CNS 831-1982 Cast Iron Pipes for Pressure Lines with TYTON Joints Class LA《压力管路用铸铁管–使用TYTON插承口（A级）》.pdf

相关资源

IRS 70778-2-2018 Recommendations for determining the carrying capacity and fatigue risks of existing metallic railway bridges.pdf

IRS 70712-2018 Rail defects.pdf

IRS 50596-6-2018 Conditions for coding intermodal loading units in combined transport combined transport lines and wagons.pdf

IRS 50596-5-2018 Transport of road vehicles on wagons-Technical Organisation-Conveyance of semi-trailers with P coding or N coding on recess wagons.pdf

IESNA TM-23-2017 Lighting Control Protocols.pdf

IESNA RP-2-2017 Recommended Practice for Retail Lighting.pdf

ITU-R RAPPORT M 766-2 FRENCH-1990 Feasibility of frequency sharing between the GPS and other services《全球定位系统和其他服务之间的频率共享的可行性》.pdf

ITU-R RAPPORT M 763-3 FRENCH-1990 Signal level variation due to multipath effects and blockage by ship-s superstructure in maritime mobile-satellite service lin.pdf

ITU-R RAPPORT M 739-1 FRENCH-1986 Interference due to intermodulation products in the land mobile service between 25 and 100 MHz《由于互调产物在陆地移动服务25和100 MHz之间产生的干扰》.pdf

ITU-R RAPPORT M 319-7 FRENCH-1990 Characteristics of equipment and principles governing the assignment of frequency channels between 25 and 100 MHz for land mob.pdf

猜你喜欢

JEDEC JESD482-A-1984 List of Preferred Values for Use on Various Types of Small Signal and Regulator Diodes《在各种类型小型信号和调整起二极管中使用的首选值清单》.pdf

JEDEC JESD49A 01-2013 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD) (Minor Revision of JESD49 SEPTEMBER 2005 Reaffirmed January 2009).pdf

JEDEC JESD5-1982 Mesurement of Temperature Coefficient of Voltage Regulator Diodes《电压常规两极真空管温度系数测试》.pdf

JEDEC JESD50B 01-2008 Special Requirements for Maverick Product Elimination and Outlier Management.pdf

JEDEC JESD50C-2018 Special Requirements for Maverick Product Elimination and Outlier Management.pdf

JEDEC JESD51-1-1995 Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)《集成电路热测方法－电测方法(单半导体器件)》.pdf

JEDEC JESD51-10-2000 Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements《通孔视野有引线的封装热测量的测试板》.pdf

JEDEC JESD51-11-2001 Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements《通孔区域排列有引线的封装热测量的测试板》.pdf

JEDEC JESD51-12 01-2012 Guidelines for Reporting and Using Electronic Package Thermal Information.pdf