1、 IEC 61249-4-16 Edition 1.0 2009-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Materials for printed boards and other interconnecting structures Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Multifunctional non-halogenated epoxide wo
2、ven E-glass prepreg of defined flammability (vertical burning test) for lead- free assembly Matriaux pour cartes imprimes et autres structures dinterconnexion Partie 4-16: Srie de spcifications intermdiaires pour matriaux primprgns, non plaqus (pour la fabrication des cartes multicouches) Tissu de v
3、erre poxyde primprgn multifonctionnel non halogn de type E dinflammabilit dfinie (essai de combustion verticale) destin aux assemblages sans plomb IEC 61249-4-16:2009 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no p
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18、STANDARD NORME INTERNATIONALE Materials for printed boards and other interconnecting structures Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (verti
19、cal burning test) for lead- free assembly Matriaux pour cartes imprimes et autres structures dinterconnexion Partie 4-16: Srie de spcifications intermdiaires pour matriaux primprgns, non plaqus (pour la fabrication des cartes multicouches) Tissu de verre poxyde primprgn multifonctionnel non halogn d
20、e type E dinflammabilit dfinie (essai de combustion verticale) destin aux assemblages sans plomb INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE N ICS 31.180 PRICE CODE CODE PRIX ISBN 2-8318-1072-4 Registered trademark of the International Electrotechnical Commis
21、sion Marque dpose de la Commission Electrotechnique Internationale 2 61249-4-16 IEC:2009 CONTENTS FOREWORD.4 1 Scope.6 2 Normative references .6 3 Materials and construction6 3.1 Reinforcement.6 3.2 Resin system.7 4 Properties.7 4.1 Properties related to the appearance of the prepreg7 4.1.1 Dewetted
22、 areas (fish eyes) 7 4.1.2 Broken filaments7 4.1.3 Distortion.7 4.1.4 Creases.7 4.1.5 Edge conditions.7 4.2 Properties related to B-stage prepreg8 4.2.1 Resin content 8 4.2.2 Treated weight.8 4.2.3 Resin flow .8 4.2.4 Scaled flow thickness 8 4.2.5 Melting viscosity9 4.2.6 Gel time.9 4.2.7 Volatile c
23、ontent9 4.3 Properties related to prepreg after curing 9 4.3.1 Electric strength 9 4.3.2 Flammability9 4.3.3 Relative permittivity and dissipation factor.10 4.3.4 Cured thickness.10 4.3.5 Glass transition temperature (Tg) 10 4.3.6 Decomposition temperature (Td)10 4.3.7 Thermal resistance10 4.3.8 Z-a
24、xis expansion .10 5 Delivery form11 5.1 Rolls11 5.2 Sheets.11 5.3 Cut panels.11 6 Quality assurance.11 6.1 Quality system.11 6.2 Responsibility for inspection11 6.3 Qualification inspection .11 6.4 Quality conformance inspection.12 6.5 Certificate of conformance.12 6.6 Safety data sheet 12 7 Packagi
25、ng and marking 12 8 Shelf life.12 9 Ordering information.13 Bibliography14 61249-4-16 IEC:2009 3 Table 1 Flammability, vertical burning test .9 Table 2 Decomposition temperature requirements .10 Table 3 Thermal resistance requirements 10 Table 4 Z-axis expansion requirements11 4 61249-4-16 IEC:2009
26、INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flamm
27、ability (vertical burning test) for lead-free assembly FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-opera
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36、uding legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of
37、 this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61249-4-16 has been prepared by IEC technical
38、 committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/852/FDIS 91/864/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This bilingu
39、al version, published in 2010-01, corresponds to the English version. 61249-4-16 IEC:2009 5 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The French version of this standard has not been voted upon. A list of all parts of the IEC 61249 series, under the general
40、 title Materials for printed boards and other interconnecting structures, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data r
41、elated to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 61249-4-16 IEC:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES Part 4-16: Sectional specification set for prepreg materials, unclad (f
42、or the manufacture of multilayer boards) Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly 1 Scope This part of IEC 61249 gives requirements for properties of prepreg that are mainly intended to be used as bonding she
43、ets in connection with laminates according IEC 61249-2-37 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates. Prepreg according to
44、 this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated flame retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the suppliers instructi
45、ons, the glass transition temperature is defined to be 150 C and 200 C. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced
46、 document (including any amendments) applies. IEC 61189-2:2006, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures IEC 61249-2-37, Materials for printed boards and other interconn
47、ecting structures Part 2-37: Reinforced base materials, clad and unclad Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly IEC 62326-4, Printed boards Part 4: Rigid multilayer printed boards with interlay
48、er connections Sectional specification ISO 11014-1:1994, Safety data sheet for chemical products Part 1: Content and order of sections 3 Materials and construction The prepreg consists of a reinforcing E-glass fabric which is impregnated modified epoxide resin and partially cured to the B-stage. 3.1
49、 Reinforcement Woven E-glass as specified in the future IEC 61249-6-3 (under consideration), woven E-glass fabric (for the manufacture of prepreg and copper-clad laminate). 61249-4-16 IEC:2009 7 3.2 Resin system Majority di-functional non-halogenated epoxide and modified non-halogenated epoxide with a glass transition temperature after curing according t
