1、 IEC 61837-1 Edition 2.0 2012-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections Part 1: Plastic moulded enclosure outlines Dispositifs pizolectriques montage en surface pour la comm
2、ande et le choix de la frquence Encombrements normaliss et connexions des sorties Partie 1: Encombrements des enveloppes en plastique moules IEC61837-1:2012 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2012 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of thi
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16、nner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61837-1 Edition 2.0 2012-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections P
17、art 1: Plastic moulded enclosure outlines Dispositifs pizolectriques montage en surface pour la commande et le choix de la frquence Encombrements normaliss et connexions des sorties Partie 1: Encombrements des enveloppes en plastique moules INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTR
18、OTECHNIQUE INTERNATIONALE S ICS 31.140 PRICE CODE CODE PRIX ISBN 978-2-88912-042-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor.
19、 Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 61837-1 IEC:2012 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Configuration of enclosures 5 4 Designation of types . 5 5 Plastic moulded enclosure dimensions . 6 6 Lead connections .
20、 6 7 Plastic moulded enclosures 6 Table 1 Designation of plastic moulded enclosures 6 61837-1 IEC:2012 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS Part 1: Plastic moulded enclo
21、sure outlines FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standard
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29、, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out
30、 of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn t
31、o the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. lnternational Standard IEC 61837-1 has been prepared by IEC technical committee 49: Piezoelectric, dielectric and
32、electrostatic devices and associated materials for frequency control, selection and detection. This second edition cancels and replaces the first edition published in 1999. It is a technical revision. This edition includes the following significant technical changes with respect to the previous edit
33、ion: one enclosure type (SIP-L5/01) has been deleted; Configuration symbol of enclosures is currently consolidated into one as DCC (dual chip carrier). 4 61837-1 IEC:2012 The text of this standard is based on the following documents: CDV Report on voting 49/930/CDV 49/969/RVC Full information on the
34、 voting for the approval of this standard can be found in the report on voting indicated in the above table. This lnternational Standard shall be read in conjunction with IEC 61240:1994. IEC 61240:1994 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency con
35、trol and selection in plastic moulded enclosures. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 61837 series, published under the general title Surface mounted piezoelectric devices for frequency control and selection Standard out
36、lines and terminal lead connections, can be found on the IEC web site. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this d
37、ate, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 61837-1 IEC:2012 5 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS Part 1: Plastic moulded enclosure outlines 1 Scope This part of
38、 IEC 61837 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures and is based on IEC 61240. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document an
39、d are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61240: 1994, Piezoelectric devices Preparation of outline drawings of surface-mounted devices (
40、SMD), for frequency control and selection General rules13 Configuration of enclosures These enclosures are made of plastic moulded materials with the terminal leads based on the descriptive designation system for semiconductors, devices package. The configuration symbols are shown as follows: DCC (d
41、ual chip carrier) 4 Designation of types The designation of types is shown in four parts as follows: A: Configuration symbol of enclosures: DCC (dual chip carrier); B: Structure of terminal leads: J: leaded type; C: Number of terminal leads D: Two digit serial number _ 1A new edition is under consid
42、eration. B C D D A 6 61837-1 IEC:2012 5 Plastic moulded enclosure dimensions The dimensions in this standard apply to all the completed SMD-devices for frequency control and selection. Only those dimensions are given which meet the requirements of IEC 61240. 6 Lead connections Recommendations for th
43、e lead connections of all completed SMD-devices for frequency control and selection are given in the following individual sheets. Lead connections shall always be given in the detail specification. 7 Plastic moulded enclosures The following table sets out the designation of the plastic moulded enclo
44、sures as outlined in the ensuing specification sheets. Table 1 Designation of plastic moulded enclosures No. Type Sheet No. Description 1 DCC-J4/01 Sheet 1 Plastic, moulded, four folded leads SMD outline 2 DCC-J4/02 Sheet 2 Plastic, moulded, four folded leads SMD outline 3 DCC-J4/03 Sheet 3 Plastic,
45、 moulded, four folded leads SMD outline 4 DCC-J4/04 Sheet 4 Plastic, moulded, four folded leads SMD outline 5 DCC-J4/05 Sheet 5 Plastic, moulded, four folded leads SMD outline 6 DCC-J4/06 Sheet 6 Plastic, moulded, four folded leads SMD outline 7 DCC-J4/07 Sheet 7 Plastic, moulded, four folded leads
46、SMD outline 8 DCC-J4/08 Sheet 8 Plastic, moulded, four folded leads SMD outline 61837-1 IEC:2012 7 Ref.Dimensions (mm)NotesMin. Nom. Max.5,087,62ABGG1K1K2FLBee1b2l2yA3bpLp0,400,209,401,700,401,0014,008,904,704,200,600,309,802,100,802,300,100,601,604 31 2AB Fy SSG1GeK1LBb2l2ee1A3K2LpbpActual sizeTerm
47、inal configurationTerminal land areas0,30Plastic, moulded, four folded leads SMD outline, type DCC-J4/01 Scale 2:1 Sheet 1 IEC 519/12 8 61837-1 IEC:2012 Terminal lead connections If the presence of any leads is optional, or if an enclosure is supplied with less than the maximum number of leads, this
48、 shall be indicated in the detail specification. Type of SMD Lead No. Crystal unit Crystal oscillator Crystal filter DCC-J4/01 1 2 3 4 Control voltage Ground Output DC supply 61837-1 IEC:2012 9 Ref.Dimensions (mm)NotesMin. Nom. Max.5,084,60ABGG1K1K2FLBee1b2l2yA3bpLp0,400,150,800,400,6010,505,302,702
49、,500,600,255,801,200,801,400,100,601,200,20A3421B FG G1SSyeK1 LBA3K2Lpbpb2l2ee1Actual sizeTerminal configurationTerminal land areasPlastic, moulded, four folded leads SMD outline, type DCC-J4/02 Scale 2:1 Sheet 2 IEC 520/12 10 61837-1 IEC:2012 Terminal lead connections If the presence of any leads is optional, or if an enclosure is supplied with less than the maximum number of
