1、 IEC 62572-3 Edition 3.0 2016-02 INTERNATIONAL STANDARD Fibre optic active components and devices Reliability standards Part 3: Laser modules used for telecommunication IEC 62572-3:2016-02(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2016 IEC, Geneva, Switzerland All rights reserved. Unless
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10、ec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. IEC 62572-3 Edition 3.0 2016-02 INTERNATIONAL STANDARD Fibre optic active components and devices Reliability standards Part 3: Laser modules used for
11、telecommunication INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.260; 33.180 ISBN 978-2-8322-3186-9 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. 2 IEC 62572-3:2016 IEC 2016 CONTENTS FOREW
12、ORD . 3 INTRODUCTION . 5 1 Scope 6 2 Normative references. 6 3 Terms, definitions, symbols and abbreviations 7 3.1 Terms and definitions 7 3.2 Symbols and abbreviations 8 4 Laser reliability and quality assurance procedure . 8 4.1 Demonstration of product quality . 8 4.2 Testing responsibilities 9 4
13、.2.1 General . 9 4.2.2 Recommendation applicable to laser customer/system supplier . 9 4.2.3 Recommendation applicable to system operator . 9 4.3 Quality improvement programmes (QIPs) . 9 5 Tests . 9 5.1 General . 9 5.2 Structural similarity . 10 5.3 Burn-in and screening (when applicable in the spe
14、cification) 10 6 Activities . 14 6.1 Analysis of reliability results 14 6.2 Technical visits to LMMs . 14 6.3 Design/process changes . 15 6.4 Deliveries 15 6.5 Supplier documentation . 15 Annex A (informative) Guidance on testing in Table 1 and Table 2 16 A.1 Laser module life tests containing therm
15、oelectric coolers (Table 1, test 1.1) . 16 A.2 Laser module life tests for uncooled modules (Table 1, test 1.2) . 16 A.3 Laser diode life tests on submounts (Table 1, test 1.3) . 17 A.4 Monitor photodiode life tests (Table 1, test 1.4) 17 A.5 Temperature cycling and thermal shock (Table 1, test 3 an
16、d Table 2, test 2) 18 A.6 Sealing/hermeticity (Table 1, test 4 and Table 2, test 3) . 18 A.7 Shock and vibration (Table 1 , test 5 and Table 2, test 4) . 18 A.8 High-temperature storage (Table 1, test 6 and Table 2, test 5) . 18 A.9 Electrostatic discharge sensitivity (ESD) (Table 1, test 7and Table
17、 2, test 6) 19 A.10 Residual gas analysis (RGA) (Table 1, test 8 and, Table 2, test 7) . 19 Bibliography . 20 Table 1 Initial qualification (1 of 3) 10 Table 2 Maintenance of qualification (1 of 2) . 13 Table 3 Performance for laser module reliability parameters . 14 Table A.1 Recommended life test
18、conditions for laser modules containing Peltier coolers . 16 Table A.2 Recommended life test conditions for uncooled laser modules 17 Table A.3 Recommended laser diode life test conditions . 17 Table A.4 Recommended photodiode life test conditions . 18 IEC 62572-3:2016 IEC 2016 3 INTERNATIONAL ELECT
19、ROTECHNICAL COMMISSION _ FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES RELIABILITY STANDARDS Part 3: Laser modules used for telecommunication FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committee
20、s (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Rep
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29、Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such paten
30、t rights. International Standard IEC 62572-3 has been prepared by subcommittee 86C: Fibre optic systems and active devices of IEC technical committee 86: Fibre optics. This third edition cancels and replaces the second edition published in 2014. This third edition constitutes a technical revision in
31、 which errors in Table 1 and Table 2 have been corrected. The text of this standard is based on the following documents: CDV Report on voting 86C/1302/CDV 86C/1345/RVC Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table.
32、4 IEC 62572-3:2016 IEC 2016 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 62572 series, published under the general title Fibre optic active components and devices Reliability standards, can be found on the IEC website. The commit
33、tee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition
34、, or amended. A bilingual version of this publication may be issued at a later date. IEC 62572-3:2016 IEC 2016 5 INTRODUCTION The laser modules covered by this International Standard are purchased by system suppliers (SS) to be inserted in equipment, which in turn are supplied/sold to a system opera
35、tor (SO) or a network operator (see definitions in Clause 3). For the system operator to act as an informed buyer, he/she should have knowledge of the potential risks posed by the use of critical components. Optoelectronic component technology is continuing to develop. Consequently, during product d
36、evelopment phases, many failure mechanisms in laser modules have been identified. These failure mechanisms, if undetected, could result in very short laser lifetime in system use. 6 IEC 62572-3:2016 IEC 2016 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES RELIABILITY STANDARDS Part 3: Laser modules used f
37、or telecommunication 1 Scope This part of IEC 62572 deals with reliability assessment of laser modules used for telecommunication. The aim of this standard is to establish a standard method of assessing the reliability of laser modules in order to minimize risks and to promote product development an
38、d reliability; to establish means by which the distribution of failures with time can be determined. This should enable the determination of equipment failure rates for specified end of life criteria. In addition, guidance is given in IEC TR 62572-2. 2 Normative references The following documents, i
39、n whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-1, Environmental test
40、ing Part 2-1: Tests Test A: Cold IEC 60068-2-14, Environmental testing Part 2-14: Tests Test N: Change of temperature IEC 60749-6, Semiconductor devices Mechanical and climatic test methods Part 6: Storage at high temperature IEC 60749-8, Semiconductor devices Mechanical and climatic test methods Pa
41、rt 8: Sealing IEC 60749-10, Semiconductor devices Mechanical and climatic test methods Part 10: Mechanical shock IEC 60749-11, Semiconductor devices Mechanical and climatic test methods Part 11: Rapid change of temperature Two-fluid-bath method IEC 60749-12, Semiconductor devices Mechanical and clim
42、atic test methods Part 12: Vibration, variable frequency IEC 60749-25, Semiconductor devices Mechanical and climatic test methods Part 25: Temperature cycling IEC 60749-26, Semiconductor devices Mechanical and climatic test methods Part 26: Electrostatic discharge (ESD) sensitivity testing Human bod
43、y model (HBM) IEC 62572-3:2016 IEC 2016 7 IEC TR 62572-2, Fibre optic active components and devices Reliability standards Part 2: Laser module degradation MIL-STD-883, Test method standard Microcircuits 3 Terms, definitions, symbols and abbreviations 3.1 Terms and definitions For the purposes of thi
44、s document the following definitions apply. 3.1.1 laser module packaged assembly containing a laser diode with/without photodiode Note 1 to entry: The module may also include a cooler and temperature sensor to enable laser temperature to be controlled and monitored. The optical output is normally vi
45、a an optical fibre pigtail. 3.1.2 submount substrate upon which a laser diode or photodiode may be mounted for assembly into the laser module Note 1 to entry: Components on submounts are also subject to qualification testing. 3.1.3 laser module manufacturer LMM manufacturer of laser modules who prov
46、ides devices meeting the requirements of the relevant detail specification (DS) and the customers reliability requirements 3.1.4 network operator NO organization which operates a telecommunications network 3.1.5 system supplier SS manufacturer of telecommunications/data transmission equipment contai
47、ning optoelectronic semiconductor lasers Note 1 to entry: The system supplier can be a laser module customer. 3.1.6 system operator SO network operator of telecommunications/data transmission equipment containing opto- electronic semiconductor lasers in the transmission path Note 1 to entry: The sys
48、tem may also be part of other more extensive systems, for example telecommunications, rail, road vehicles, aerospace or weapons. 3.1.7 capability qualifying components CQC components selected to represent critical stages of the process and limiting or boundary characteristics of mechanical and elect
49、ro-optic design 8 IEC 62572-3:2016 IEC 2016 Note 1 to entry: Such components should aid the identification of end product failure mechanisms to enable the determination of activation energies. 3.2 Symbols and abbreviations T Aminimum storage temperature T Bmaximum storage temperature T cmodule case temperature T ssubmount temperature T s nomrecommended submount temperature T op minmodule minimum operating temperature T op maxmodule maxim
