1、INTERNATIONAL STANDARD IEC 60748-23-5 QC 165000-5 First edition 2003-10 Semiconductor devices Integrated circuits Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval Dispositifs semiconducteurs Circuits intgrs Partie 23-5: C
2、ircuits intgrs hybrides et structures par films Certification de la ligne de fabrication Procdure dhomologation Reference number IEC 60748-23-5:2003(E)Publication numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series. For example, IEC 34-1 is now ref
3、erred to as IEC 60034-1. Consolidated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the base publication incorporating amendment 1 and the base publication incorporating amendm
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8、 Centre If you have any questions regarding this publication or need further assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 INTERNATIONAL STANDARD IEC 60748-23-5 QC 165000-5 First edition 2003-10 Semiconductor devices Integra
9、ted circuits Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval Dispositifs semiconducteurs Circuits intgrs Partie 23-5: Circuits intgrs hybrides et structures par films Certification de la ligne de fabrication Procdure dho
10、mologation IEC 2003 Copyright - all rights reserved No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission, 3, r
11、ue de Varemb, PO Box 131, CH-1211 Geneva 20, Switzerland Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch V For price, see current catalogue PRICE CODE Commission Electrotechnique Internationale International Electrotechnical Commission 2 60748-23-5 IEC:2003
12、(E) CONTENTS FOREWORD 3 1 Scope 5 2 Normative references. 5 3 Terms and definitions. 5 4 Qualification approval procedures 5 4.1 General 5 4.2 Marking 5 4.3 Validity of release for delivery 6 4.4 Application for qualification approval . 6 4.5 Structural similarity . 6 4.6 Materials, piece-parts and
13、added components. 6 4.7 Initial qualification approval. 6 4.8 Granting of qualification approval 7 4.9 Maintenance of qualification approval 7 4.10 Procedure in the event of a failure in a periodic test 8 4.11 Withdrawal of qualification approval 8 5 Qualification-product assessment level schedules
14、9 6 Blank detail specification.28 6.1 General .28 6.2 FRONT PAGE FOR COMPONENTS ASSESSED BY QUALIFICATION APPROVAL29 6.3 GENERAL DATA30 6.4 Inspection requirements.3160748-23-5 IEC:2003(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES INTEGRATED CIRCUITS Part 23-5: Hybrid integ
15、rated circuits and film structures Manufacturing line certification Procedure for qualification approval FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The
16、object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specific
17、ations (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations l
18、iaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters exp
19、ress, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Commi
20、ttees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC Nation
21、al Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no m
22、arking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, serv
23、ants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publicati
24、on, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility
25、 that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60748-23-5 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Se
26、miconductor devices. The text of this standard is based on the European standard EN 165000-5 and the following documents: FDIS Report on voting 47A/672/FDIS 47A/677/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table.
27、 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 60748-23-5 IEC:2003(E) This standard should be read in conjunction with IEC 60748-23-1. The QC number that appears on the front cover of this publication is the specification number in the IEC Quality Assessment
28、System for Electronic Components (IECQ). The committee has decided that the contents of this publication will remain unchanged until 2006. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended.60748-23-5 IEC:2003(E) 5 SEMICONDUCTOR DEVICES INTEGRATED
29、 CIRCUITS Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval 1 Scope This part of IEC 60748-23 applies to high quality hybrids (with films) incorporating special customer quality and reliability requirements whose quality i
30、s assessed on the basis of Qualification Approval. NOTE 1 Hybrid integrated circuits may be fully or part completed. Part completed devices are those that may be supplied to customers for further processing. NOTE 2 Test methods are selected from IEC 60748-23-1. A blank detail specification (BDS) is
31、included to assist manufacturers and users in the preparation of detail specifications. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition o
32、f the referenced document (including any amendments) applies. IEC 60748-23-1:2002, Semiconductor devices Integrated circuits Part 23-1: Hybrid integrated circuits and film structures Manufacturing line certification Generic specification IEC 61340-5-1:1998, Electrostatics Part 5-1: Protection of ele
33、ctronic devices from electro- static phenomena General requirements QC 001002-3:1998, IEC Quality Assessment System for Electronic Components (IECQ) Rules of Procedure Part 3: Approval procedures 3 Terms and definitions For the purposes of this part of IEC 60748, related documents, preferred ratings
34、 and characteristics, and terminology are given in IEC 60748-23-1. 4 Qualification approval procedures 4.1 General The procedures in QC 001002-3 shall apply. Subclause 6.1 of IEC 60748-23-1 applies with the exceptions given in 4.2 to 4.11 of this standard. 4.2 Marking Clause 5 of IEC 60748-23-1 appl
35、ies. 6 60748-23-5 IEC:2003(E) 4.3 Validity of release for delivery Circuits may be released under qualification approval subject to the following conditions: a) the circuits conform with the requirements of the detail specification; b) the circuits, their added components, piece parts and materials
36、are traceable to original manufacturers lot numbers. 4.4 Application for qualification approval Application shall be made to the NSI in accordance with QC 001002-3. In addition, the manufacturer shall: a) conform with the eligibility requirements of 6.1.1 of IEC 60748-23-1; b) conform with the relev
37、ant detail specification based on the blank detail specification (see Clause 6) and the Qualification product assessment level schedules (Q-PALS) (see Clause 5) contained in this standard. 4.5 Structural similarity For the purposes of assessment testing, structural similarity can be used if the test
38、ing of one representative type of circuit gives at least the same quality level for the rest of the types which are grouped together. The designated management representative (DMR) shall declare to the satisfaction of the NSI the method of operating the structural similarity plan within the manufact
39、uring facilities and agree the representative type(s) from each structurally similar group. For the qualification approval procedure, two or more circuits can be considered structurally similar, and thus the required numbers of specimens for a test shall be selected from the combined production, whe
40、n they have the same function type, use the same design rules, materials, processes and methods (for example a range of T-cell thick film attenuators using the same line of inks; or thin film D/A convertors using the same film material and same added components from the same supplier). Only those te
41、sts not specifically excluded in the Q-PALS may be considered for structural similarity. 4.6 Materials, piece-parts and added components Subclause 6.1.3 of IEC 60748-23-1 applies. 4.7 Initial qualification approval The schedules to be used for qualification approval testing on the basis of lot-by-lo
42、t and periodic testing are given in the Q-PALS tables contained in this standard. The procedure for initial qualification approval is given below. The relevant Q-PALS for initial qualification approval, release of products (lot-by-lot tests) and maintenance of qualification approval (periodic tests)
43、 collectively prescribe the minimum test programme on completed circuits. 1) Sampling The sample shall be representative of the range of circuits for which approval is sought (see 6.4.3 of IEC 60748-23-1). The size of the sample and the criterion of acceptability depend on the relevant Q-PALS which
44、it is intended to release against.60748-23-5 IEC:2003(E) 7 2) Tests The complete series of tests specified in the relevant Q-PALS contained in this standard is required for the approval of circuits covered by one detail specification. The tests shall be carried out in the order given. Test and measu
45、rement procedures are given in Clause 7 of IEC 60748-23-1. Samples used for Group B, C and D tests shall have passed Group A tests. One failure is counted when a circuit has not satisfied the whole, or a part, of the tests of a group. Approval is granted when the number of failures does not exceed t
46、he specified number of permissible failures for each group or sub-group. 4.8 Granting of qualification approval The manufacturer shall submit a report to the NSI covering the qualification approval testing in accordance with the requirements of 4.7 of this standard, and with QC 001002-3. Qualificati
47、on approval shall be granted when the requirements of this standard have been satisfied. A qualification approval certificate will be issued by the responsible national authority in accordance with QC 001002-3. 4.9 Maintenance of qualification approval 4.9.1 General Qualification approval is maintai
48、ned after successful completion of the procedures and requirements of quality conformance inspection (see 6.4.2 of IEC 60748-23-1) with the following details: 1) Design evaluation tests In addition to the initial delivery lot, design evaluation tests shall be carried out at the periodicity specified
49、 in the detail specification. 2) Detail specification The detail specification shall conform to the requirements of the BDS and Q-PALS in this standard. The manufacturer shall also have maintained continuous production, for example: a) no change has occurred in the place of manufacture and final test; b) no break exceeding two years has occurred in the manufacturers declared periodic test sched
