1、 IEC 61240 Edition 3.0 2016-10 INTERNATIONAL STANDARD Piezoelectric devices Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection General rules IEC 61240:2016-10(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2016 IEC, Geneva, Switzerland All rig
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11、ces (SMD) for frequency control and selection General rules INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.140 ISBN 978-2-8322-3692-5 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. 2 IEC 61
12、240:2016 IEC 2016 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 6 2 Normative references 6 3 Classification of SMD 6 4 Title of the outline drawing . 6 5 Composition of the outline drawing 6 5.1 Elements of outline drawings 6 5.2 Outline drawing . 7 5.3 Table of detailed dimensions. 7 5.4 Actual si
13、ze sketch . 7 5.5 Drawing of terminal land areas 7 5.6 Terminal lead details . 7 6 Requirements for terminal leads 9 7 Requirements for the terminal land area 9 8 Connections of terminal leads 9 9 Descriptive notes . 10 Annex A (informative) Miniaturized leadless ceramic enclosures of piezoelectric
14、devices (SMD) for frequency control and selection 13 A.1 Precise drawing 13 A.2 Requirements for enclosures with 3 terminals . 15 A.3 Naming rule for new type of enclosures 15 Annex B (informative) Example of terminal connections for surface-mounted piezoelectric devices (SMD) for frequency control
15、and selection . 17 Bibliography 18 Figure 1 Illustration of terminal projection zone 8 Figure 2 Example of a terminal land area . 9 Figure A.1 Upper part of the view from above 13 Figure A.2 Front view (without a board) . 14 Figure A.3 Front view (with a board) 14 Table A.1 Scale of drawings. 13 Tab
16、le A.2 Guideline for dimension table . 14 Table A.3 Guideline for column “Max.” of Table A.2 for A, B . 15 Table A.4 Examples of correspondence between new and old enclosures 16 Table B.1 Examples of terminal connections for various types of piezoelectric devices . 17 IEC 61240:2016 IEC 2016 3 INTER
17、NATIONAL ELECTROTECHNICAL COMMISSION _ PIEZOELECTRIC DEVICES PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION GENERAL RULES FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising a
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27、references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible
28、 for identifying any or all such patent rights. International Standard IEC 61240 has been prepared by lEC technical committee 49: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection. This third edition cancels and replaces the s
29、econd edition published in 2012. It constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: outline drawings have been changed from three views (top, front and bottom) to that based on ISO layout in the third-angle pro
30、jection, in which the view from the right has been added to the top, front and bottom views; reference line and geometrical dimensions of the package for enclosures have been changed for practical use; information on miniaturized leadless ceramic enclosures of piezoelectric devices (SMD) for frequen
31、cy control and selection has been included in an annex. 4 IEC 61240:2016 IEC 2016 The text of this standard is based on the following documents: CDV Report on voting 49/1172/CDV 49/1188/RVC Full information on the voting for the approval of this International Standard can be found in the report on v
32、oting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data
33、related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IEC 61240:2016 IEC 2016 5 INTRODUCTION The enclosures of quartz crystal resonators and
34、oscillators are unified in this third edition of IEC 61240. Regarding the current situation of many quartz crystal device suppliers, many of them use their own enclosure layouts in their catalogues. For the convenience of consumers, general rules of enclosure layout and definition of size need to be
35、 unified. The reasons prompting the revision of IEC 61240:2012 are as follows: a) The height of packages should not be included in a drawing. Only the total height of enclosures should be expressed. b) In small enclosure types, the size tolerance in smaller enclosures will not meet the conditions de
36、fined in Table A.3 (Annex A). In newly proposed general rules of outline drawings, only the total height of enclosures should be expressed and the size tolerance in smaller enclosures is revised. 6 IEC 61240:2016 IEC 2016 PIEZOELECTRIC DEVICES PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVIC
37、ES (SMD) FOR FREQUENCY CONTROL AND SELECTION GENERAL RULES 1 Scope This International Standard sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this document as SMD) in order to ensure mechanical inte
38、r-changeability of all outline drawings of the SMDs for frequency control and selection. 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited
39、applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-6, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Classif
40、ication of SMD The SMD piezoelectric devices are classified into three types of packages depending on the structure of the terminal leads. a) Leaded type: the folded ends of the terminal leads are turned away from the body. NOTE 1 The package of the pin lead type is compatible with the socket. This
41、is defined in the description of the leaded type. b) Folded-leads type: the folded ends of the terminal lead are turned towards the body. NOTE 2 The supporter with a board is defined in the description of this folded lead type. c) Leadless type: terminal pads only are present on the body instead of
42、terminal leads. A proper combination of these options should be selected. 4 Title of the outline drawing The title of the outline drawing shall imply the main package material (e.g. metal, plastic, glass, ceramic), the sealing procedure, number of terminals and the type of SMD, as shown in Examples
43、1, 2 and 3 1 . 5 Composition of the outline drawing 5.1 Elements of outline drawings The outline drawing of an SMD shall be composed of five elements: the drawings from four views in the third-angle projection, the table of detailed dimensions, the actual size sketch, the _ 1Examples 1, 2 and 3 refe
44、r to the sheets provided after Clause 9 of this document. IEC 61240:2016 IEC 2016 7 drawing of terminal land areas and the terminal lead details. These sample formats are shown in Examples 1, 2, and 3. 5.2 Outline drawing The outline drawing with dimensional symbols shall be executed in the third-an
45、gle projection. Basically, one set of outline drawings consists of the view from above, the front view, the view from the right, and the view from below. In square type enclosure and cylindrical type enclosure, the view from the right can be omitted. 5.3 Table of detailed dimensions The dimensions s
46、hall be given in millimetres and are required only where the letter X is shown in the table. 5.4 Actual size sketch The actual size sketch means a drawing of the view from above with the real size outer dimensions. 5.5 Drawing of terminal land areas The drawing of terminal land areas which is define
47、d in Clause 7 shall be adapted to the connecting terminal leads on the printed circuit boards, alumina substrates, etc. 5.6 Terminal lead details The terminal lead details shall be shown in accordance with IEC 60191-6 (see Figure 1). 8 IEC 61240:2016 IEC 2016 Figure 1 Illustration of terminal projec
48、tion zone IEC L p x b p = terminal projection zone (hatched) Side view A3 Reference plane Projected zone Bottom view Seating plane L p b p S Side view Reference plane Projected zone Seating plane L p L p x b p = terminal projection zone (hatched) Bottom view Key for figure 1 and examples 1 to 3 = re
49、ference plane distance b p S P P A3 P A3 = projected tolerance zone (see ISO 1101, clause 11) (*) means the true geometrical position IEC 61240:2016 IEC 2016 9 6 Requirements for terminal leads 6.1 The dimensions of terminal lead spacing shall be shown by the centre position of the terminal leads and its basic value e is 2,54 n mm (n is an integer) and 1,27 n mm for package dimensions smaller than 6 mm. 6.2 In the view from above of SMD, the lower lead
