1、 IEC 62421 Edition 1.0 2007-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronics assembly technology Electronic modules Techniques dassemblage des composants lectroniques Modules lectroniques IEC 62421:2007-08(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerla
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19、vez des questions contactez-nous: csciec.ch. IEC 62421 Edition 1.0 2007-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronics assembly technology Electronic modules Techniques dassemblage des composants lectroniques Modules lectroniques INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECT
20、ROTECHNIQUE INTERNATIONALE P ICS 31.190 PRICE CODE CODE PRIX ISBN 978-2-8322-1466-4 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor
21、. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 62421:2007 IEC 2007 CONTENTS FOREWORD . 4 1 Scope and object 6 2 Normative references . 6 3 Terms and definitions . 7 4 Business model and interface between supplier and user . 7 4.1 Business mod
22、el (see Figure 1 and Figure 2) 7 4.1.1 General . 7 4.1.2 E-type business model 8 4.1.3 M-type business model 9 4.1.4 F-type business model . 9 4.2 S-U interface (see Figure 1) 9 4.2.1 S-U interface 1 9 4.2.2 S-U interface2 . 9 4.2.3 S-U interface3 . 9 4.3 Standardization areas . 9 5 Preferred rating
23、s 10 5.1 General . 10 5.2 Preferred operating temperature range 11 5.3 Preferred rated voltage 11 6 Tests and measuring methods 11 6.1 Standard atmospheric conditions . 11 6.1.1 Standard atmospheric conditions for testing 11 6.1.2 Referee conditions 11 6.1.3 Reference conditions . 12 6.2 Electrical
24、performance tests 12 6.2.1 General . 12 6.2.2 Protection of electronic modules and test equipment . 12 6.2.3 Accuracy of measurement . 12 6.3 Mechanical performance tests . 13 6.3.1 Robustness of terminations and integral mounting devices 13 6.3.2 Resistance to soldering heat . 14 6.3.3 Solderabilit
25、y 14 6.3.4 Shock 14 6.3.5 Vibration (sinusoidal) . 14 6.3.6 Resistance to solvents . 15 6.4 Climatic performance tests 15 6.4.1 Dry heat 15 6.4.2 Cold 15 6.4.3 Damp heat, steady state 16 6.4.4 Change of temperature 16 IEC 62421:2007 IEC 2007 3 Figure 1 S-U interfaces in each business model . 8 Figur
26、e 2 Standardization areas in M-type and F-type business models 10 Table 1 Preferred temperatures to be selected for temperature ranges (C) . 11 Table 2 Referee conditions 12 Table 3 Application 14 4 IEC 62421:2007 IEC 2007 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTRONICS ASSEMBLY TECHNOLOGY E
27、LECTRONIC MODULES FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning stan
28、dardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparat
29、ion is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely wit
30、h the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subj
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33、ossible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any eq
34、uipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and
35、 IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) At
36、tention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights.
37、 IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62421 has been prepared by IEC technical committee 91: Electronics assembly technology. This bilingual version (2014-03) corresponds to the monolingual English version, published in 2007-08.
38、The text of this standard is based on the following documents: FDIS Report on voting 91/689/FDIS 91/722/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon.
39、 IEC 62421:2007 IEC 2007 5 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the d
40、ata related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 6 IEC 62421:2007 IEC 2007 ELECTRONICS ASSEMBLY TECHNOLOGY ELECTRONIC MODULES 1 Scope and object This International Standard provides a generic standard of
41、 electronic modules on which their sectional standards are based. This standard provides a definition, business model, interface between the trading partners, and related areas of standardization of electronic modules. In addition a generic set of test method is provided. 2 Normative references The
42、following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068 (all parts), Environmental testing IEC 6006
43、8-1:1988, Environmental testing Part 1: General and guidance IEC 60068-2-1: Environmental Testing Part 2-1: Tests Test A: Cold IEC 60068-2-2: Environmental testing Part 2-2: Tests Tests B: Dry heat IEC 60068-2-6: Environmental testing Part 2-6: Tests Test Fc: Vibration (sinusoidal) IEC 60068-2-14: E
44、nvironmental testing Part 2-14: Tests Test N: Change of temperature IEC 60068-2-20: Environmental testing Part 2-20: Tests Test T: Soldering IEC 60068-2-21: Environmental testing Part 2-21: Tests Test U: Robustness of terminations and integral mounting devices IEC 60068-2-27: Environmental testing P
45、art 2-27: Tests Test Ea and guidance: Shock IEC 60068-2-45: Environmental testing Part 2-45: Tests Test XA and guidance: Immersion in cleaning solvents IEC 60068-2-58: Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to so
46、ldering heat of surface mounting devices (SMD) IEC 60068-2-78: Environmental testing Part 2-78: Tests Test Cab: Damp heat, steady state ISO 3: Preferred numbers Series of preferred numbers IEC 62421:2007 IEC 2007 7 3 Terms and definitions For the purposes of this document, the terms and definitions
47、given in the IEC 60068 series, as well as the following, apply. 3.1 electronic module functional block which contains individual electronic elements and /or electronic packages, to be used in a next level assembly NOTE An individual module having an application-specific function, including electroni
48、c, optoelectronic, mechanical or other elements. The module typically provides protection of its elements and packages to assure the required level of reliability. Electronic modules may be categorized by signal interface, for example: wired module: a module which has only electrical interfaces (maj
49、ority of present day modules) wireless module: a module which has a wireless interface opto-electronic module: a module which has an optoelectronic interface sensor module: a module which can input physical information actuator module: a module which could output physical information 3.2 coplanarity distance in height between the lowest and highest leads or termin
