1、 IEC 60749-43 Edition 1.0 2017-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climatic test methods Part 43: Guidelines for IC reliability qualification plans Dispositifs semiconducteurs Mthodes dessais mcaniques et climatiques Partie 43: Lignes directrices conce
2、rnant les plans de qualification de la fiabilit des CI IEC 60749-43:2017-06(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or b
3、y any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this pub
4、lication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectroniqu
5、e ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de lIEC ou du Comit national de lIEC du pays du demandeur. Si vous avez des questions sur le copyright de lIEC ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou con
6、tactez le Comit national de lIEC de votre pays de rsidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that p
7、repares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have
8、 been published. IEC Catalogue - webstore.iec.ch/catalogue The stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC public
9、ations search - www.iec.ch/searchpub The advanced search enables to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to
10、 date on all new IEC publications. Just Published details all new publications released. Available online and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and
11、 French, with equivalent terms in 16 additional languages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary 65 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publication
12、s issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch
13、. A propos de lIEC La Commission Electrotechnique Internationale (IEC) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications IEC Le contenu technique des publica
14、tions IEC est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue IEC - webstore.iec.ch/catalogue Application autonome pour consulter tous les renseignements bibliographiques sur les Normes internationales, Spcif
15、ications techniques, Rapports techniques et autres documents de lIEC. Disponible pour PC, Mac OS, tablettes Android et iPad. Recherche de publications IEC - www.iec.ch/searchpub La recherche avance permet de trouver des publications IEC en utilisant diffrents critres (numro de rfrence, texte, comit
16、dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. IEC Just Published - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications IEC. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi une fois p
17、ar mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne de termes lectroniques et lectriques. Il contient 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans 16 langues additionnelles. Egalement appel Vocabulaire Electrotechnique
18、 International (IEV) en ligne. Glossaire IEC - std.iec.ch/glossary 65 000 entres terminologiques lectrotechniques, en anglais et en franais, extraites des articles Termes et Dfinitions des publications IEC parues depuis 2002. Plus certaines entres antrieures extraites des publications des CE 37, 77,
19、 86 et CISPR de lIEC. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60749-43 Edition 1.0 2017-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and cli
20、matic test methods Part 43: Guidelines for IC reliability qualification plans Dispositifs semiconducteurs Mthodes dessais mcaniques et climatiques Partie 43: Lignes directrices concernant les plans de qualification de la fiabilit des CI INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTEC
21、HNIQUE INTERNATIONALE ICS 31.080.01 ISBN 978-2-8322-4471-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vou
22、s assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 60749-43:2017 IEC 2017 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Terms and definitions 8 4 Product categories and applications 8 5 Failure . 9 5.1 Failure distribution 9 5.
23、2 Early failure 10 5.2.1 Description 10 5.2.2 Early failure rate 11 5.2.3 Screening 14 5.3 Random failure . 17 5.3.1 Description 17 5.3.2 Mean failure rate . 17 5.4 Wear-out failure 20 5.4.1 Description 20 5.4.2 Wear-out failure rate 20 6 Reliability test 23 6.1 Reliability test description . 23 6.2
24、 Reliability test plan . 23 6.2.1 Procedures for creating a reliability test plan . 23 6.2.2 Estimation of the test time required to confirm the TDDB from the number of test samples . 26 6.2.3 Estimation of the number of samples required to confirm the TDDB from the test time. 27 6.3 Reliability tes
25、t methods . 28 6.4 Acceleration models for reliability tests . 31 6.4.1 Arrhenius model 31 6.4.2 V-model: 32 6.4.3 Absolute water vapor pressure model 32 6.4.4 Coffin-Manson model . 32 7 Stress test methods . 32 8 Supplementary tests 33 9 Summary table of assumptions 34 10 Summary . 36 Bibliography
26、37 Figure 1 Bathtub curve . 10 Figure 2 Failure process of IC manufacturing lots during the early failure period . 11 Figure 3 Weibull conceptual diagram of the early failure rate . 12 Figure 4 Example of a failure ratio: (in hundreds) and the number of failures for CL of 60 % 14 Figure 5 Screening
27、and estimated early fail rate in Weibull diagram 15 Figure 6 Bathtub curve setting the point immediately after production as the origin . 16 IEC 60749-43:2017 IEC 2017 3 Figure 7 Bathtub curve setting the point after screening as the origin 17 Figure 8 Conceptual diagram of calculation method for th
28、e mean failure rate from the exponential distribution . 18 Figure 9 Conceptual diagram of calculation method for the mean failure rate as an extension of early failure . 19 Figure 10 Conceptual diagram of the wear-out failure 21 Figure 11 Conceptual diagram describing the concept of the acceleration
29、 test 21 Figure 12 Concept of the reliability test in a Weibull diagram (based on sample size) . 25 Figure 13 Concept of the reliability test in a Weibull diagram (based on test time) 28 Figure 14 Difference in sampling sizes according to the m value (image) . 29 Table 1 Examples of product categori
30、es . 9 Table 2 Cumulative failure probability 0,1 % over 10 years 10 6 for the third, fifth and seventh years 25 Table 3 Major reliability (life) test methods and purposes . 30 Table 4 Examples of the number of test samples and the test time in typical reliability (life) test methods 31 Table 5 LTPD
31、 sampling table for acceptance number Ac = 0 33 Table 6 Major reliability (strength) test methods and purposes . 33 Table 7 Supplementary tests 34 Table 8 Accelerating factors, calculation formulae and numerical values a35 4 IEC 60749-43:2017 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMI
32、CONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 43: Guidelines for IC reliability qualification plans FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committe
33、es). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available
34、 Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organi
35、zations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical ma
36、tters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC Natio
37、nal Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, I
38、EC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itse
39、lf does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that t
40、hey have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature
41、 whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced p
42、ublications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International
43、 Standard IEC 60749-43 has been prepared by IEC technical committee 47: Semiconductor devices. The text of this International Standard is based on the following documents: FDIS Report on voting 47/2389/FDIS 47/2406/RVD Full information on the voting for the approval of this International Standard ca
44、n be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. IEC 60749-43:2017 IEC 2017 5 A list of all parts in the IEC 60749 series, published under the general title Semiconductor devices Mechanical and climatic
45、 test methods, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reco
46、nfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a
47、 colour printer. 6 IEC 60749-43:2017 IEC 2017 INTRODUCTION This document provides guidelines for semiconductor IC vendors in the preparation of detailed reliability test plans for device qualification. Such plans are intended to be prepared before commencing qualification tests and after consultatio
48、n with the user of their semiconductor integrated circuit product. The guideline gives some examples for creating reliability qualification test plans to determine appropriate reliability test conditions based on the quality standards demanded in use conditions for each application of semiconductor
49、integrated circuits. Categories are set for automotive applications and for general applications as a target of reliability. The grade for automotive use is further classified into two grades according to applications. The guideline assumes annual operating hours, useful life, etc. for each grade, and defines the verification methods for early failure rate and wear-out
