1、 IEC 61189-11 Edition 1.0 2013-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys Mthodes dessai pour les m
2、atriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 11: Mesure de la temprature de fusion ou des plages de tempratures de fusion des alliages braser IEC61189-11:2013 colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerla
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15、ropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (VEI) en l
16、igne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61189-11 Edition 1.0 2013-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards an
17、d other interconnection structures and assemblies Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 11: Mesure de la temprature de fusion
18、 ou des plages de tempratures de fusion des alliages braser INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE P ICS 31.180 PRICE CODE CODE PRIX ISBN 978-2-83220-800-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commissio
19、n Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colourinside 2 61189-11 IEC:2013 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative refe
20、rences . 5 3 Terms and definitions . 5 4 Summary of measuring methods . 6 5 Test equipment . 6 5.1 Method A:DSC 6 5.1.1 DSC 6 5.1.2 Balance . 6 5.1.3 Pans 6 5.1.4 Inert gas 6 5.1.5 Alumina powder . 6 5.2 Method B:Cooling curve of molten solder 7 5.2.1 Electric furnace . 7 5.2.2 Thermocouple 7 5.2.3
21、Measuring instrument 7 5.2.4 Recorder . 7 5.2.5 Container. 7 6 Calibration of the temperature 7 7 Procedure for the measuring method 7 7.1 Method A: DSC . 7 7.1.1 Test condition 7 7.1.2 Procedure for measuring the DSC curve 8 7.2 Method B: Cooling curve of molten solder . 10 7.2.1 Test condition 10
22、7.2.2 Procedure for measuring the cooling curve of molten solder 10 Annex A (normative) Test report on melting temperatures of solder alloys . 12 Annex B (informative) Examples of test result (Method A) 13 Annex C (informative) Example of test result (Method B) . 14 Bibliography 15 Figure 1 Determin
23、ation of solidus temperature . 8 Figure 2 Determination of temperature of melting ends 9 Figure 3 Determination of liquidus temperature 10 Figure 4 Cooling curves of molten solder . 11 Figure B.1 Example of test result (Method A: Sn96,5Ag3Cu,5 alloy) 13 Figure B.2 Example of test result (Method A: S
24、n95,8Ag3,5Cu,7 alloy) 13 Figure C.1 Example of test result (Method B: Sn96,5Ag3Cu,5 alloy) 14 Figure C.2 Example of test result (Method B: Sn95,8Ag3,5Cu,7 alloy) . 14 Table 1 Metal list for calibration . 7 Table A.1 Report form 12 61189-11 IEC:2013 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST
25、METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardizat
26、ion comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes Internatio
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33、ed out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Comm
34、ittees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn t
35、o the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be
36、held responsible for identifying any or all such patent rights. International Standard IEC 61189-11 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/1086/FDIS 91/1097/RVD Full inf
37、ormation on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 61189-11 IEC:2013 A list of all parts of IEC 61189 under the general title Test methods f
38、or electrical materials, printed boards and other interconnection structures and assemblies can be found in the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in t
39、he data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the co
40、rrect understanding of its contents. Users should therefore print this document using a colour printer. 61189-11 IEC:2013 5 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 11: Measurement of melting temperature or melting temperature ran
41、ges of solder alloys 1 Scope This part of IEC 61189 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components. 2 Normative refe
42、rences The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
43、IEC 60194, Printed board design, manufacture and assembly Terms and definitions1IEC 61189-3, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3: Test methods for interconnection structures (printed boards) IEC 61190-1-3, Attachment materi
44、als for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications ISO 9453, Soft solder alloys Chemical compositions and forms ISO 11357-1, Plastics Differential scanning calorimetry (DSC) Part 1: Gener
45、al principles 3 Terms and definitions For the purposes of this document the terms and definitions of IEC 60194, IEC 61189-3, IEC 61190-1-3, ISO 9453 and ISO 11357-1, as well as the following apply. 3.1 melting temperature ranges total range of solidus and liquidus temperature of solder alloys 3.2 so
46、lidus temperature temperature when solder alloys start to melt measured by DSC (method A) 1Sixth edition to be published. 6 61189-11 IEC:2013 3.3 solidus temperature temperature when solidification of solder alloys ends measured by the cooling curve of molten solder (method B) 3.4 liquidus temperatu
47、re temperature when melting ends measured for various heating temperature levels by DSC (method A) 3.5 liquidus temperature solidification temperature measured by the cooling curve of molten solder (method B) 3.6 DSC curve curve measured by differential scanning calorimetry (DSC) 4 Summary of measur
48、ing methods The melting temperature range of solder alloys is measured by using the following methods. Method A: Differential scanning calorimetry (DSC). Method B: Cooling curve of molten solder. Test report shall be made according to Annex A. 5 Test equipment 5.1 Method A: DSC 5.1.1 DSC See ISO 113
49、57-1. 5.1.2 Balance The balance shall have a resolution of 0,1 mg or better. 5.1.3 Pans Pans shall be constructed of a material with a high heat transfer rate and which is not corroded by the samples. Usually, aluminium is used. 5.1.4 Inert gas Inert gas (example N2 or Ar: of a purity higher than 99,9 %) should be used to avoid the sample oxidation. 5.1.5 Alumina powder Alumina powder should be u
