1、 IEC 60191-6-12 Edition 2.0 2011-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guidelines for fine-pitch land grid array (FLGA
2、) Normalisation mcanique des dispositifs semiconducteurs Partie 6-12: Rgles gnrales pour la prparation des dessins dencombrement des botiers des dispositifs semiconducteurs montage en surface Lignes directrices de conception pour les botiers matriciels plots et pas fins (FLGA) IEC 60191-6-12:2011 co
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17、Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60191-6-12 Edition 2.0 2011-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surfa
18、ce mounted semiconductor device packages Design guidelines for fine-pitch land grid array (FLGA) Normalisation mcanique des dispositifs semiconducteurs Partie 6-12: Rgles gnrales pour la prparation des dessins dencombrement des botiers des dispositifs semiconducteurs montage en surface Lignes direct
19、rices de conception pour les botiers matriciels plots et pas fins (FLGA) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE R ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-88912-527-2 Registered trademark of the International Electrotechnical Commission Marque dpose
20、 de la Commission Electrotechnique Internationale colour inside 2 60191-6-12 IEC:2011 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 Terminal position numbering . 6 5 Nominal package dimension . 6 6 Outline drawings and principle dimensions . 7 7 Dimension
21、s 10 Figure 1 Flange-type FLGA 6 Figure 2 Rectangle-type FLGA . 6 Figure 3 Flange-type FLGA 7 Figure 4 Rectangle-type FLGA . 8 Figure 5 Mechanical gauge drawing e . 9 Figure 6 Pattern of terminal position area f. 9 Table 1 Group 1: Dimensions appropriate to mounting and interchangeability 10 Table 2
22、 Group 2: Dimensions and tolerances . 14 Table 3 Combination list of D, E, M D , and M E e = 0,80mm pitch . 15 Table 4 Combination list of D, E, M D , and M E e = 0,65 mm pitch . 16 Table 5 Combination list of D, E, M D , and M E e = 0,50 mm pitch . 17 Table 6 Combination list of D, E, M D , and M E
23、 e = 0,40 mm pitch . 18 Table 7 Combination list of D, E, M D , and M E e = 0,30 mm pitch . 19 60191-6-12 IEC:2011 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-12: General rules for the preparation of outline drawings of surface mounted sem
24、iconductor device packages Design guidelines for fine-pitch land grid array (FLGA) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to pr
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34、r the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-12 has be
35、en prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. This second edition of IEC 60191-6-12 cancels and replaces the first edition, published in 2002 and constitutes a technical revision. This edition includes the
36、following significant changes with respect to the previous edition: a) scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: “Rectangular type” has been deleted from the title. b) ball pitch of 0,3 mm has been added; c) datum i
37、s changed from the body datum to the ball datum; d) combination lists of D, E, M D , and M Ehave been revised. 4 60191-6-12 IEC:2011 The text of this standard is based on the following documents: CDV Report on voting 47D/784/CDV 47D/795/RVC Full information on the voting for the approval of this sta
38、ndard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 60191 series, under the general title Mechanical standardization of semiconductor devices, can be found on
39、the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, r
40、eplaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6019
41、1-6-12 IEC:2011 5 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guidelines for fine-pitch land grid array (FLGA) 1 Scope This part of IEC 60191 provides standard outline dra
42、wings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited appli
43、es. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191(all parts), Mechanical standardization of semiconductor devices IEC 60191-6, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outlin
44、e drawings of surface mounted semiconductor device packages 3 Terms and definitions For the purposes of this document, the terms and definitions given IEC 60191 series and the following apply. 3.1 fine-pitch land grid array FLGA package with metal lands on one side of a substrate in a matrix of at l
45、east three rows and three columns on a pitch of 0,8 mm or less, wherein the maximum standoff height is 0,10 mm or less NOTE Terminals may be missing from some row-column intersections. 3.2 flange-type FLGA FLGA with a package outline (length, width) defined by a package flange part, mostly substrate
46、, extending outward beyond the perimeter of a molded part or of a flip-chip-bonded part NOTE Flange-type FLGA, shown in Figure 1, is generally cut by singulation press, thus resulting in larger dimensional errors than the singulation by dicing saw 6 60191-6-12 IEC:2011 Figure 1 Flange-type FLGA 3.3
47、rectangle-type FLGA FLGA with a package outline (length, width) defined by a molded part with no extending flange part NOTE Rectangle-type FLGA, shown in Figure 2, is generally cut by dicing, thus resulting in less dimensional errors than the singulation by press machine. Figure 2 Rectangle-type FLG
48、A 4 Terminal position numbering When a package is viewed from the terminal side with the index corner in the bottom left corner position, terminal rows are lettered from bottom to top starting with A, then B, C, AA, AB, etc, whereas terminal columns are numbered from left to right starting with 1. T
49、erminal positions are designated by a row-column grid system and shown as alphanumeric identification, e.g., A1, B1. The letters I, O, Q, S, X and Z shall not be used for naming the terminal rows. 5 Nominal package dimension A nominal package dimension is defined as “the package width (E) length (D)”, which is expressed in the tenths place in mi
