1、 IEC 60539-2 Edition 1.1 2010-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Directly heated negative temperature coefficient thermistors Part 2: Sectional specification Surface mount negative temperature coefficient thermistors Thermistances coefficient de temprature ngatif chauffage direct Partie
2、2: Spcification intermdiaire Thermistances coefficient de temprature ngatif pour montage en surface IEC 60539-2:2003+A1:2010 colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2010 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may
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17、irectly heated negative temperature coefficient thermistors Part 2: Sectional specification Surface mount negative temperature coefficient thermistors Thermistances coefficient de temprature ngatif chauffage direct Partie 2: Spcification intermdiaire Thermistances coefficient de temprature ngatif po
18、ur montage en surface INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE CE ICS 31.040.30 PRICE CODE CODE PRIX ISBN 978-2-88912-248-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale
19、colour inside 2 60539-2 IEC:2003+A1:2010 CONTENTS FORE WORD 4 1 General . 6 1.1 Scope . 6 1.2 Normative references . 6 1.3 Information to be given in a detail specification . 7 1.3.1 Outline drawing and dimensions . 7 1.3.2 Mounting 7 1.3.3 Ratings and characteristics 7 1.4 Terminology 7 2 Preferred
20、 ratings and characteristics 7 2.1 Tolerances on rated zero-power resistance . 7 2.2 Climatic categories . 8 3 Quality assessment procedures . 8 3.1 Primary stage of manufacture 8 3.2 Structurally similar components . 8 3.3 Qualification approval procedures 8 3.3.1 The manufacturer shall comply with
21、 3.4 of IEC 60539-1. . 8 3.4 Quality conformance inspection . 8 3.4.1 Qualification approval on the basis of the fixed sample size proce dure . 9 3.5 Quality conformance inspection . 10 3.5.1 Formation of inspection lots . 10 3.5.2 Test schedule . 11 3.5.3 Delayed delivery . 11 3.5.4 Assessment leve
22、l 11 4 Test and measurement procedures . 12 4.1 Mounting . 12 4.2 Drying and recovery . 12 4.2.1 Drying 12 4.2.2 Reco very 12 4.3 Visual examination and check of dimensions. 12 4.3.1 Visual examination 12 4.3.2 Requirements . 12 4.3.3 Marking 14 4.3.4 Dimensions 14 4.4 Electrical tests . 14 4.4.1 Ze
23、ro-power resistance . 14 4.4.2 B-value or resistance ratio 14 4.4.3 Resistance/temperature characteristic . 15 4.5 Thermal tests. 15 4.5.1 Dissipation factor (d) . 15 4.5.2 Thermal time constant by cooling after self-heating (t c ) 15 4.6 Resistance to soldering heat . 15 4.6.1 Initial measurement .
24、 15 4.6.2 Test conditions . 15 4.6.3 Reco very 16 60539-2 IEC:2003+A1:2010 3 4.6.4 Final inspection, measurements and requirements 16 4.7 Solderability 16 4.7.1 Test conditions . 16 4.7.2 Reco very 17 4.7.3 Final inspection, measurements and requirements 17 4.8 Rapid change of temperature 17 4.9 The
25、rmal shock . 18 4.10 Climatic sequence 18 4.10.1 Initial measurements . 18 4.10.2 Dry heat . 18 4.10.3 Damp heat (cyclic), first cycle . 18 4.10.4 Cold . 18 4.10.5 Damp heat (cyclic), remaining cycles 18 4.10.6 Final measurements 19 4.11 Damp heat, steady state . 19 4.12 Endurance . 19 4.12.1 Endura
26、nce at q 3and P max 19 4.12.2 Endurance at upper category temperature . 20 4.13 Shear (adhesion) test . 20 4.14 Substrate bending test 20 4.15 Component solvent resistance . 20 4.16 Solvent resistance of marking 20 Annex A (normative) Guide for the specification and coding of dimensions of surface m
27、ount negative temperature coefficient thermistors 21 Figure 1 Fault: fissure or defect . 13 Figure 2 Fault: crack 13 Figure 3 Separation or delamination 13 Figure 4 Exposed electrodes . 13 Figure 5 Principal faces 14 Figure A.1 Dimensioning of surface mount thermistors 21 Table 1 Upper and lower cat
28、egory temperatures and duration of the damp heat test . 8 Table 2 Fixed sample size test schedule for qualification approval of surface mount negative temperature coefficient thermistors Assessment level EZ 10 Table 3 Lot-by-lot inspection . 11 Table 4 Periodic test 12 Table 5 Number of cycles . 19
29、Table A.1 Dimensions 21 4 60539-2 IEC:2003+A1:2010 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS Part 2: Sectional specification Surface mount negative temperature coefficient thermistors FOREWORD 1) The International Electrotechnical Commis
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37、onformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and m
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39、n or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publicatio
40、n may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. This consolidated version of IEC 60539-2 consists of the first edition (2003) documents 40/1346/FDIS and 40/1368/RVD and its amendment 1 (2010) documents 40/2034/CDV and 40/2051/RV
41、C. It bears the edition number 1.1. The technical content is therefore identical to the base edition and its amendment and has been prepared for user convenience. A vertical line in the margin shows where the base publication has been modified by amendment 1. Additions and deletions are displayed in
42、 red, with deletions being struck through. 60539-2 IEC:2003+A1:2010 5 International Standard IEC 60539-2 has been prepared by IEC technical committee 40: Capacitors and resistors for electronic equipment. This bilingual version, published in 2010-07, corresponds to the English version. The French ve
43、rsion of this standard has not been voted upon. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The committee has decided that the contents of the base publication and its amendments will remain unchanged until the stability date indicated on the IEC web site und
44、er “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are con
45、sidered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 60539-2 IEC:2003+A1:2010 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS Part 2: Sectional specification Surface mount negative temperature coefficien
46、t thermistors 1 General 1.1 Scope This part of IEC 60539 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering st
47、rips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards. 1.2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references,
48、 the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-2:1974, Environmental testing Part 2: Tests Tests B: Dry heat Amendment 1 (1993) Amendment 2 (1994) IEC 60068-2-14:1984, Environmental testing Part 2: Tests Test N: Change of temperature Amendment 1 (1986)
49、 IEC 60068-2-30:1980, Environmental testing Part 2: Tests Test Db and guidance: Damp heat, cyclic (12 + 12-hour cycle) Amendment 1 (1985) IEC 60068-2-58:1999 2004, Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-78: Envi
