1、 IEC TR 62396-7 Edition 1.0 2017-07 TECHNICAL REPORT Process management for avionics Atmospheric radiation effects Part 7: Management of single event effects (SEE) analysis process in avionics design IEC TR 62396-7:2017-07(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Switz
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8、e a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and French, with equivalent terms in 16 additional languages. Also known as the International Electrotechnical Vocabulary
9、 (IEV) online. IEC Glossary - std.iec.ch/glossary 65 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Cu
10、stomer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. IEC TR 62396-7 Edition 1.0 2017-07 TECHNICAL REPORT Process management for avionics Atmospheric radiation effects Pa
11、rt 7: Management of single event effects (SEE) analysis process in avionics design INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-4456-2 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publicatio
12、n from an authorized distributor. 2 IEC TR 62396-7:2017 IEC 2017 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms, definitions and abbreviated terms 6 3.1 Terms and definitions 6 3.2 Abbreviated terms . 6 4 Radiation analysis process 7 4.1 General . 7 4.2 Determine inputs to SEE anal
13、ysis . 8 4.3 Assess electronic component SEE sensitivity 9 4.4 Identify and account for mitigations and electronic equipment effects . 10 4.5 Calculate SEE rates and analyse risk 11 4.6 Perform radiation tests 12 4.7 Design change 12 4.8 Radiation report 13 4.9 SEE impact analysis . 13 4.10 On-going
14、 component management 14 (informative) Detailed radiation analysis process . 15 Annex A(informative) Radiation effects evaluation table of electronic component 16 Annex B Bibliography 18 Figure 1 Radiation analysis process overview 8 Figure A.1 Detailed radiation analysis process flowchart 15 Table
15、B.1 Template for radiation effects evaluation table of electronic component . 17 IEC TR 62396-7:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PROCESS MANAGEMENT FOR AVIONICS ATMOSPHERIC RADIATION EFFECTS Part 7: Management of single event effects (SEE) analysis process in avionics desi
16、gn FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in
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25、blication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the poss
26、ibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. However, a technical committee may propose
27、the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC TR 62396-7, which is a technical report, has been prepared by IEC technical committee 107: Process management f
28、or avionics. 4 IEC TR 62396-7:2017 IEC 2017 The text of this technical report is based on the following documents: Enquiry draft Report on voting 107/300/DTR 107/304/RVDTR Full information on the voting for the approval of this technical report can be found in the report on voting indicated in the a
29、bove table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 62396 series, published under the general title Process management for avionics Atmospheric radiation effects, can be found on the IEC website. The committee has decided t
30、hat the contents of this document will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual
31、version of this publication may be issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a col
32、our printer. IEC TR 62396-7:2017 IEC 2017 5 PROCESS MANAGEMENT FOR AVIONICS ATMOSPHERIC RADIATION EFFECTS Part 7: Management of single event effects (SEE) analysis process in avionics design 1 Scope This part of IEC 62396, which is a technical report, describes a process to account for the effects o
33、f atmospheric radiation on electronic equipment. Single event effects (SEE) due to atmospheric radiation are one class of possible failure mechanisms that are addressed in the safety and reliability analyses of electronic equipment and associated functions. This document focuses on electronic compon
34、ents, electronic equipment and associated electronic functions. System level analysis is not addressed in this document. This document is intended to describe an approach to accounting for SEE in electronic equipment design, design review, and it can provide aid in the aerospace certification proces
35、s. This document establishes an example process for assessing electronic components in the atmospheric radiation environment, evaluating for mitigations/protections/utilizations, and addressing the electronic equipment impacts of the SEE. The process is intended to support an SEE analysis for electr
36、onic equipment. It does not describe, in detail, methods used to mitigate the effects of SEE in the electronic equipment design. NOTE 1 IEC 62396-3 provides further details for this process. NOTE 2 IEC 62396-2 provides further details for SEE testing. This document, by itself, is not a program requi
37、rements document, i.e. it does not contain the word “shall.” However it describes a process that can be used, for example, at the discretion and agreement of the users, to aid in the preparation and the maintenance of an electronic components management plan (see 1 1and 7). The output of the process
38、 described in this document provides data as an input into the product safety and reliability analyses. Although developed for the avionics industry, this document can be used by other industrial sectors at their discretion. 2 Normative references The following documents are referred to in the text
39、in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62396-1:2016, Process management for avionics
40、 Atmospheric radiation effects Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment _ 1Numbers in square brackets refer to the Bibliography. 6 IEC TR 62396-7:2017 IEC 2017 3 Terms, definitions and abbreviated terms 3.1 Terms and definit
41、ions For the purposes of this document, the terms and definitions given in IEC 62396-1 apply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at htt
42、p:/www.iso.org/obp NOTE For the purposes of the document, the term “device” can be used in place of “electronic component”. 3.2 Abbreviated terms BIT built-in test BoM bill of material COTS commercial off the shelf CRC cyclic redundancy check E Energy ECC error correction code EDAC error detection a
43、nd correction FoM figure of merit FPGA field-programmable gate array IEEE Institute of Electrical and Electronics Engineers I/O input/output JEDEC JEDEC Solid State Technology Association JESD JEDEC standard L1/L2 level 1 / level 2 (related to microprocessor cache memories, “level 1“ cache memory be
44、ing usually built onto the microprocessor chip itself, “level 2” cache memory being usually on a separate chip or expansion card) MBU multiple bit upset (in the same word) MCU multiple cell upset MTBF mean time between failure P/SSA preliminary/system safety assessment RAM random access memory SDRAM
45、 synchronous dynamic random access memory SEB single event burnout SEE single event effect SEFI single event functional interrupt SEL single event latch-up SET single event transient SEU single event upset SSA system safety assessment TLB translation lookaside buffer P microprocessor IEC TR 62396-7:
46、2017 IEC 2017 7 4 Radiation analysis process 4.1 General Electronic components and integrated circuits have become increasingly susceptible to atmospheric radiation causing SEE. These phenomena are the result of interaction of high energy cosmic rays with silicon-based components. The resulting sing
47、le event effects may cause various conditions; such as data corruption. Additional types of undesirable effects may include: damage to hardware; corrupted software residing in volatile memory; corrupted data in memory; microprocessor halts and interrupts; writing over critical data tables; unplanned
48、 events. The industry trend is for continued decreases in electronic component feature size and operating voltages, while the number of gates on a given device continues to increase, which entails focusing attention on the radiation effects. As this trend continues to deep sub-micron feature sizes,
49、electronic component designs are achieving higher densities and lower voltages, resulting in smaller active charge regions. In general, for decreasing feature size of silicon based cells, the expected critical charge decreases and the sensitivity to radiation may increase. The radiation effects analysis example process described in this document assesses the radiation effects susceptibility of the electronic components and the effects at the electronic equipm
