1、Recognized as anAmerican National Standard (ANSI)The Institute of Electrical and Electronics Engineers, Inc.345 East 47th Street, New York, NY 10017-2394, USACopyright 1997 by the Institute of Electrical and Electronics Engineers, Inc.All rights reserved. Published 1997. Printed in the United States
2、 of America.ISBN 1-55937-896-7No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission of the publisher.IEEE Std 1301.4-1996 (R2008)IEEE Standard for Metric Equipment Practice for Microcomputers Coordination Docum
3、ent forMezzanine CardsSponsorBus Architecture Standards Committeeof theIEEE Computer SocietyReaffirmed 31 January 2008Approved 10 December1996IEEE-SA Standards BoardReaffirmed 29 October 2002Approved 15 May 1997American National Standards InstituteAbstract: This standard establishes the metric modul
4、ar order and coordination dimensions formezzanine cards for use on host modules.Keywords: front panel, host module, metric, mezzanine, moduleiiIEEE Standards documents are developed within the Technical Committees of the IEEE Societies and the StandardsCoordinating Committees of the IEEE Standards B
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16、he legal validity orscope of those patents that are brought to its attention.iiiIntroduction(This introduction is not part of IEEE Std 1301.4, IEEE Standard for a Metric Equipment Practice for MicrocomputersCoordinationDocument for Mezzanine Cards.)This generic standard has been developed as a follo
17、w-on to IEEE Std 1301-1991. This standard was developed inresponse to the recognition of the need for a small form factor board to be applied to a host module, with the ability tosupport multiple functionality. Initially it was assumed that this need would be driven entirely by desktop usage.However
18、 as this standard was developed, it became obvious that desktop applications were only part of the potentialsystem architectures. These small form factor units, or mezzanine cards, would also see usage on other host modules,such as in industrial application of subrack plug-in units. This standard w
19、ill add to the modular order, initiated byIEEE Std 1301-1991, the concept of a standardized mezzanine card with the appropriate dimensions and featuresdefined.The following persons were members of the IEEE P1301.4 Working Group:Joe Trainor, Chair Elwood Parsons, Vice Chair Roger Hinsdale, Technical
20、Editor Mike Humphrey (Task Group Leader)Clifford Lupien (Draft Editor)James Koser, Secretary The following persons were on the balloting committee:Ed J. BarsottiRalf BokmperDavid BrearleyWayne P. FischerPaul J. FultonKenneth C. HeckRoger HinsdaleJames R. KoserKristian MartinsonElwood T. ParsonsDougl
21、as Rawson-HarrisRichard C. SprattNobuaki SugiuraMichael G. ThompsonEike G. WaltzWhen the IEEE Standards Board approved this standard on 10 December 1996, it had the following membership:Donald C. Loughry, Chair Richard J. Holleman, Vice Chair Andrew G. Salem, Secretary Gilles A. BarilClyde R. CampJo
22、seph A. CannatelliStephen L. DiamondHarold E. EpsteinDonald C. FleckensteinJay Forster*Donald N. HeirmanBen C. JohnsonE. G. “Al” KienerJoseph L. Koepfinger*Stephen R. LambertLawrence V. McCallL. Bruce McClungMarco W. MigliaroMary Lou PadgettJohn W. PopeJose R. RamosArthur K. ReillyRonald H. ReimerGa
23、ry S. RobinsonIngo RschJohn S. RyanChee Kiow TanLeonard L. TrippHoward L. Wolfman*Member EmeritusAlso included are the following nonvoting IEEE Standards Board liaisons:Satish K. Aggarwal Alan H. Cookson Chester C. TaylorLisa S. YoungIEEE Standards Project EditorivCLAUSE PAGE1. Overview.11.1 Scope 1
24、1.2 Purpose. 11.3 Dimensions. 11.4 Coordination dimensions . 21.5 Environmental requirements 21.6 Conformance 22. References.23. Word usage, definitions, and abbreviations 33.1 Special word usage. 33.2 Definitions 33.3 Abbreviations. 43.4 Dimensional location nomenclature. 44. General arrangement .5
25、4.1 Mezzanine card coordination dimensions 64.2 Mezzanine card boundary envelope. 74.3 Mezzanine card spacing 94.4 Mezzanine card types. 94.5 Mezzanine card elements . 10Copyright 1997 IEEE All Rights Reserved 1IEEE Standard for a Metric Equipment Practice for MicrocomputersCoordination Document for
26、 Mezzanine Cards1. Overview1.1 ScopeThis generic standard may be applied in all fields of electronics where equipment and installations are required toconform to a metric modular order. This standard establishes the metric modular order for parallel mounted,interconnected electronic circuit assembli
27、es, hereafter referred to as mezzanine cards, and may be applied in otherapplications. The choice of coordination dimensions for the mechanical structure lies within a homogeneous, metric,modular, three-dimensional grid as specified in IEC 917.2-1992 and referenced in IEEE Std 1301-1991.1 Optimumcon
28、ditions are thereby created for the application of computer-assisted methods throughout design and manufacturing,e.g., computer-assisted planning, development, manufacturing, testing, and installation. Due to the application-specificnature of mezzanine cards, the electrical and mechanical interconne
29、ct implementation will require definition that isbeyond the scope of this document.1.2 PurposeThis generic standard has been generated to establish a metric modular order nomenclature for mezzanine cards,thereby providing a universal document that makes a mezzanine card easier to specify and that ca
30、n be used to fosterand support many specific applications.1.3 DimensionsAll dimensions in this document are in millimeters as per ISO 1000: 1992 and ISO 31-1: 1992, unless otherwisespecified.1Information on references can be found in clause 2.2 Copyright 1997 IEEE All Rights ReservedIEEE Std 1301.4-
31、1996 IEEE STANDARD FOR A METRIC EQUIPMENT PRACTICE FOR1.4 Coordination dimensionsIEEE Std 1301-1991 defines the actual dimensions of a 25 mm metric equipment practice. These actualdimensions are derived from coordination dimensions using the principles of boundary and axis referencesillustrated in I
32、EC 917.2-1992 and IEEE Std 1301-1991.Overall dimensions and internal subdivisions are determined by using mounting pitches (mp1 = 25 mm, mp2 = 5 mm,mp3 = 2.5 mm, mp4 = 0.5 mm, and mp5 = 0.05 mm) to derive the dimensions given in this standard. They are also usedwhen extending this standard with addi
33、tional dimensions (where such extensions are permitted) and when alternativepositions of piece parts are described (in such cases, the relationships between involved dimensions shall bemaintained).A subscript “c” has been used in this document to indicate coordination dimensions.1.5 Environmental re
34、quirementsThe appropriate environmental requirements will be defined by other related standards or application-specificstandards.1.6 ConformanceConformance with this standard can be claimed provided thata) The required values are used.b) Allowed but non-preferred dimensions and options, as indicated
35、 in this standard, are implemented.2. ReferencesThe following publications shall be used conjunction with this standard:IEC 50:, International Electrotechnical Vocabulary.2 IEC 149: 1988, Terms and Definitions for Printed Circuits. IEC 916:1988, Mechanical structures for electronics equipmentTermino
36、logy IEC 917-2: 1992, Modular order for the development of mechanical structures for electronic equipmentpracticesPart 2: Sectional specificationInterface coordination dimensions for the 25 mm equipment practice. IEC 917-2-2: 1994, Modular order for the development of mechanical structures for elect
37、ronic equipmentpracticesPart 2: Sectional specificationInterface coordination dimensions for the 25 mm equipmentpracticeSection 2: Detail specificationDimensions for subracks, chassis, backplanes, front panels, and plug-inunits. IEEE Std 100-1996, The IEEE Standard Dictionary of Electrical and Elect
38、ronics Terms.3 2IEC publications are available from IEC Sales Department, Case Postale 131, 3, rue de Varemb, CH-1211, Genve 20, Switzerland/Suisse. IECpublications are also available in the United States from the Sales Department, American National Standards Institute, 11 West 42nd Street, 13thFloo
39、r, New York, NY 10036, USA.3As this standard goes to press, IEEE Std 100-1996 is approved but not yet published. Anticipated publication date is April 1996. IEEE publicationsare available from the Institute of Electrical and Electronics Engineers, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1
40、331, USA.Copyright 1997 IEEE All Rights Reserved 3MICROCOMPUTERS-COORDINATION DOCUMENT FOR MEZZANINE CARDS IEEE Std 1301.4-1996IEEE Std 1301-1991, IEEE Standard for Metric Equipment Practice for MicrocomputersCoordinating Document(ANSI). IEEE Std 1301.2-1993, IEEE Recommended Practices for the Imple
41、mentation of a Metric Equipment Practice(ANSI). ISO 31-1: 1992, Quantities and unitsPart 1: Space and time. ISO 1000: 1992, SI units and recommendations for the use of their multiples and of certain other units. ISO/DIS 1101, Geometrical Product Specifications (GPS)Geometrical tolerancingGeneralitie
42、s, definitions,symbols, indication on drawings. (Revision of ISO 1101: 1983).4 3. Word usage, definitions, and abbreviations3.1 Special word usagemay: A key word indicating flexibility of choice with no implied preference. The phrase is optional is usedinterchangeably with the key word may.shall: A
43、key word indicating a mandatory requirement. Designers shall implement such mandatory requirements toinsure interchangeability and to claim conformance with the specification. The phrase is required is usedinterchangeably with the key word shall.should: A key word indicating flexibility of choice wi
44、th strongly preferred implementation. The phrase isrecommended is used interchangeably with the key word should.3.2 DefinitionsCommon terms are defined in IEEE Std 100-1996. The terms defined in this clause are specific to this standard.3.2.1 aperture dimension: The usable space between standardized
45、 features.3.2.2 coordination dimension: A reference dimension used to coordinate mechanical interfaces. This is not amanufacturing dimension with a tolerance.3.2.3 host: In general, the host is an electronic circuit assembly, e.g., a plug-in unit, a back-plane, a motherboard, oranother mezzanine car
46、d that provides electrical and/or mechanical connections to a subordinate assembly.3.2.4 mezzanine card: An electronic card assembly mounted parallel to, and with electrical and/or mechanicalconnections to, a host.3.2.5 mezzanine card boundary envelope: A three-dimensional set of separation planes w
47、ithin which a mezzaninecard and all its components reside. It will be treated as a single unit.3.2.6 n: A multiplier having integer values (e.g., 0, 1, 2, 3).3.2.7 reference plane: A theoretical plane not having thickness or tolerance.3.2.8 separation plane: A reference plane used to separate two ob
48、jects. This plane shall not be encroached upon bythe object on either side except in clearly specified interface areas.3.2.9 stack height: A dimension used to define the spacing between adjacent surfaces of mezzanine cards or amezzanine card and its host.3.2.10 system unit (SU): The equipment refere
49、nce increment or mounting pitch (mp1), used for length and width(1 SU = 25 mm = mp1).4ISO publications are available from the ISO Central Secretariat, Case Postale 56, 1 rue de Varemb, CH-1211, Genve 20, Switzerland/Suisse. ISOpublications are also available in the United States from the Sales Department, American National Standards Institute, 11 West 42nd Street, 13thFloor, New York, NY 10036, USA.4 Copyright 1997 IEEE All Rights ReservedIEEE Std 1301.4-1996 IEEE STANDARD FOR A METRIC EQUIPMENT PRACTICE FOR3.3 AbbreviationsThe following abbreviations ar
