1、 IEC 60068-3-13 Edition 1.0 2016-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 3-13: Supporting documentation and guidance on Test T Soldering Essais denvironnement Partie 3-13: Documentation daccompagnement et guide sur les essais T Brasage IEC 60068-3-13:2016-05(en-fr)
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19、taires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60068-3-13 Edition 1.0 2016-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 3-13: Supporting documentation and guidance on Test T Soldering Essais denvironnement Partie 3-13: Documenta
20、tion daccompagnement et guide sur les essais T Brasage INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 19.040 ISBN 978-2-8322-3359-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internati
21、onale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 60068-3-13:2016 IEC 2016 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references. 6 3 Terms, definitions a
22、nd abbreviations 6 3.1 Terms and definitions 6 3.2 Abbreviations 7 4 Overview . 7 4.1 Factors influencing the formation and reliability of solder joints (ability to be soldered) 7 4.2 Physics of surface wetting . 8 4.3 Quality and reliability of solder joints . 10 5 Component soldering Processes . 1
23、0 5.1 General considerations 10 5.1.1 Components ability to be soldered . 10 5.1.2 Soldering processes . 12 5.1.3 Soldering defects . 12 5.1.4 Geometrical factors which may influence the soldering result 12 5.1.5 Process factors 12 5.1.6 Material factors 12 5.2 Solder . 13 5.3 Grouping of soldering
24、conditions . 13 5.4 Ability to be soldered . 13 5.5 Moisture sensitivity of components 13 5.6 Relation between storage time/storage conditions and solderability 14 5.6.1 Natural and accelerated ageing 14 5.6.2 Oxidation . 14 5.6.3 Growth of intermetallic layers . 14 5.6.4 Effect of ageing to wetting
25、 characteristics . 14 5.6.5 Test conditions for accelerated ageing 15 5.7 Place of soldering tests in testing 16 6 Soldering tests 17 6.1 General . 17 6.2 Solder . 18 6.3 Fluxes . 18 6.4 Test equipment . 18 6.5 Evaluation methods . 18 6.5.1 Criteria for visual inspection . 18 6.5.2 Criteria for quan
26、titative evaluation of the wetting characteristic . 19 6.5.3 Special cases 19 6.6 Acceptance criteria . 19 7 Soldering tests Methods 19 7.1 General principles . 19 7.2 Survey of test methods 19 7.3 Bath test . 22 7.4 Reflow test 23 7.4.1 With/without solder land . 23 IEC 60068-3-13:2016 IEC 2016 3 7
27、.4.2 Selection of solder paste (flux system and activity grade) 23 7.5 Soldering iron test . 23 7.6 Resistance to dissolution of metallization and soldering heat 23 7.6.1 General . 23 7.6.2 Limitations . 23 7.6.3 Choice of severity 24 7.7 Wetting balance test 24 7.7.1 General . 24 7.7.2 Test methods
28、 available 25 7.7.3 Limitations . 25 8 Requirements and statistical character of results 25 Bibliography . 27 Figure 1 Sessile drop of solder on oxidised copper . 8 Figure 2 Sessile drop of solder plus flux on clean copper 9 Figure 3 Sessile drop equilibrium forces . 9 Figure 4 Typical soldering pro
29、cesses 12 Figure 5 Soldering tests for devices with leads . 21 Figure 6 Soldering tests for SMDs 22 Table 1 Solder process groups . 13 4 IEC 60068-3-13:2016 IEC 2016 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ENVIRONMENTAL TESTING Part 3-13: Supporting documentation and guidance on Test T Soldering
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39、ication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possib
40、ility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60068-3-13 has been prepared by IEC technical committee 91: Electronics assembly technology. This f
41、irst edition cancels and replaces IEC 60068-2-44:1995 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: information for lead-free solders are added; technical update and restructuring. IEC 60068-3-13:2016 IEC
42、 2016 5 The text of this standard is based on the following documents: FDIS Report on voting 91/1345/FDIS 91/1356/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance wi
43、th the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60068 series, published under the general title Environmental testing, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IE
44、C web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 IEC 60068-3-13:2016 IEC 2016 ENVIRONMENTAL TESTING Part 3-13: Supporting documentation and guidance on
45、Test T Soldering 1 Scope This part of IEC 60068 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-1,
46、 which defines requirements to the specification of surface mounting components. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undat
47、ed references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-20:2008, Environmental testing Part 2: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads IEC 60068-2-58, Environmental testing Part 2-58: Tes
48、ts Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-69, Environmental testing Part 2-69: Tests Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wett
49、ing balance method 1IEC 60068-2-83, Environmental testing Part 2-83: Tests Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) IEC 62137-3, Electronics assembly technology Part
