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IEC 60191-6-18 CORR 2-2010 Mechanical standardization of semiconductor devices - Part 6-18 General rules for the preparation of outline drawings of surface mounted semiconductor de.pdf

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1、July 2010 Juillet 2010 IEC 60191-6-18 (Edition 1.0 2010) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for ball grid array (BGA) CEI 60191-6-18 (dition 1.0 2010) NORMA

2、LISATION MCANIQUE DES DISPOSITIFS SEMICONDUCTEURS Partie 6-18: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Guide de conception pour les botiers matriciels billes (BGA) CORRIGENDUM 2 3.1 ball grid array BGA This correction applies to the French only. 3.1 botier matriciel billes BGA Remplacer la note existante par la nouvelle note qui suit: NOTE Dans la prsente norme, BGA signifie Botier matriciel billes , nom conforme aux normes existantes (Voir Bibliographie).

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