1、 IEC 62026-3 Edition 3.0 2014-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Low-voltage switchgear and controlgear Controller-device interfaces (CDIs) Part 3: DeviceNet Appareillage basse tension Interfaces appareil de commande-appareil (CDI) Partie 3: DeviceNet IEC 62026-3:2014-08(en-fr) colour in
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19、csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62026-3 Edition 3.0 2014-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Low-voltage switchgear and controlgear Controller-device interfaces (CDIs) Part 3: DeviceNet Appa
20、reillage basse tension Interfaces appareil de commande-appareil (CDI) Partie 3: DeviceNet INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE XF ICS 29.130.20 PRICE CODE CODE PRIX ISBN 978-2-8322-1792-4 Registered trademark of the International Electrotechnical Commi
21、ssion Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 62026-3:2014 IEC 2014 CONTENT
22、S FOREWORD . 8 INTRODUCTION . 10 1 Scope 11 2 Normative references. 11 3 Terms, definitions, symbols and abbreviated terms . 12 3.1 Terms and definitions 12 3.2 Symbols and abbreviated terms . 18 4 Classification . 18 4.1 General . 18 4.2 DeviceNet communication model . 19 4.3 DeviceNet, CAN and CIP
23、 . 20 5 Characteristics 21 5.1 DeviceNet connections 21 5.1.1 General . 21 5.1.2 DeviceNets use of the CAN identifier field 21 5.1.3 Connection establishment 22 5.2 DeviceNet messaging protocol 23 5.2.1 Explicit messaging . 23 5.2.2 Input/output messaging 34 5.2.3 Fragmentation/reassembly . 35 5.2.4
24、 Offline connection set 39 5.2.5 Device heartbeat 49 5.2.6 Device shutdown message . 50 5.2.7 Duplicate MAC ID detection protocol 52 5.2.8 Quick connect 53 5.3 DeviceNet communication object classes . 53 5.3.1 General . 53 5.3.2 Identity object class definition (class ID code: 0x01) . 53 5.3.3 Messa
25、ge router object class definition (class ID code: 0x02) . 54 5.3.4 DeviceNet object class definition (class ID code: 0x03) . 54 5.3.5 Connection object class definition (class ID code: 0x05) . 54 5.3.6 Acknowledge handler object class definition (class ID code: 0x2B) 55 5.4 Link access state machine
26、 . 55 5.4.1 General . 55 5.4.2 State transition diagram and event matrix . 55 5.4.3 Duplicate MAC ID detection 58 5.5 Predefined master/slave connection set . 58 5.5.1 General . 58 5.5.2 Predefined master/slave connection set messages . 59 5.5.3 DeviceNet object class specific services for the maste
27、r/slave connection set . 61 5.5.4 Slave connection object characteristics 68 5.5.5 Master connection object characteristics . 73 5.5.6 Bit-strobe command/response messages 73 5.5.7 Poll command/response messages . 74 5.5.8 Multicast poll command/response messages . 75 5.5.9 Change of state/cyclic co
28、nnections . 75 IEC 62026-3:2014 IEC 2014 3 5.5.10 Group 2 only devices . 77 5.6 CIP Safety on DeviceNet 78 5.6.1 General . 78 5.6.2 Use of CAN identifiers for CIP Safety on DeviceNet 78 5.7 Physical layer . 78 5.7.1 General . 78 5.7.2 Transceiver 80 5.7.3 Grounding 81 5.7.4 Isolation . 81 5.7.5 Tran
29、smission medium 83 5.7.6 Topology 83 5.7.7 Link power . 84 6 Product information . 85 7 Normal service, mounting and transport conditions . 85 7.1 Normal service conditions . 85 7.1.1 General . 85 7.1.2 Ambient air temperature . 85 7.1.3 Altitude 86 7.1.4 Climatic conditions . 86 7.2 Conditions duri
30、ng transport and storage 86 7.3 Mounting . 86 8 Constructional and performance requirements 86 8.1 Indicators and configuration switches 86 8.2 DeviceNet cable 87 8.2.1 Overview . 87 8.2.2 Cable profile template 87 8.2.3 Thick cable profile 88 8.2.4 Thin cable profile . 92 8.2.5 Flat cable profile 9
31、5 8.3 Terminating resistors . 98 8.4 Connectors . 98 8.4.1 General specifications 98 8.4.2 Connector profile template . 98 8.4.3 Open connector profile . 99 8.4.4 Sealed mini connector profile . 102 8.4.5 Sealed micro connector profile . 103 8.4.6 Flat trunk connector profile . 104 8.5 Device taps a
32、nd power taps . 107 8.5.1 Device taps 107 8.5.2 Power taps. 108 8.6 Link powered devices 109 8.7 Miswiring protection 109 8.8 Power supplies 109 8.9 Electromagnetic compatibility (EMC) 110 8.9.1 General . 110 8.9.2 Immunity 110 8.9.3 Emissions 111 8.10 Additional functional safety requirements relat
33、ed to EMC . 112 9 Tests . 112 4 IEC 62026-3:2014 IEC 2014 9.1 General . 112 9.2 Electrical and EMC testing 112 9.2.1 Test of the DeviceNet power supply 112 9.2.2 Device peak current consumption . 113 9.2.3 Power ON behaviour 113 9.2.4 Reverse connection of V+ and V . 114 9.2.5 Disconnection of V . 1
34、15 9.2.6 Differential input impedance test 115 9.2.7 Transmit levels 115 9.2.8 Acknowledge delay 116 9.2.9 CDI tests . 117 9.2.10 Electromagnetic compatibility testing 118 9.3 Logical testing . 120 9.3.1 General . 120 9.3.2 Duplicate MAC ID check test 120 9.3.3 UCMM . 121 9.3.4 Allocation of predefi
35、ned master/slave connection set Explicit messaging connection 122 9.3.5 Allocation of predefined master/slave connection set I/O messaging connection . 122 9.3.6 Logical testing of safety products . 123 Bibliography . 124 Figure 1 Typical DeviceNet controller-device interfaces 19 Figure 2 DeviceNet
36、protocol architecture compared with the OSI reference model . 20 Figure 3 DeviceNets use of the CAN identifier field 21 Figure 4 Explicit message CAN data field use . 23 Figure 5 Explicit message data field format. 23 Figure 6 Explicit message header format 24 Figure 7 Service field format 24 Figure
37、 8 Open explicit messaging connection request format 26 Figure 9 Open explicit messaging connection response format 28 Figure 10 Close connection request format . 30 Figure 11 Close connection response format 30 Figure 12 Non-fragmented explicit request message format, values 0 3 32 Figure 13 Non-fr
38、agmented explicit request message format, value 4 . 33 Figure 14 Non-fragmented success response message format 33 Figure 15 Error response message . 34 Figure 16 Data field of an I/O message . 34 Figure 17 Format of DeviceNet fragmentation protocol 35 Figure 18 I/O message fragment format 36 Figure
39、 19 Explicit message fragment format . 36 Figure 20 Acknowledgement message format . 38 Figure 21 Establishing the offline ownership . 40 Figure 22 Multicast nature of the offline ownership . 41 Figure 23 Offline ownership request message. 42 IEC 62026-3:2014 IEC 2014 5 Figure 24 Offline ownership r
40、esponse message protocol . 42 Figure 25 Communication faulted request message Multicast protocol 43 Figure 26 Communication faulted request message Point-to-point protocol . 44 Figure 27 Identify communication faulted request message Multicast protocol 45 Figure 28 Communication faulted identify res
41、ponse message 46 Figure 29 Identify communication faulted request message Point-to-point protocol . 46 Figure 30 Who communication faulted request message . 47 Figure 31 Who response message 48 Figure 32 Change MAC ID communication faulted request message . 48 Figure 33 Device heartbeat message 49 F
42、igure 34 Device shutdown message . 51 Figure 35 Duplicate MAC ID check CAN identifier field 52 Figure 36 Duplicate MAC ID check message data field format . 52 Figure 37 Link access state transition diagram . 56 Figure 38 Allocation choice byte contents . 61 Figure 39 Allocate_master/slave_connection
43、_set request message . 62 Figure 40 Success response to allocate_master/slave_connection_set request . 63 Figure 41 Parent explicit messaging connection logic . 65 Figure 42 Release choice byte contents . 66 Figure 43 Release_master/slave_connection set request message . 66 Figure 44 Success respons
44、e to release_master/slave_connection_set request 67 Figure 45 Predefined master/slave I/O connection state transition diagram . 69 Figure 46 Predefined master/slave explicit messaging connection state transition diagram 71 Figure 47 Physical layer block diagram . 79 Figure 48 Device containing a non
45、-isolated physical layer . 82 Figure 49 Device containing an isolated physical layer 83 Figure 50 DeviceNet medium topology . 84 Figure 51 Thick cable: physical configuration 91 Figure 52 Thick cable: current available on the DeviceNet power bus 91 Figure 53 Thin cable: physical configuration . 94 F
46、igure 54 Thin cable: current available on the DeviceNet power bus . 94 Figure 55 Flat cable: physical configuration 97 Figure 56 Flat cable: current available on the DeviceNet power bus 97 Figure 57 Open connector pinout . 101 Figure 58 Open connector geometry . 101 Figure 59 Mini connector pinout .
47、 103 Figure 60 Micro connector pinout . 104 Figure 61 Flat trunk connector layout Part 1 106 Figure 62 Flat trunk connector layout Part 2 107 Figure 63 Power supply rise time test circuit . 112 Figure 64 Current consumption test circuit 113 Figure 65 Power ON test circuit 114 6 IEC 62026-3:2014 IEC
48、2014 Figure 66 Test circuit for reversal of V+ and V and also V interruption . 114 Figure 67 Differential impedance test circuit . 115 Figure 68 Transmit level test setup . 116 Figure 69 Transmit levels . 116 Figure 70 Timing test setup 117 Figure 71 Timing 117 Figure 72 CDI test configuration . 118 Figure 73 Test circuit for logical tests . 120 Table 1 Message body format values 27 Table 2 Group select values . 27 Table 3 Source message ID in open explicit messaging connection request 28 Table 4 Destination message ID in open explicit messaging connection response . 29 Tab
