1、 IEC 62739-1 Edition 1.0 2013-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 1: Erosion test method for metal materials without surface processing Mthode dessai de lrosion de lquipement de brasage la vague u
2、tilisant un alliage braser sans plomb fondu Partie 1: Mthode dessai drosion de matriaux mtalliques sans traitement de surface IEC62739-1:2013 colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this p
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16、r des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62739-1 Edition 1.0 2013-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 1: Erosion test method for metal
17、materials without surface processing Mthode dessai de lrosion de lquipement de brasage la vague utilisant un alliage braser sans plomb fondu Partie 1: Mthode dessai drosion de matriaux mtalliques sans traitement de surface INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNA
18、TIONALE R ICS 31.190; 31.240 PRICE CODE CODE PRIX ISBN 978-2-83220-870-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention
19、 Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colourinside 2 62739-1 IEC:2013 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 Test 6 4.1 Overview . 6 4.2 Test equipment . 6 4.2.1 Test equipment description 6 4.2.2 C
20、onfiguration example of test equipment 6 4.3 Specimen 7 4.4 Test conditions 9 4.5 Test method 9 4.5.1 Test procedure 9 4.5.2 Dross removal procedure . 10 5 Method of erosion depth measurement (focal depth method with optical microscope) 10 5.1 General . 10 5.2 Preparation of the specimen 10 5.3 Meas
21、urement equipment . 10 5.4 Measurement procedure 11 6 Items to be recorded in test report 12 Annex A (normative) Specifications of test equipment any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental
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30、ational Standard IEC 62739-1 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/1092/FDIS 91/1106/RVD Full information on the voting for the approval of this standard can be found i
31、n the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62739-1 IEC:2013 A list of all parts in the IEC 62739 series, published under the general title Test method for erosion of wave soldering equipment using molten
32、 lead-free solder alloy, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publ
33、ication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print t
34、his document using a colour printer. 62739-1 IEC:2013 5 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY Part 1: Erosion test method for metal materials without surface processing 1 Scope This part of the IEC 62739 series provides an evaluating test method for
35、the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. 2 Normative references The following documents, in whole or in part, are normatively referenc
36、ed in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Require
37、ments for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications IEC 60068-2-20:2008, Environmental testing Part 2-20: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads 3 Terms and definitions For
38、the purposes of this document, the following terms and definitions apply. 3.1 erosion phenomenon where a base material is dissolved and made thinner by coming into contact with molten solder 3.2 lead-free solder alloy that does not contain more than 0,1 % mass fraction of lead (Pb) as its constituen
39、t and is used for joining components to substrates or for coating surfaces SOURCE: IEC 60194:2006, 75.1904 modified “mass fraction“ is used instead of “weight“ 3.3 dross oxide and other contaminants that form on the surface of molten solder SOURCE: IEC 60194:2006, 75.0410 6 62739-1 IEC:2013 4 Test 4
40、1 Overview The specimen is mounted to the rotation block of the test equipment which is driven by the motor (may include gear unit) then immersed into molten lead-free solder and rotated to simulate solder flow in the wave soldering equipment. The erosion depth is measured after the block is rotate
41、d for a designated period of time. 4.2 Test equipment 4.2.1 Test equipment description Test equipment shall include equipment that realises the test conditions specified in 4.3. Component materials of the test equipment which come in contact with molten solder shall be erosion resistant or processed
42、 to be erosion resistant. Details of the specifications of the equipment are given in Annex A. 4.2.2 Configuration example of test equipment An example of the configuration of the test equipment is shown in Figure 1. The test equipment consists of a pot unit, rotation unit, and control unit. a) The
43、pot unit consists of a heater to melt the lead-free solder alloy and a pot in which a specimen can rotate. b) The rotation unit consists of a motor which rotates the specimen and a rotation block to which the specimen is attached. c) The control unit has functions to control the heater, using a temp
44、erature sensor, control mechanism and motor rotation. Since dross spreads during the test, it is preferable for the test equipment to have a ventilatory function with an exhaust air duct. Other test equipment can be used if its configuration and functions meet the above requirements. 62739-1 IEC:201
45、3 7 Control unit Rotation motor Pot unit Specimen Solder Exhaust air duct Pot Heater Rotation unit Temperature sensor Rotation block IEC 1429/13 Figure 1 Configuration example of test equipment 4.3 Specimen A specimen of the following material and shape is used. a) The material of the specimen shall
46、 be the same as that of the solder bath and its components which come into contact with the molten solder. b) The shape of specimen and the indication of the material designation shall be as shown in Figure 2. The indication of the material designation shall be engraved. c) The surfaces of the speci
47、men to be evaluated shall be the surface with material indication (face A) and its backside (face B), and from the lower edge to 50 mm above it. 8 62739-1 IEC:2013 Dimensions in millimetres 2 8 4 2 3,3 86105701 IEC 1430/13 Key 1 Laser engraved mark Figure 2 Shape of the specimen 62739-1 IEC:2013 9 4
48、4 Test conditions Test materials and test conditions are shown in Table 1. Table 1 Test conditions Composition of test solder alloy Sn96,5Ag3Cu,5 specified in IEC 61190-1-3 shall be used if not otherwise specified in individual standards. Test flux Rosin flux with halide content of 0,2 % mass fract
49、ion shall be used. Materials specified in Annex B of IEC 60068-2-20:2008, shall be used. Solder temperature (at measurement position) 350 C 3 C (the temperature is measured at a depth of 35 mm to 40 mm from the solder surface and at a distance of 20 mm to 30 mm from the specimen.). Rotation speed of specimen 100 r/min 3 r/min Rotation radius of specimen 6 mm to 8 mm (from the centre of the rotation
