1、 IEC 60191-4 Edition 3.0 2013-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages Normalisation mcanique des dispositifs semiconducteurs Partie 4:
2、Systme de codification et classification en formes des structures des botiers pour dispositifs semiconducteurs IEC60191-4:2013 colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may
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16、res sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60191-4 Edition 3.0 2013-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor
17、 device packages Normalisation mcanique des dispositifs semiconducteurs Partie 4: Systme de codification et classification en formes des structures des botiers pour dispositifs semiconducteurs INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE T ICS 31.080 PRICE COD
18、E CODE PRIX ISBN 978-2-8322-1155-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez
19、obtenu cette publication via un distributeur agr. colourinside 2 60191-4 IEC:2013 CONTENTS FOREWORD . 3 1 Scope . 5 2 Coding system of package outlines for semiconductor devices 5 3 Classification into forms of package outlines for semiconductor devices 5 4 Coding system for semiconductor-device pac
20、kages . 6 4.1 General . 6 4.2 New descriptive codes . 6 4.3 Descriptive designators 6 4.3.1 General remarks 6 4.3.2 Minimum descriptive designator . 6 4.3.3 Terminal-position prefix 8 4.3.4 Package-body-material prefix . 8 4.3.5 Package-specific feature prefix 9 4.3.6 Lead-form and terminal-count su
21、ffixes . 9 4.3.7 Detailed information field . 11 5 Coding system of package-outline styles . 12 Annex A (informative) Examples of descriptive coding system application . 15 Annex B (informative) Derivation and application of the descriptive coding system Common package names 22 Figure 1 Descriptive
22、coding for semiconductor device packages . 7 Figure 2 Relationship of codes to profile . 10 Figure A.1 Typical package styles and descriptive coding system (1 of 4) . 17 Figure A.2 Examples of lead forms (or terminal shapes) . 21 Figure B.1 Descriptive coding system for common name of semiconductor-
23、device package 22 Table 1 Package-outline-style codes. 8 Table 2 Terminal-position prefixes 9 Table 3 Prefixes for predominant package-body material 10 Table 4 Prefixes for package-specific features 10 Table 5 Suffixes for lead form (or terminal shape) . 12 Table A.1 Descriptive coding system applic
24、ation . 16 Table B.1 Basic package code and names 23 Table B.2 Common package name and descriptive code examples . 24 60191-4 IEC:2013 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 4: Coding system and classification into forms of package outl
25、ines for semiconductor device packages FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all ques
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28、aborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion
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32、 bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attac
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34、 and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication
35、 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-4 has been prepared by subcommittee 47D: Semiconductor d
36、evices packaging, of IEC technical committee 47: Semiconductor devices. This third edition cancels and replaces the second edition published in 1999, Amendment 1:2001 and Amendment 2:2002.This edition constitutes a technical revision. This edition includes the following significant technical changes
37、 with respect to the previous edition: a) Material code “S“ is added to indicate a silicon based package. b) Description of “WL“ is added to be used for general use. 4 60191-4 IEC:2013 The text of this standard is based on the following documents: FDIS Report on voting 47D/837/FDIS 47D/848/RVD Full
38、information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 60191 series, published under the general title Mecha
39、nical standardization of semiconductor devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication.
40、 At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users s
41、hould therefore print this document using a colour printer. 60191-4 IEC:2013 5 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 4: Coding system and classification into forms of package outlines for semiconductor device packages 1 Scope This part of IEC 60191 specifies a method for the desig
42、nation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied
43、control for assuring package interchangeability. 2 Coding system of package outlines for semiconductor devices The following coding system will be used in the publications concerning mechanical standardization: first: a three-digit serial number (000 to 999); second: a single reference letter indica
44、ting the form as shown in Table 1; third: a two-digit serial number (00 to 99) to indicate a variant of an outline drawing. The use of prefix P to indicate a provisional drawing remains unchanged. Examples 101A00 050G13 P 101F01 3 Classification into forms of package outlines for semiconductor devic
45、es The package outline drawings for semiconductor devices are classified into forms according to the following scheme: form A: single-ended form B: heat-sink-mounted form C: stud-mounted form D: axial-leaded form E: surface-mounted form F: single-ended, heat-sink-mounted form G: dual and quad in-lin
46、e form H: axial lead-less. 6 60191-4 IEC:2013 4 Coding system for semiconductor-device packages 4.1 General The standard coding system is a method for identifying the physical features of an electronic device package family. The system is predicated upon a minimum two-character designator, which ind
47、icates the package outline style. This designator can be extended, through the use of optional, user-selected fields, to provide additional package information such as terminal position and count, terminal form, package shape, and predominant body material. 4.2 New descriptive codes If a new package
48、 that does not conform to one of the designated field character codes is being proposed, a new code may be recommended for standardization. 4.3 Descriptive designators 4.3.1 General remarks The package outline style code is the only compulsory field within this descriptive designation system. Additi
49、onal information may be provided using optional prefixes and suffixes described by the system. In general, these fields are independent of one another. Unless otherwise indicated herein, the users of this system may pick and choose which of these fields they wish to implement for their specific application (see Figure 1). The descriptive designator may be extended with additional informa
