1、 IEC 62137-4 Edition 1.0 2014-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices Technique dassemblage des composants lectroniques Partie 4: Mthodes dessais dendurance des joi
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20、NTERNATIONALE Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices Technique dassemblage des composants lectroniques Partie 4: Mthodes dessais dendurance des joints brass des composants pour montage en surface botiers de typ
21、e matriciel INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE X ICS 31.190 PRICE CODE CODE PRIX ISBN 978-2-8322-1873-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make
22、sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 62137-4:2014 IEC 2014 CONTENTS FOREWORD . 6 1 Scope 8 2 Normative references 8 3 Terms definitions and abbrevia
23、tions 9 3.1 Terms and definitions 9 3.2 Abbreviations 9 4 General . 9 5 Test apparatus and materials 10 5.1 Specimen 10 5.2 Reflow soldering equipment 10 5.3 Temperature cycling chamber . 10 5.4 Electrical resistance recorder 10 5.5 Test substrate . 10 5.6 Solder paste . 11 6 Specimen preparation 11
24、 7 Temperature cycling test . 13 7.1 Pre-conditioning 13 7.2 Initial measurement 13 7.3 Test procedure 13 7.4 End of test criteria. 15 7.5 Recovery 15 7.6 Final measurement . 15 8 Temperature cycling life 15 9 Items to be specified in the relevant product specification . 15 (informative) Acceleratio
25、n of the temperature cycling test for solder joints . 17 Annex A A.1 General . 17 A.2 Acceleration of the temperature cycling test for an Sn-Pb solder joint . 17 A.3 Temperature cycling life prediction method for an Sn-Ag-Cu solder joint . 18 A.4 Factor that affects the temperature cycling life of t
26、he solder joint 22 (informative) Electrical continuity test for solder joints of the package 23 Annex B B.1 General . 23 B.2 Package and daisy chain circuit 23 B.3 Mounting condition and materials 23 B.4 Test method 23 B.5 Temperature cycling test using the continuous electric resistance monitoring
27、system 23 (informative) Reflow solderability test method for package and test substrate Annex C land 25 C.1 General . 25 C.2 Test equipment . 25 C.2.1 Test substrate 25 C.2.2 Pre-conditioning oven 25 C.2.3 Solder paste 25 C.2.4 Metal mask for screen printing . 25 C.2.5 Screen printing equipment . 25
28、 IEC 62137-4:2014 IEC 2014 3 C.2.6 Package mounting equipment 25 C.2.7 Reflow soldering equipment . 25 C.2.8 X-ray inspection equipment . 26 C.3 Standard mounting process 26 C.3.1 Initial measurement . 26 C.3.2 Pre-conditioning 26 C.3.3 Package mounting on test substrate 26 C.3.4 Recovery . 27 C.3.5
29、 Final measurement 27 C.4 Examples of faulty soldering of area array type packages . 27 C.4.1 Repelled solder by contamination on the ball surface of the BGA package . 27 C.4.2 Defective solder ball wetting caused by a crack in the package . 27 C.5 Items to be given in the product specification 28 (
30、informative) Test substrate design guideline . 29 Annex D D.1 General . 29 D.2 Design standard 29 D.2.1 General . 29 D.2.2 Classification of substrate specifications 29 D.2.3 Material of the test substrate . 31 D.2.4 Configuration of layers of the test substrate . 31 D.2.5 Land shape of test substra
31、te 31 D.2.6 Land dimensions of the test substrate 31 D.3 Items to be given in the product specification 32 (informative) Heat resistance to reflow soldering for test substrate 33 Annex E E.1 General . 33 E.2 Test apparatus 33 E.2.1 Pre-conditioning oven 33 E.2.2 Reflow soldering equipment . 33 E.3 T
32、est procedure 33 E.3.1 General . 33 E.3.2 Pre-conditioning 33 E.3.3 Initial measurement . 33 E.3.4 Moistening process (1) 34 E.3.5 Reflow heating (1) . 34 E.3.6 Moistening process (2) 34 E.3.7 Reflow heating process (2) 34 E.3.8 Final measurement 34 E.4 Items to be given in the product specification
33、 34 (informative) Pull strength measurement method for the test substrate land 35 Annex F F.1 General . 35 F.2 Test apparatus and materials 35 F.2.1 Pull strength measuring equipment 35 F.2.2 Reflow soldering equipment . 35 F.2.3 Test substrate 35 F.2.4 Solder ball . 35 F.2.5 Solder paste 35 F.2.6 F
34、lux . 35 F.3 Measurement procedure . 36 4 IEC 62137-4:2014 IEC 2014 F.3.1 Pre-conditioning 36 F.3.2 Solder paste printing 36 F.3.3 Solder ball placement 36 F.3.4 Reflow heating process . 36 F.3.5 Pull strength measurement 36 F.3.6 Final measurement 37 F.4 Items to be given in the product specificati
35、on 37 (informative) Standard mounting process for the packages 38 Annex G G.1 General . 38 G.2 Test apparatus and materials 38 G.2.1 Test substrate 38 G.2.2 Solder paste 38 G.2.3 Metal mask for screen printing . 38 G.2.4 Screen printing equipment . 38 G.2.5 Package mounting equipment 38 G.2.6 Reflow
36、 soldering equipment . 38 G.3 Standard mounting process 39 G.3.1 Initial measurement . 39 G.3.2 Solder paste printing 39 G.3.3 Package mounting . 39 G.3.4 Reflow heating process . 39 G.3.5 Recovery . 40 G.3.6 Final measurement 40 G.4 Items to be given in the product specification 40 (informative) Me
37、chanical stresses to the packages 41 Annex H H.1 General . 41 H.2 Mechanical stresses . 41 Bibliography 42 Figure 1 Region for evaluation of the endurance test . 10 Figure 2 Typical reflow soldering profile for Sn63Pb37 solder alloy 12 Figure 3 Typical reflow soldering profile for Sn96,5Ag3Cu,5 sold
38、er alloy 13 Figure 4 Test conditions of temperature cycling test. 14 Figure A.1 FBGA package device and FEA model for calculation of acceleration factors AF . 20 Figure A.2 Example of acceleration factors AF with an FBGA package device using Sn96,5Ag3Cu,5 solder alloy 21 Figure A.3 Fatigue character
39、istics of Sn96,5Ag3Cu,5 an alloy micro solder joint (N f= 20 % load drop from initial load) . 22 Figure B.1 Example of a test circuit for the electrical continuity test of a solder joint . 23 Figure B.2 Measurement example of continuously monitored resistance in the temperature cycling test 24 Figur
40、e C.1 Temperature measurement of specimen using thermocouples 26 Figure C.2 Repelled solder caused by contamination on the solder ball surface 27 Figure C.3 Defective soldering as a result of a solder ball drop 28 Figure D.1 Standard land shapes of the test substrate . 31 Figure F.1 Measuring method
41、s for pull strength . 36 IEC 62137-4:2014 IEC 2014 5 Figure G.1 Example of printed conditions of solder paste . 39 Figure G.2 Temperature measurement of the specimen using thermocouples 40 Table 1 Test conditions of temperature cycling test 14 Table A.1 Example of test results of the acceleration fa
42、ctor (Sn63Pb37 solder alloy) 18 Table A.2 Example test results of the acceleration factor (Sn96,5Ag3Cu,5 solder alloy) 20 Table A.3 Material constant and inelastic strain range calculated by FEA for FBGA package devices as shown in Figure A.1 (Sn96,5Ag3Cu,5 solder alloy) 21 Table D.1 Types classific
43、ation of the test substrate 30 Table D.2 Standard layers configuration of test substrates 31 Table G.1 Stencil design standard for packages 38 Table H.1 Mechanical stresses to mounted area array type packages 41 6 IEC 62137-4:2014 IEC 2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTRONICS ASSE
44、MBLY TECHNOLOGY Part 4: Endurance test methods for solder joint of area array type package surface mount devices FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committee
45、s). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available
46、Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organiz
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49、al Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum exten
