1、 IEC 60749-42 Edition 1.0 2014-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climatic test methods Part 42: Temperature and humidity storage Dispositifs semiconducteurs Mthodes dessais mcaniques et climatiques Partie 42: Stockage de temprature et dhumidit IEC 60
2、749-42:2014-08(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2014 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying
3、 and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC
4、member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, san
5、s laccord crit de lIEC ou du Comit national de lIEC du pays du demandeur. Si vous avez des questions sur le copyright de lIEC ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de lIEC de votre pays de rsidence. I
6、EC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electri
7、cal, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. IEC Catalogue - webstore.iec.ch/catalogue Th
8、e stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC publications search - www.iec.ch/searchpub The advanced search enab
9、les to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all
10、 new publications released. Available online and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in 14 additional lan
11、guages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary More than 55 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have be
12、en collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de lIEC La Commission Electrot
13、echnique Internationale (IEC) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications IEC Le contenu technique des publications IEC est constamment revu. Veuillez
14、vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue IEC - webstore.iec.ch/catalogue Application autonome pour consulter tous les renseignements bibliographiques sur les Normes internationales, Spcifications techniques, Rapports techniques
15、et autres documents de lIEC. Disponible pour PC, Mac OS, tablettes Android et iPad. Recherche de publications IEC - www.iec.ch/searchpub La recherche avance permet de trouver des publications IEC en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informatio
16、ns sur les projets et les publications remplaces ou retires. IEC Just Published - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications IEC. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.ele
17、ctropedia.org Le premier dictionnaire en ligne de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans 14 langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (IEV) en ligne. Gl
18、ossaire IEC - std.iec.ch/glossary Plus de 55 000 entres terminologiques lectrotechniques, en anglais et en franais, extraites des articles Termes et Dfinitions des publications IEC parues depuis 2002. Plus certaines entres antrieures extraites des publications des CE 37, 77, 86 et CISPR de lIEC. Ser
19、vice Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60749-42 Edition 1.0 2014-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climatic test methods Part 4
20、2: Temperature and humidity storage Dispositifs semiconducteurs Mthodes dessais mcaniques et climatiques Partie 42: Stockage de temprature et dhumidit INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE H ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-8322-1785-6 Regi
21、stered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distrib
22、uteur agr. colour inside 2 IEC 60749-42:2014 IEC 2014 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Test equipment 5 3.1 Capacity of the equipment 5 3.2 Materials and construction of the thermostatic/humidistatic chamber 5 3.3 Water to be used in the test 5 4 Procedure 5 4.1 Preconditio
23、ning . 5 4.2 Initial measurements . 6 4.3 Tests 6 Inserting and removing specimens . 6 4.3.1Test conditions 6 4.3.2Test duration . 6 4.3.3Post treatment . 7 4.3.4End-point measurement . 7 4.3.5 5 Failure criteria . 7 6 Information to be given in applicable procurement document . 8 Figure 1 Unsaturat
24、ed pressurized vapour test conditions profile. 7 Table 1 Temperature and humidity storage test conditions . 6 IEC 60749-42:2014 IEC 2014 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 42: Temperature and humidity storage FOREWORD 1) The
25、International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and
26、electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical comm
27、ittees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization f
28、or Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committe
29、e has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is ac
30、curate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regi
31、onal publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in
32、 some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agen
33、ts including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of,
34、or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some o
35、f the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-42 has been prepared by IEC technical committee 47: Semiconductor devices. This first edition is based on Japa
36、n Electronics and Information Technology Industries Association, EIAJ ED-4701/100, Environmental and endurance test methods for semiconductor devices, test method 103. It is used with permission of the copyright holder, Japan Electronics and Information Technology Industries Association (JEITA). 4 I
37、EC 60749-42:2014 IEC 2014 The text of this standard is based on the following documents: FDIS Report on voting 47/2200/FDIS 47/2204/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafte
38、d in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60749 series, published under the general title Semiconductor devices Mechanical and climatic test methods, can be found on the IEC website. The committee has decided that the contents of this publication will remain
39、 unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page
40、 of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. IEC 60749-42:2014 IEC 2014 5 SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 42:
41、 Temperature and humidity storage 1 Scope This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of
42、chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests. 2 Normative references The foll
43、owing documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60749-20, S
44、emiconductor devices Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 3 Test equipment 3.1 Capacity of the equipment The chamber to be used in this test shall be capable of maintaining the test temperature and
45、 humidity conditions specified in 4.3 throughout the test duration. 3.2 Materials and construction of the thermostatic/humidistatic chamber The chamber shall be made of materials that do not deteriorate under high humidity conditions. The design of the chamber shall prevent water condensed on the ce
46、iling of the chamber from dropping on the specimen. 3.3 Water to be used in the test Water to be used in the tests shall be distilled water or deionised water, with a resistivity of 500 m or more at 23 C. 4 Procedure 4.1 Preconditioning When the specimen is a plastic-moulded SMD, the moisture soakin
47、g and soldering heat stress treatment specified in IEC 60749-20 shall be carried out before executing this test. 6 IEC 60749-42:2014 IEC 2014 4.2 Initial measurements The initial measurements shall be carried out in accordance with the applicable procurement document. 4.3 Tests Inserting and removin
48、g specimens 4.3.1 The specimens shall be placed in the chamber at the high temperature and high humidity conditions required by the applicable procurement document. When putting the specimen in and out of the chamber, care shall be taken to ensure that water droplets not to adhere to the specimen an
49、d that the specimen does not come into contact with any condensed water. NOTE When a SMD is to be mounted on a jig for evaluation, the relevant conditions (board materials, size of the land, soldering method, flux cleaning, etc.) are specified in the applicable procurement document. Test conditions 4.3.2 The temperature and humidity conditions shall be selected from Table 1. Unless otherwise required
