1、 IEC 60352-5 Edition 4.0 2012-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Solderless connections Part 5: Press-in connections General requirements, test methods and practical guidance Connexions sans soudure Partie 5: Connexions insres force Exigences gnrales, mthodes dessai et guide pratique IEC
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16、AL STANDARD NORME INTERNATIONALE Solderless connections Part 5: Press-in connections General requirements, test methods and practical guidance Connexions sans soudure Partie 5: Connexions insres force Exigences gnrales, mthodes dessai et guide pratique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMI
17、SSION ELECTROTECHNIQUE INTERNATIONALE V ICS 31.220.10 PRICE CODE CODE PRIX ISBN 978-2-88912-919-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authoriz
18、ed distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 60352-5 IEC:2012 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope and object 7 2 Normative references . 7 3 Terms and definitions . 8 4 Requirements . 9 4.1 General . 9 4.2 Tools . 9 4.2.
19、1 General . 9 4.2.2 Tools evaluation 9 4.3 Press-in terminations. 9 4.3.1 Materials . 9 4.3.2 Dimensions of the press-in zone 9 4.3.3 Dimensions of the plated through hole . 9 4.3.4 Surface finishes . 9 4.4 Test boards . 10 4.4.1 General . 10 4.4.2 Materials . 10 4.4.3 Thickness of test boards 10 4.
20、4.4 Plated-through hole . 10 4.5 Press-in connections . 12 4.6 Manufacturers specification 12 5 Tests 13 5.1 General remarks 13 5.1.1 General . 13 5.1.2 Standard conditions for testing 13 5.1.3 Mounting of specimens 14 5.2 Test and measuring methods 14 5.2.1 General examination 14 5.2.2 Mechanical t
21、ests 14 5.2.3 Electrical tests . 18 5.2.4 Climatic tests . 19 5.3 Test schedules 20 5.3.1 General . 20 5.3.2 Qualification test schedule . 20 5.3.3 Flow chart . 22 5.3.4 Application test schedule . 22 5.4 Test report 23 5.4.1 Qualification test report . 23 5.4.2 Application test report 24 Annex A (i
22、nformative) Practical guidance . 25 Bibliography 32 Figure 1 Plated-through hole 10 Figure 2 Location and example of the transversal microsection for measuring the copper thickness . 11 60352-5 IEC:2012 3 Figure 3 Example of hole ranges 12 Figure 4 Test arrangement, bending 15 Figure 5 Test arrangem
23、ent push-out force 16 Figure 6 Transverse section of a press-in connection . 17 Figure 7 Longitudinal section of a press-in connection . 18 Figure 8 Test arrangement for contact resistance 19 Figure 9 Qualification test schedule . 22 Figure A.1 Example of a termination removal tool 29 Figure A.2 Con
24、ceptual composition of a four-layer printed circuit-board . 30 Table 1 Plated-through hole requirements for test boards 11 Table 2 Vibration, preferred test severities . 17 Table 3 Qualification test schedule Test group A. 20 Table 4 Qualification test schedule Test group B. 21 Table 5 Qualification
25、 test schedule Test group C 21 Table 6 Application test schedule Test group D . 23 Table A.1 Example for dimensioning the hole . 31 4 60352-5 IEC:2012 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SOLDERLESS CONNECTIONS Part 5: Press-in connections General requirements, test methods and practical guid
26、ance FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization i
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35、ublication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the pos
36、sibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60352-5 has been prepared by subcommittee 48B: Connectors, of IEC technical committee 48: Electr
37、omechanical components and mechanical structures for electronic equipment. This fourth edition cancels and replaces the third edition published in 2008. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous editi
38、on: a) Enhancement of Annex A and further application remarks are added. b) Editorial changes throughout the standard to prevent the document from being misunderstood as specification for establishing press-in connection in total. c) Deletion of all tables with hole dimensions. Historically the hole
39、 dimensions were constrained because of the dimensions of the wire wrap and clip connections posts. Since 60352-5 IEC:2012 5 these connection technologies are no longer commonly used, the design requirements are no longer practical. d) Inclusion of additional figures and one table in 4.4.4 to define
40、 tolerance ranges for holes in test-boards and to illustrate them. e) Inclusion of a requirement for the thickness of the test-board in 4.4. The text of this standard is based on the following documents: FDIS Report on voting 48B/2276/FDIS 48B/2286/RVD Full information on the voting for the approval
41、 of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IE
42、C web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 60352-5 IEC:2012 INTRODUCTION This part of IEC 60352 includes requirements, tests and practical guidanc
43、e information. Two test schedules are provided. a) The qualification test schedule applies to individual press-in connections (press-in zone). They are tested to the specification provided by the manufacturer of the press-in termination (see 4.6) taking into account the requirements of Clause 4. The
44、 qualification is independent of the application of the press-in zone in a component. b) The application test schedule applies to press-in connections which are part of a component and are already qualified to the qualification test schedule. Test sequences focus on the performance of the press-in c
45、onnection which is affected by the implementation in a component. As the manufacturer of the press-in termination has to provide the main part of the information needed for qualification, the word “manufacturer“ is used throughout this standard for simplicity. IEC Guide 109 advocates the need to min
46、imise the impact of a product on the natural environment throughout the product life cycle. 60352-5 IEC:2012 7 SOLDERLESS CONNECTIONS Part 5: Press-in connections General requirements, test methods and practical guidance 1 Scope and object This part of IEC 60352 is applicable to solderless press-in
47、connections for use in tele-communication equipment and in electronic devices employing similar techniques. The press-in connection consists of a termination having a suitable press-in zone which is inserted into a plated-through hole of a double-sided or multilayer printed board. Information on mat
48、erials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of press-in connections under mechanical, electrical an
49、d atmospheric conditions as specified by the manufacturer of the press-in termination and to provide a means of comparing test results when the tools used to make the connections are of different designs or manufacture. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For da