opine or judge whether propose

13、d licensing terms or conditions are reasonable or non-discriminatory. TIA does not warrant or represent that procedures or practices suggested or provided in the Manual have been complied with as respects the Document or its contents. If the Document contains one or more Normative References to a do

14、cument published by another organization (“other SSO”) engaged in the formulation, development or publication of standards (whether designated as a standard, specification, recommendation or otherwise), whether such reference consists of mandatory, alternate or optional elements (as defined in the T

15、IA Engineering Manual, 4thedition) then (i) TIA disclaims any duty or obligation to search or investigate the records of any other SSO for IPR or letters of assurance relating to any such Normative Reference; (ii) TIAs policy of encouragement of voluntary disclosure (see Engineering Manual Section 6

16、.5.1) of Essential Patent(s) and published pending patent applications shall apply; and (iii) Information as to claims of IPR in the records or publications of the other SSO shall not constitute identification to TIA of a claim of Essential Patent(s) or published pending patent applications. TIA doe

17、s not enforce or monitor compliance with the contents of the Document. TIA does not certify, inspect, test or otherwise investigate products, designs or services or any claims of compliance with the contents of the Document. ALL WARRANTIES, EXPRESS OR IMPLIED, ARE DISCLAIMED, INCLUDING WITHOUT LIMIT

18、ATION, ANY AND ALL WARRANTIES CONCERNING THE ACCURACY OF THE CONTENTS, ITS FITNESS OR APPROPRIATENESS FOR A PARTICULAR PURPOSE OR USE, ITS MERCHANTABILITY AND ITS NONINFRINGEMENT OF ANY THIRD PARTYS INTELLECTUAL PROPERTY RIGHTS. TIA EXPRESSLY DISCLAIMS ANY AND ALL RESPONSIBILITIES FOR THE ACCURACY O

19、F THE CONTENTS AND MAKES NO REPRESENTATIONS OR WARRANTIES REGARDING THE CONTENTS COMPLIANCE WITH ANY APPLICABLE STATUTE, RULE OR REGULATION, OR THE SAFETY OR HEALTH EFFECTS OF THE CONTENTS OR ANY PRODUCT OR SERVICE REFERRED TO IN THE DOCUMENT OR PRODUCED OR RENDERED TO COMPLY WITH THE CONTENTS. TIA

20、SHALL NOT BE LIABLE FOR ANY AND ALL DAMAGES, DIRECT OR INDIRECT, ARISING FROM OR RELATING TO ANY USE OF THE CONTENTS CONTAINED HEREIN, INCLUDING WITHOUT LIMITATION ANY AND ALL INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF BUSINESS, LOSS OF PROFITS, LITIGATION,

21、 OR THE LIKE), WHETHER BASED UPON BREACH OF CONTRACT, BREACH OF WARRANTY, TORT (INCLUDING NEGLIGENCE), PRODUCT LIABILITY OR OTHERWISE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. THE FOREGOING NEGATION OF DAMAGES IS A FUNDAMENTAL ELEMENT OF THE USE OF THE CONTENTS HEREOF, AND THESE CONTENTS

22、WOULD NOT BE PUBLISHED BY TIA WITHOUT SUCH LIMITATIONS. TIA-455-56-C iFOTP-56 Test method for evaluating fungus resistance of optical fiber and cable Contents Foreword 1 Introduction iii 1.1 Intent 1 1.2 General effects 1 1.3 Hazards 1 2 Applicable documents 1 3 Apparatus 2 3.1 Chamber 2 3.2 Specime

23、n container 2 4 Sampling and specimens 2 4.1 General requirements 2 4.2 Fiber samples 3 4.3 Cable samples 3 5 Procedure 3 5.1 General procedure 3 5.2 Test fungi 4 5.3 Inspection 4 6 Calculations or interpretation of results 5 7 Documentation 5 8 Specification information 5 Annex A (informative) 6 A-

24、1 Introduction 6 A-2 Documents in print 6 A-3 Documents in progress 6 A-4 Comparisons 6 TIA-455-56-C iiThis page left blankTIA-455-56-C iiiFOTP-56 Test method for evaluating fungus resistance of optical fiber and cable Forward (This Foreword is informative and not part of the Standard.) This Standar

25、d is from Standards Proposal No. SP-3-3272-RV3, formulated under the cognizance of the TIA FO-4.2 Subcommittee on Optical Fibers and Cables. This FOTP is part of the series of test procedures included within Recommended Standard TIA/EIA-455. Revision C of this document adds method 508 of MIL-STD-810

26、 within this test method as a preferred procedure for U.S. military applications when specified. A general comparison of ASTM G21 and method 508 of MIL-STD-810 shows that the ASTM G21 procedure places test specimens in a dish or pan during the fungi spore incubation period while method 508 of MIL-ST

27、D-810 suspends test specimens during the incubation period. The preferred U.S military method utilizes microscopic inspection of the specimens to determine amount of microbial growth, whereas ASTM G21 uses a general visual inspection. There is one informative Annex. Key words: spore, culture, fungi,

28、 incubation, growth. TIA-455-56-C ivThis page left blank TIA-455-56-C 11 Introduction 1.1 Intent This method is intended to evaluate the adequacy of optical fibers and cables to retain their structural integrity and performance level under environmental conditions favorable for the development of fu

29、ngal growth. These conditions are: high humidity, a warm atmosphere, and the presence of inorganic salts. 1.2 General effects 1.2.1 Organic materials commonly form an integral part of optical fiber: for plastic cladding, for protecting the surface of a glass fiber, and for buffering. Some fibers are

30、 fabricated entirely from various plastic materials. Organic materials are also commonly used in fabricating optical cable: bufferings, filling materials, strength members, and jacketing. 1.2.2 Micro-organisms digest certain organic materials as a normal metabolic process, thus degrading them and ca

31、using porosity and loss of structural integrity, even to the point of catastrophic failure. Basic resins do not usually serve as carbon sources for growth of fungi. Rather it is generally other components such as plasticizers, stabilizers, colorants, lubricants, and cellulosics that are responsible

32、for the actual fungus attack. 1.2.3 Enzymes and organic acids produced during metabolism diffuse out of their cells and on to the plastic to cause such possible phenomena as cracking; corrosion; glass etching; hardening of cable filling compounds; increased modulus; weight changes; dimensional chang

33、es; and microbending of the fiber, with a resultant increase in attenuation. 1.3 Hazards 1.3.1 Because of safety and toxicity considerations detailed in 1.3.3, conduct testing at a site specifically equipped for the purpose. This generally means a separate, isolated facility with the ability to keep

34、 the test specimens within a confined area during the entire testing and incubation period. 1.3.2 Similarly, all testing shall be performed by personnel trained in microbiological laboratory techniques, sterile routines, and proper disposal of all waste solutions at the close of testing. 1.3.3 The r

35、eason for specifying the testing site and personnel qualifications is the potentially toxic nature of fungal spores. They have been implicated in pneumonia-like respiratory infections, ulcers of the skin, and digestive problems. 2 Applicable documents ANSI/ASTM G 21-90, Standard Practice for Determi

36、ning Resistance of Synthetic Polymeric Materials to Fungi (1990) TIA-455-56-C 2EIA/TIA-455-A, Standard Test Procedures for Fiber Optic Fibers, Cables, Transducers, Sensors, Connecting and Terminating Devices, and Other Fiber Optic Components (1991) MIL-STD-810, Environmental Engineering Consideratio

37、ns and Laboratory Tests 3 Apparatus 3.1 Chamber A chamber or cabinet is required, with the instrumentation necessary to maintain the specified conditions of temperature and humidity: up to 30C and a minimum of 85% relative humidity. Provide apparatus capable of recording temperature and humidity. 3.

38、1.1 Make provision to prevent condensation from dripping directly on any of the specimens in their containers. 3.1.2 There shall be free circulation of air around each container for the test specimens. When forced air is used, the flow rate shall not exceed 1 m/s (3.3 ft/s) over the surface of the c

39、ontainers. 3.1.3 Make provision so that any heating elements inside the chamber do not directly contact the test containers. 3.2 Specimen container Provide a glass dish or pan, capable of being sterilized, for each test specimen. The container shall be large enough so that the entire specimen shall

40、be able to lie flat inside it. Provide each container with a glass cover (flat window glass makes a convenient, inexpensive one). For military applications, the test specimens may be suspended in the chamber in lieu of being placed in a dish or pan. 4 Sampling and specimens 4.1 General requirements

41、Generally, only a visual inspection is required for test specimens after they have been exposed to fungi. In this case, 3 test specimens are required for each polymeric component or part. For tests conducted with glass dishes or pans, if the 2 sides of a specimen are different, 3 specimens are requi

42、red for each side (i. e., 3 for face up and 3 for face down). If further tests beyond visual inspection are specified, the number of additional specimens shall also be specified, along with the test(s) to be run. TIA-455-56-C 3For military applications, microscopic inspection, in addition to visual

43、inspection, shall be used to verify if change observed is fungus growth (1) when material may change under test conditions (such as gelling of water blocking materials under humid conditions), (2) when uncertainly is due to scarcity of growth or unusual characteristics (such as texture, color or pat

44、tern). List magnification used for microscopic inspections. 4.2 Fiber samples 4.2.1 All test specimens shall each be at least 5 m (16 ft) long and sampled from regular production runs of optical fiber. 4.2.2 Form the specimens into loose coils with a minimum inside diameter of 200 mm (8 inches). 4.2

45、.3 Test specimens shall have no surface treatment other than that ordinarily applied during production of the fiber. 4.3 Cable samples Test specimens for cable testing shall be specified in the Detail Specification and may be in any or all of the following forms: 4.3.1 The simplest forms may be flat

46、 squares 50 mm (2 inch) on a side; flat circles 50 mm (2 inch) in diameter; or rods or tubing a minimum of 76 mm (3 inch) long cut from the material to be tested. 4.3.2 Test specimens may be from completely fabricated parts, or sections or subassemblies cut from completely fabricated parts. 4.3.3 Sa

47、mples of film-forming materials such as coatings may be in the form of films a minimum of 50 mm (2 inch) square. These films may be prepared by casting on glass, then stripping after cure; or by impregnating filter paper or ignited glass fabric. 4.3.4 For military applications, a 12 inch length of c

48、able shall be tested, stripped back 8 inches from the end to expose all cable components. Be advised that it may not be able to determine if there is fungus growth on water blocking material. 5 Procedure 5.1 General procedure 5.1.1 For nonmilitary applications, the procedure indicated in ANSI/ASTM G

49、 21-90, clauses 6 (Reagents and materials, paying careful attention to subclause 6.4, Mixed fungus spore suspension) and 7 (Viability control), as well as subclauses 9.1-9.3 (in procedure), shall be followed. TIA-455-56-C 45.1.2 For military applications, the procedure indicated in MIL-STD-810 shall be followed. Careful attention shall be paid to decontamination (test specimen, test apparatus, solutions preparation apparatus, etc. both before and after test), materials (culture stock, chemicals and water), spore suspension preparation (spore suspension concentration), positive con

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