1、BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06Mechanical standardization of semiconductor devicesPart 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018)BS EN IEC 60191-1:2018EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE N
2、ORM EN IEC 60191-1 March 2018 ICS 31.080.01 Supersedes EN 60191-1:2007 English Version Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018) Normalisation mcanique des dispositifs semi-conducteurs -
3、Partie 1: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs discrets (IEC 60191-1:2018) Mechanische Normung von Halbleiterbauelementen - Teil 1: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von Einzelhalbleiterbauelementen (IEC 60191-1:2018) This European Standa
4、rd was approved by CENELEC on 2018-02-27. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concernin
5、g such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member
6、 into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic
7、of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardiz
8、ation Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN IEC 601
9、91-1:2018 E National forewordThis British Standard is the UK implementation of EN IEC 60191-1:2018. It is identical to IEC 60191-1:2018. It supersedes BS IEC 60191-1:2007, which is withdrawn.BSI has queried a possible typographical error in Table A.1 with IEC.The UK participation in its preparation
10、was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Th
11、e British Standards Institution 2018 Published by BSI Standards Limited 2018ISBN 978 0 580 84425 6ICS 31.080.01Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30
12、 April 2018.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN IEC 60191-1:2018EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN IEC 60191-1 March 2018 ICS 31.080.01 Supersedes EN 60191-1:2007 English Version Mechanical standardization of semiconductor devices -
13、 Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018) Normalisation mcanique des dispositifs semi-conducteurs - Partie 1: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs discrets (IEC 60191-1:2018) Mechanische Normung von Hal
14、bleiterbauelementen - Teil 1: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von Einzelhalbleiterbauelementen (IEC 60191-1:2018) This European Standard was approved by CENELEC on 2018-02-27. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the
15、conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standa
16、rd exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are t
17、he national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Pola
18、nd, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de
19、 la Science 23, B-1040 Brussels 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN IEC 60191-1:2018 E BS EN IEC 60191-1:2018EN IEC 60191-1:2018 (E) 2 European foreword The text of document 47D/886/CDV, future edition 3 of IEC 6019
20、1-1, prepared by IEC/SC 47D “Semiconductor devices packaging, of IEC technical committee 47: Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 60191-1:2018. The following dates are fixed: latest date by which the document has to be implemented at
21、 national level by publication of an identical national standard or by endorsement (dop) 2018-11-27 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2021-02-27 This document supersedes EN 60191-1:2007. Attention is drawn to the possibility that som
22、e of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60191-1:2018 was approved by CENELEC as a European Standard without any modificat
23、ion. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60191-6 (series) NOTE Harmonized as EN 60191-6 (series). ISO 5459:2011 NOTE Harmonized as EN ISO 5459:2011 (not modified). BS EN IEC 60191-1:2018EN IEC 60191-1:2018 (E) 3 Annex ZA (n
24、ormative) Normative references to international publications with their corresponding European publications The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited appl
25、ies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of
26、the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60191-2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions - - IEC 60191-4 - Mechanical standardization of semiconductor devices - Part 4: Coding system and cl
27、assification into forms of package outlines for semiconductor device packages EN 60191-4 - IEC 60191-6-1 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wi
28、ng lead terminals EN 60191-6-1 - IEC 60191-6-3 - Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) EN 60191-6-3 - I
29、EC 60191-6-20 - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) EN 60191-6-20 - IEC 60191-6-21 - M
30、echanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) EN 60191-6-21 - BS EN IEC 60191-1:2018This page deliberate
31、ly left blankIEC 60191-1 Edition 3.0 2018-01 INTERNATIONAL STANDARD Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline drawings of discrete devices INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.080.01 ISBN 978-2-8322-5266-6 Registered trademar
32、k of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. IEC 60191-1 Edition 3.0 2018-01 INTERNATIONAL STANDARD Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline dra
33、wings of discrete devices INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.080.01 ISBN 978-2-8322-5266-6 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. BS EN IEC 60191-1:2018 2 IEC 60191-1:20
34、18 IEC 2018 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references 6 3 Terms and definitions 7 4 General rules for all drawings 8 4.1 Drawing layout 8 4.2 Dimensions and tolerances . 9 4.3 Methods for locating the datum . 10 4.4 Numbering of terminals . 11 4.4.1 General . 11 4.4.2 Single-ended devic
35、es with terminals in a linear array . 11 4.4.3 Single-ended devices with terminals in a circular array 11 4.4.4 Double-ended devices . 11 4.4.5 Devices with terminals disposed in a square or rectangular periphery 11 4.4.6 Particular case of lozenge shaped bases 11 4.4.7 Other devices 12 5 Additional
36、 rules 12 5.1 Rules for device and case outline drawings . 12 5.2 Rules to specify the dimensions and positions of terminals . 13 5.2.1 General rules . 13 5.2.2 Rules to specify the dimensions and the positions of the terminals on a base drawing . 13 5.3 Rules for gauge drawings . 13 6 Inter-convers
37、ion of inch and millimetre dimensions and rules for rounding off . 14 7 Rules for coding 14 Annex A (informative) Reference letter symbols . 15 Annex B (informative) Rules to specify the dimensions and positions of terminals on a base drawing . 18 B.1 Example of dimensioning for a circular base outl
38、ine with no tab and having four terminals located symmetrically on a pitch circle 18 B.1.1 Interpretation of the principle of dimensioning 18 B.1.2 Checking . 19 B.2 Example of dimensioning for a circular base outline with a tab and having four terminals located symmetrically on a pitch circle 19 B.
39、2.1 Interpretation of the principle of dimensioning 19 B.2.2 Checking . 20 Annex C (normative) General philosophy of flat base devices 24 Annex D (normative) Special rules for SMD-packages . 26 D.1 General reference . 26 D.2 Lead terminals 26 D.3 Measuring methods . 26 Annex E (informative) Examples
40、 of semiconductor device drawings . 27 Annex F (informative) Former rules for rounding off . 33 F.1 Toleranced dimensions . 33 F.1.1 Maximum and minimum values of toleranced dimensions 33 F.1.2 Nominal value of toleranced dimensions 33 BS EN IEC 60191-1:2018IEC 60191-1:2018 IEC 2018 3 F.2 Untoleranc
41、ed dimensions (maximum only or minimum only) 33 F.3 Untoleranced nominal dimensions given for general information . 33 F.4 Untoleranced nominal dimensions given to specify true geometrical positions . 34 Annex G (informative) Former rules for coding . 35 G.1 General . 35 G.2 Device outlines . 35 G.3
42、 Bases . 35 G.4 Case outlines 35 G.5 Type variants and provisional drawings . 35 Bibliography 36 Figure 1 Numbering of terminals for the particular case of lozenge shaped bases . 12 Figure 2 System to indicate the dimensions of the terminals 13 Figure B.1 Circular base outline with no tab . 21 Figur
43、e B.2 Tolerances of terminals. 21 Figure B.3 Gauge for a circular base outline with no tab 22 Figure B.4 Circular base outline with tab 22 Figure B.5 Gauge for a circular base outline with tab . 23 Figure C.1 Example of flat base outline 25 Figure E.1 Long form package . 27 Figure E.2 Post/stud moun
44、t package 27 Figure E.3 Cylindric package . 28 Figure E.4 Cylindric in-line package . 29 Figure E.5 Flange-mounted in-line package . 29 Figure E.6 Press package 30 Figure E.7 SMD-package with flat leads . 30 Figure E.8 SMD-Package with gull-wing leads . 31 Figure E.9 SMD-package with no leads 32 Tab
45、le A.1 Dimensions of reference letter symbols 15 BS EN IEC 60191-1:2018 4 IEC 60191-1:2018 IEC 2018 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 1: General rules for the preparation of outline drawings of discrete devices FOREWORD 1) The Intern
46、ational Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electr
47、onic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)“). Their preparation is entrusted to technical committees
48、; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Stan
49、dardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by
