1、 IEC 60749-20-1 Edition 1.0 2009-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climatic test methods Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Dispositifs semicon
2、ducteurs Mthodes dessais mcaniques et climatiques Partie 20-1: Manipulation, emballage, tiquetage et transport des composants pour montage en surface sensibles leffet combin de lhumidit et de la chaleur de brasage IEC 60749-20-1:2009 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva
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17、 +41 22 919 03 00 IEC 60749-20-1 Edition 1.0 2009-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climatic test methods Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Di
18、spositifs semiconducteurs Mthodes dessais mcaniques et climatiques Partie 20-1: Manipulation, emballage, tiquetage et transport des composants pour montage en surface sensibles leffet combin de lhumidit et de la chaleur de brasage INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE
19、 INTERNATIONALE V ICS 31.080.01 PRICE CODE CODE PRIX ISBN 2-8318-1036-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 60749-20-1 IEC:2009 CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 T
20、erms and definitions .7 4 General applicability and reliability considerations9 4.1 Assembly processes9 4.1.1 Mass reflow .9 4.1.2 Localized heating 9 4.1.3 Socketed components .9 4.1.4 Point-to-point soldering .9 4.2 Reliability 9 5 Dry packing 10 5.1 Requirements10 5.2 Drying of SMDs and carrier m
21、aterials before being sealed in MBBs.10 5.2.1 Drying requirements - level A2.10 5.2.2 Drying requirements - levels B2a to B5a10 5.2.3 Drying requirements - carrier materials10 5.2.4 Drying requirements - other .11 5.2.5 Excess time between bake and bag.11 5.3 Dry pack11 5.3.1 Description 11 5.3.2 Ma
22、terials .11 5.3.3 Labels .13 5.3.4 Shelf life14 6 Drying 14 6.1 Drying options .14 6.2 Post exposure to factory ambient 16 6.2.1 Floor life clock .16 6.2.2 Any duration exposure.16 6.2.3 Short duration exposure 16 6.3 General considerations for baking .17 6.3.1 High-temperature carriers17 6.3.2 Low-
23、temperature carriers.17 6.3.3 Paper and plastic container items17 6.3.4 Bakeout times17 6.3.5 ESD protection 17 6.3.6 Reuse of carriers.17 6.3.7 Solderability limitations17 7 Use 18 7.1 Floor life clock start.18 7.2 Incoming bag inspection18 7.2.1 Upon receipt18 7.2.2 Component inspection .18 7.3 Fl
24、oor life18 7.4 Safe storage19 60749-20-1 IEC:2009 3 7.4.1 Safe storage categories.19 7.4.2 Dry pack19 7.4.3 Dry atmosphere cabinet.19 7.5 Reflow.19 7.5.1 Reflow categories19 7.5.2 Opened MBB.19 7.5.3 Reflow temperature extremes19 7.5.4 Additional thermal profile parameters 20 7.5.5 Multiple reflow p
25、asses .20 7.5.6 Maximum reflow passes 20 7.6 Drying indicators .20 7.6.1 Drying requirements 20 7.6.2 Excess humidity in the dry pack.20 7.6.3 Floor life or ambient temperature/humidity exceeded.21 7.6.4 Level B6 SMDs21 Annex A (normative) Symbol and labels for moisture-sensitive devices22 Annex B (
26、informative) Board rework.27 Annex C (informative) Derating due to factory environmental conditions 28 Bibliography31 Figure 1 Typical dry pack configuration for moisture-sensitive SMDs in shipping tubes 11 Figure 2a Example humidity indicator card for level A2 13 Figure 2b Example humidity indicato
27、r card for levels B2a to B5a .13 Figure 2 Example humidity indicator cards.13 Figure A.1 Moisture-sensitive symbol (example) 22 Figure A.2 MSID label (example) .22 Figure A.3 Information label for level A1 or B1 (example).23 Figure A.4 Moisture-sensitive caution label for level A2 (example) .24 Figu
28、re A.5 Moisture-sensitive caution label for levels B2-B5a (example)25 Figure A.6 Moisture-sensitive caution label for level B6 (example) .26 Table 1 Dry packing requirements10 Table 2 Reference conditions for drying mounted or unmounted SMDs (user bake: floor life begins counting at time = 0 after b
29、ake)14 Table 3 Default baking times used prior to dry-pack that were exposed to conditions 60 % RH (supplier bake: MET = 24 h) .16 Table 4 Moisture classification level and floor life 18 Table C.1 Recommended equivalent total floor life (days) for level A2 at 20 C, 25 C, 30 C and 35 C for ICs with N
30、ovolac, biphenyl and multifunctional epoxies (reflow at same temperature at which component was classified) .28 Table C.2 Recommended equivalent total floor life (days) for levels B2a to B5a at 20 C, 25 C, 30 C and 35 C for ICs with Novolac, biphenyl and multifunctional epoxies (reflow at same tempe
31、rature at which component was classified).29 4 60749-20-1 IEC:2009 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and sol
32、dering heat FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardiz
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40、ational Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attentio
41、n is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC s
42、hall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-20-1 has been prepared by IEC technical committee 47: Semiconductor devices. This standard cancels and replaces IEC/PAS 62168 and IEC/PAS 62169 published in 2000. IEC/PAS 62169 was based on a
43、 Joint (IPC/JEDEC) Industry Standard. This first edition of IEC 60749-20-1 constitutes a technical revision. 60749-20-1 IEC:2009 5 The text of this standard is based on the following documents: FDIS Report on voting 47/2010/FDIS 47/2013/RVD Full information on the voting for the approval of this sta
44、ndard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 60749 series, under the general title Semiconductor devices Mechanical and climatic test methods, can be fo
45、und on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirm
46、ed, withdrawn, replaced by a revised edition, or amended. 6 60749-20-1 IEC:2009 INTRODUCTION The advent of surface-mount devices (SMDs) introduced a new class of quality and reliability concerns regarding package damage cracks and delamination from the solder reflow process. This document describes
47、the standardized levels of floor life exposure for moisture/reflow-sensitive SMDs along with the handling, packing and shipping requirements necessary to avoid moisture/reflow-related failures. IEC 60749-20 defines the classification procedure and Annex A of this document defines the labelling requi
48、rements. Moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solder SMDs to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200 C. During solder reflow, the combination of rapid moisture expansion,
49、materials mismatch, and material interface degradation can result in package cracking and/or delamination of critical interfaces within the package. The solder reflow processes of concern are convection, convection/IR, infrared (IR), vapour phase (VPR) and hot air rework tools. The use of assembly processes that immerse the component body in molten solder ar
