IEC 60796-3-1990 Microprocessor system BUS I 8-bit and 16-bit data part 3 mechanical and pin descriptions for the eurocard configuration with pin and socket (in.pdf

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1、IEC 796 PT*3 90 W 48Li487L 0099b88 3 m NORME CE1 INTERNATIONALE IEC I NTE R NATI O N AL 796-3 Premire dition First edition 1990-02 STANDARD BUS I systme microprocesseurs, donnes: 8 bits et 16 bits Troisime partie: Description mcanique et brochage pour la configuration Eurocard ayant des connecteurs

2、rapports Microprocessor system BUS I, 8-bit and 16-bit data Part 3: Mechanical and pin descriptions for the Eurocard configuration with pin and socket (indirect) connectors Numro de rfrence Reference number CEI/IEC 796-3: 1990 Rvision de la prsente publication Le contenu technique des publications d

3、e la CE1 est constam- ment revu par ia Commission afin dassurer quil reflte bien ltat actuel de ia technique. Les renseignements relatifs ce travail de rvision, ltablis- sement des ditions rvises et aux mises jour peuvent tre obtenus auprs des Comits nationaux de la CE I et en consultant les documen

4、ts ci-dessous: Annuaire de la CE1 Bulletin de la CE I Catalogue des publications de la CE1 Publi annuellement Terminologie En ce qui concerne la terminologie gnrale, le lecteur se repor- tera la Publication 50 de la CE I: Vocabulaire Electrotechnique International (VEI), qui est tablie sous forme de

5、 chapitres spars traitant chacun dun sujet dfini, lIndex gnral tant publi spa- rment. Des dtails complets sur le VE1 peuvent tre obtenus sur demande. Les termes et dfinitions figurant dans la prsente publication ont t soit repris du VEI, soit spcifiquement approuvs aux fins de cette publication. Sym

6、boles graphiques et littraux Pour les symboles graphiques, symboles littraux et signes dusage gnral approuvs par la CEI, le lecteur consultera: - la Publication 27 de la CEI: Symboles littraux utiliser en - la Publication 617 de la CEI: Symboles graphiques pour Les symboles et signes contenus dans l

7、a prsente publication ont t soit repris des Publications 27 ou 617 de la CEI, soit spcifi- quement approuvs aux fins de cette publication. lectrotechnique ; schmas, Publications de la CE1 tablies par le mme Comit dEtudes Lattention du lecteur est attire sur le deuxime feuillet de la couverture, qui

8、numre les publications de la CE I prpares par le Comit dEtudes qui a tabli la prsente publication. Revision of this publication The technical content of I EC publications is kept under con- stant review by the I EC, thus ensuring that the content reflects current technology. Information on the work

9、of revision, the issue of revised edi- tions and amendment sheets may be obtained from I EC National Committees and from the following I EC sources: I EC Bulletin IEC Yearbook Catalogue of I EC Publications Published yearly Terminology For general terminology, readers are referred to I EC Publi- cat

10、ion 50: International Electrotechnical Vocabulary (IEV), which is issued in the form of separate chapters each dealing with a specific field, the General Index being published as a separate booklet. Full details of the IEV will be supplied on request. The terms and definitions contained in the prese

11、nt publication have either been taken from the IEV or have been specifically approved for the purpose of this publication. Graphical and letter symbols For graphical symbols, and letter symbols and signs approved by the I EC for general use, readers are referred to: - I EC Publication 27 : Letter sy

12、mbols to be used in electrical - IEC Publication 617: Graphical symbols for diagrams. technology; The symbols and signs contained in the present publication have either been taken from I EC Publications 27 or 617, or have been specifically approved for the purpose of this publication. I E C publicat

13、ions prepared by the same Technical Committee The attention of readers is drawn to the back cover, which lists I EC publications issued by the Technical Committee which has prepared the present publication. - IEC 796 PT*3 90 m 4844891 0047b70 L NORME INTERNATIONALE I NTE R NATI O N AL STANDARD CE1 I

14、EC 796-3 Premire dition First edition 1990-02 BUS I systme microprocesseurs, . donnes: 8 bits et 16 bits Troisime partie: Description mcanique et brochage pour la configuration Eurocard ayant des connecteurs rapports Microprocessor system BUS I, 8-bit and 16-bit data Part 3: Mechanical and pin descr

15、iptions for the Eurocard configuration with pin and socket (indirect) connectors O CE1 1990 Droits de reproduction rservs - Copyright - all rights reserved Aucune panie de cette publication ne peut Bue reproduite ni utilise sous quelque forme que ce soit et par aucun procd. lectronique ou mcanique,

16、y compris la photocopie et les microfilms. sans Iac- cord crit de diteur. No pan of this publication may be reproduced or utilized in any lomi or by any means, elecuonic or mechanical, including photocopying and microfilm, without permission in vniting from the publisher. Bureau Central de la Commis

17、sion Electrotechnique Internationale 3, rue de Varemh Genve, Suisse Commission Electrotechnique Internationale e International Electrotechnical Commission CODE PRIX PRICECODE K -2- SOMMAIRE 796-3 O CE1 PREAMBULE PREFACE . INTRODUCTION SPECIFICATIONS MECANIQUES Art i cl es 1 . 2 . 3 . 4 . 5 . Domaine

18、 dapplication Objet Dfinitions 3.1 Fond de panier 3 . 1 .I Face frontale du fond de panier 3.2 Eu-rocard . 3.2,l Face frontale dune Eurocard . 3.2.2 Bord arrire dune Eurocard Connecteurs pour Eurocard 5.1 Techniques de construction des Eurocards Eurocards . 5.2 Norme de dsignation de rfrence et de n

19、umrotation des broches 5.3 Dimensions de IEurocard . 5.4 5.5 5.6 5.6.1 5.6.2 5.6.3 5.6.4 5.7 5.8 Connecteurs de bord dEurocard non relis au bus Face de montage des composants Relation entre les cartes Espacement des cartes Epaisseur de carte . Hauteur des composants Espace prvoir pour le guide-carte

20、s Fond de panier . Affectation des broches du bus . FIGURES . TABLEAU Pages 4 4 8 8 8 8 8 . 8 8 8 10 10 10 10 10 10 12 12 12 12 12 12 12 12 12 14 18 IEC 79bpPT*3 90 m 48L1L18L 0099b2 5 m 796-3 O IEC -3- CONTENTS Page FOREWORD . 5 PREFACE 5 INTRODUCTION 9 . MECHANICAL SPEC1 FICATIONS Clause i. Scope

21、9 2. Object 1 9 3. Definitions 9 3.1 Backplane 9 3.1.1 Front of a backplane 9 3.2 Eurocard . 9 3.2.1 Front of a Eurocard 9 3.2.2 Rear edge of a Eurocard . 11 4. Eurocard connectors . 11 5. Eurocards 11 . 11 5.1 Eurocard construction techniques . 5.2 Reference designations .and pin numbering standard

22、s 11 5.3 5.4 5.5 5.6 5.6.1 5.6.2 5.6.3 5.6.4 5.7 5.8 11 13 Component side . 13 Board to board relationships . 13 Board to board spacing i 13 Board thickness 13 13 Component height Clearance of the card guide-edges . 13 Backplane 13 Bus pin assignment - .13 Eurocard dimensions . Eurocard non-bus edge

23、 connectors . FIGURES 14 . TABLE 19 IEC 77b PT*3 70 W 4844893 0077b73 7 -4- 796-3 O CE1 COMMISSION ELECTROTECHNIQUE INTERNATIONALE BUS I SYSTEME A MICROPROCESSEURS, DONNEES: 8 BITS ET 16 BITS Troisime partie: Description mcanique et brochage pour la configuration Eurocard ayant des connecteurs rappo

24、rts PREAMBUL E 1) Les dcisions ou accords officiels de la CE1 en ce qui concerne les questions techniques, prpars -par des Comits d Etudes o sont repr- sents tous les Comits nationaux sintressant ces questions, expriment dans la plus ,grande mesure possible un accord international , sur les sujets e

25、xamins. 2) Ces dcisions consti tuent des recommandations internationales et sont agres comme telles par les Comits nationaux. 31 Dans le but dencourager lunification internationale? la CE1 exprime le voeu que tous les Comits nationaux adoptent dans leurs rgles nationales le texte de la recommandatio

26、n de la CEI? dans la mesure o les conditions nationales le permettent. Toute divergence entre la recommandation de la CE1 et-la rgle nationale correspondante doit, dans la mesure du possible, etre indique en termes clairs dans cette dernire. 4) La CE1 na fix aucune procdure concernant le marquage co

27、mme indica- tion dapprobation et sa responsabilit nest pas engage quand il est dclar quun matriel est conforme lune de ses recommandations. PREFACE La prsente norme a t tablie par le Sous-Comit 47B*: Systmes microprocesseurs, du Comit dEtudes no 47 de la CEI: Dispositifs semi- conducteurs, Cette nor

28、me constitue la troisime partie dune srie de publications, dont les autres parties sont les suivantes: Publication 796-1 ( Publication 796-2 ( 990) : Premire partie: Description fonctionnelle avec spcifications lectriques et chrono- logiques. 990) : Deuxime partie: Description mcanique et brochage p

29、our la configuration du bus systme, avec des connecteurs en bout de carte. * Le Sous-Comit 47B de la CE1 est dsormais transfr dans lISO/CEI JTC 1. La prsente norme a t approuve selon les procdures de la CE1 et, par consquent, est publie comme norme de la CEI. 796-3 0 IEC- IEC 79b PT*3 90 m 48qL189L

30、0099b94 9 -5- INTERNATIONAL ELECTROTECHNICAL COMMISSION MICROPROCESSOR SYSTEM BUS I, 8-BIT AND 16-BIT DATA Part 3: Mechanical and pin descriptions for the Eurocard configuration with pin and socket (indirect) connectors FOREWORD 1) The formal decisions or agreements of the IEC on technical matters,

31、prepared by Technical Committees on which all the National Committees having a special interest therein are represented, express, as nearly as possible, an international consensus of, opinion on the subjects dealt with. 2) They have the form of recommendations for international use and they are acce

32、pted by the National Committees in that sense. 3) In order to promote international unification, the IEC expresses the wish that all National Committees should adopt the text of the IEC recommendation for their national rules in so far as national condi- tions will permit. Any divergence between the

33、 IEC recommendation .and the corresponding national rules should, as far as possible, be clearly indicated in the latter. 4) The IEC has not laid down any procedure concerning marking as an - indication of approval and has no responsibility when an item of equipment is declared to comply with one of

34、 its recommendations. PREFACE This standard has been prepared by Sub-Committee 47B*: Microprocessor systems, of IEC Technical Committee No. 47: Semiconductor devices. This standard forms Part 3 of a series of publications, the other parts being: Publication 796-1 (1990): Part 1 : Functional descript

35、ion with electrical and timing specifications. Publication 796-2 (1990): Part 2: Mechanical and pin descriptions for the system bus configuration, with edge connectors (direct). * IEC Sub-committee 47B has now been transferred to ISOIIEC JTC 1. This standard was approved according to IEC procedures

36、and is therefore published as an IEC standard. IEC 79b PT*3 90 4844893 009b95 O W Rgle des Six Mois -6- 796-3 O CE1 Rapport de vote Le texte de cette norme est issu des documents suivants: I 47B ( BC) 1 O .I 47B(BC)14 I Le rapport de vote indiqu dans le tableau ci-dessus donne toute infor- mation su

37、r le vote ayant abouti lapprobation de cette norme. La publication suivante de la GEI est cite dans la prsente norme: Publication no 130-14 (1975) r Connecteurs utiliss aux frquences jus- qu 3 MHz, Quatorzime partie: Connec- teurs multiranses monts sur cartes imprimes ayant un cartement des contacts

38、 et des sorties suivant une grille carre de 2,54 mm (0,l in). (Cette publication a t retirde de la vente.) 796-3 0 IEC 47B( CO) 1 O IEC 77b PT*3 70 48447L 007bb 2 47B(CO) 14 -7- The text of this standard is based on the following documents: Six Months Rule I Report on Voting Full information on the

39、voting for the approval of this standard can be found in the Voting Report indicated in the above table. The following IEC publication is quoted in ibis s-tandard: Publication No 130-14 (19751: Connectors for frequencies below 3 MHz, Part 14: Multi-row board mounted printed . board connectors having

40、 contact and termination spacing on a 2.54 mm (0.1 in) square grid. (This publication has been withdrawn from sale.) IEC 77b PT*3 70 4844B7L 0077b77 LI = -8- 796-3 0 CE1 BUS I SYSTEME A MICROPROCESSEURS, DONNEES: 8 BITS ET 16 BITS Troisime partie: Description mcanique et brochage pour la , configura

41、tion Eurocard ayant des connecteurs rapports INTRODUCTION. La prsente norme fait partie dune srie qui traite des interfaces mca- niques et lectriques permettant aux divers composants dun systme microprocesseurs de dialoguer entre eux. Le bus dinterface sert de moyen de transfert en parallle et dinte

42、rconnexion des signaux utilitaires pour les composants dun systme troitement coupls, La srie est compose dune description fonctionnelle et de deux normes mcaniques. 1. 2. 3, 3.1 SPECIFICATIONS MECANIQUES Domaine dapplication La prsente norme est applicable une interface utilise pour assurer la liais

43、on des composants dun systme microprocesseurs au moyen du fond de panier connecteurs rapp Obj-et Cette norme a pour objet de fournir les Drocu rer u ne comDati bi I t mca n ia ue entre wts. nformations permettant de les fonds de panier, les supports de cartes et les cartes de circuit imprim. Dfi n i

44、t ions Les dfinitions suivantes sont applicables dans le cadre de cette norme: Fond de panier Par “fond de panier“, on entend un panneau sur lequel sont installs des connecteurs 96 broches. .Ce panneau interconnecte certaines broches de ces connecteurs en constituant ainsi un bus. 3.1.1 Face frontal

45、e du fond de panier La face frontale du fond de panier est le ct par lequel les cartes Eurocards sont enfiches dans les connecte.urs. 3.2 Eurocard Par “Eurocard“; on entend une carte de circuit imprim qui, enfiche dans le fond de panier, communique avec dautres Eurocards installes dans le mme fond .

46、de panier. 3.2.1 Face frontale dune Eurocard La face frontale dune Eurocard est le ct sur lequel sont monts les composants. , IEC 77b PT*3 90 4844891 0077698 b H 796-3 IEC -9- MICROPROCESSOR SYSTEM BUS I, 8-BIT AND 16-BIT DATA Part 3: Mechanical and pin descriptions for the Eurocard configuration wi

47、th pin and socket (indirect) connectors INTRODUCTION This standard is one of a series which deals with the electrical and mechanical interfaces to allow various microprocessor system components to interact with each other. The interface bus serves as a parallel transfer and utility signal interconne

48、ct for closely coupled system components. The series consists of one functional description and two alternative mechanical standards. 1. 2. 3. 3 MECHANICAL SPEC1 FICATIONS Scope This standard is applicable to an interface used to connect micro- processor system components by means of the pin and socket (indirect) connector type backplane. Object The object of this standard is to provide information to assure that bus backplanes, card racks and printed circuit boards are mechanically compatible. Definitions The following definitions apply for the purpose of this standard: 1 Backplane A board

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