1、BSI Standards Publication BS ISO/IEC 10373-3:2010 Identification cards Test methods Part 3: Integrated circuit cards with contacts and related interface devices BS ISO/IEC 10373-3:2010 Incorporating corrigendum September 2013BS ISO/IEC 10373-3:2010 BRITISH STANDARD National foreword This British Sta
2、ndard is the UK implementation of ISO/IEC 10373-3:2010, incorporating corrigendum September 2013. It supersedes BS ISO/IEC 10373-3:2001 which is withdrawn. The start and finish of text introduced or altered by corrigendum is indicated in the text by tags. Text altered by ISO/IEC corrigendum Septembe
3、r 2013 is indicated in the text by . The UK participation in its preparation was entrusted to Technical Committee IST/17, Cards and personal identification. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include
4、 all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2013. Published by BSI Standards Limited 2013 ISBN 978 0 580 84382 2 ICS 35.240.15 Compliance with a British Standard cannot confer immunity from legal obligations. This
5、British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 October 2010. Amendments/corrigenda issued since publication Date Text affected 30 September 2013 Implementation of ISO/IEC corrigendum September 2013BS ISO/IEC 10373-3:2010Reference number ISO/IE
6、C 10373-3:2010(E) ISO/IEC 2010INTERNATIONAL STANDARD ISO/IEC 10373-3 Second edition 2010-10-01 Identification cards Test methods Part 3: Integrated circuit cards with contacts and related interface devices Cartes didentification Mthodes dessai Partie 3: Cartes circuit(s) intgr(s) contacts et disposi
7、tifs dinterface assimils BS ISO/IEC 10373-3:2010 ISO/IEC 10373-3:2010(E) PDF disclaimer This PDF file may contain embedded typefaces. In accordance with Adobes licensing policy, this file may be printed or viewed but shall not be edited unless the typefaces which are embedded are licensed to and ins
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10、 please inform the Central Secretariat at the address given below. COPYRIGHT PROTECTED DOCUMENT ISO/IEC 2010 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and mi
11、crofilm, without permission in writing from either ISO at the address below or ISOs member body in the country of the requester. ISO copyright office Case postale 56 CH-1211 Geneva 20 Tel. + 41 22 749 01 11 Fax + 41 22 749 09 47 E-mail copyrightiso.org Web www.iso.org Published in Switzerland ii ISO
12、/IEC 2010 All rights reservedBS ISO/IEC 10373-3:2010 ISO/IEC 10373-3:2010(E) ISO/IEC 2010 All rights reserved iiiContents Page Foreword .v 1 Scope1 2 Normative references1 3 Terms and definitions .2 4 General items applicable to the test methods2 4.1 Test environment.2 4.2 Pre-conditioning 2 4.3 Sel
13、ection of test methods.3 4.4 Default tolerance .3 4.5 Total measurement uncertainty .3 4.6 Conventions for electrical measurements3 4.7 Apparatus.3 4.7.1 Apparatus for testing the integrated circuit cards with contacts (card-test-apparatus) .3 4.7.2 Apparatus for testing the interface device (IFD-te
14、st-apparatus)8 4.7.3 Test Scenario .13 4.8 Relationship of test methods versus base standard requirements.13 5 Test methods for electrical characteristics of cards with contacts.16 5.1 VCC contact .16 5.1.1 Apparatus.16 5.1.2 Procedure.16 5.1.3 Test report17 5.2 I/O contact 17 5.2.1 Apparatus.17 5.2
15、.2 Procedure.17 5.2.3 Test report19 5.3 CLK contact .19 5.3.1 Apparatus.19 5.3.2 Procedure.19 5.3.3 Test report20 5.4 RST contact20 5.4.1 Apparatus.20 5.4.2 Procedure.20 5.4.3 Test report21 5.5 SPU (C6) contact .21 6 Test methods for logical operations of cards with contacts 21 6.1 Answer to Reset (
16、ATR)21 6.1.1 Cold Reset and Answer-to-Reset (ATR)21 6.1.2 Warm Reset22 6.2 T=0 Protocol.22 6.2.1 I/O transmission timing for T=0 protocol22 6.2.2 I/O character repetition for T=0 protocol 23 6.2.3 I/O reception timing and error signaling for T=0 protocol 24 6.3 T=1 Protocol.25 6.3.1 I/O transmission
17、 timing for T=1 protocol25 6.3.2 I/O reception timing for T=1 protocol 25 6.3.3 Character Waiting Time ( CWT) behavior.26 6.3.4 card-reaction to IFD exceeding character waiting time ( CWT).27 6.3.5 Block Guard time ( BGT)27 6.3.6 Block sequencing by the card .28 BS ISO/IEC 10373-3:2010 ISO/IEC 10373
18、-3:2010(E) iv ISO/IEC 2010 All rights reserved6.3.7 Reaction of the card to protocol errors.31 6.3.8 Recovery of a transmission error by the card 31 6.3.9 Resynchronization.32 6.3.10 IFSD negotiation 33 6.3.11 Abortion by the IFD34 7 Test methods for physical and electrical characteristics of the IF
19、D35 7.1 Activation of contacts .35 7.1.1 Apparatus .35 7.1.2 Procedure .35 7.1.3 Test report 35 7.2 VCC contact36 7.2.1 Apparatus .36 7.2.2 Procedure .36 7.2.3 Test report 37 7.3 I/O contact 37 7.3.1 Apparatus .37 7.3.2 Procedure .37 7.3.3 Test report 39 7.4 CLK contact39 7.4.1 Apparatus .39 7.4.2 P
20、rocedure .39 7.4.3 Test report 41 7.5 RST contact41 7.5.1 Apparatus .41 7.5.2 Procedure .41 7.5.3 Test report 42 7.6 SPU (C6) contact42 7.7 Deactivation of the contacts.42 7.7.1 Apparatus .42 7.7.2 Procedure .42 7.7.3 Test report 43 8 Test methods for logical operations of the IFD 43 8.1 Answer to R
21、eset (ATR)43 8.1.1 Card Reset (cold reset) .43 8.1.2 card Reset (warm reset) 43 8.2 T=0 Protocol .44 8.2.1 I/O transmission timing for T=0 protocol 44 8.2.2 I/O character repetition for T=0 protocol.44 8.2.3 I/O reception timing and error signaling for T=0 protocol.45 8.3 T=1 Protocol .46 8.3.1 I/O
22、transmission timing for T=1 protocol 46 8.3.2 I/O reception timing for T=1 protocol 47 8.3.3 IFD Character Waiting Time ( CWT) behavior 48 8.3.4 IFD-reaction to card exceeding CWT.49 8.3.5 Block Guard time ( BGT) 49 8.3.6 Block sequencing by the IFD50 8.3.7 Recovery of a transmission error by the IF
23、D52 8.3.8 IFSC negotiation 53 8.3.9 Abortion by the card53 8.4 IFD Reaction of the IFD to invalid PCBs .54 8.4.1 Apparatus .54 8.4.2 Procedure .54 8.4.3 Test report 55 55 55BS ISO/IEC 10373-3:2010 ISO/IEC 10373-3:2010(E) ISO/IEC 2010 All rights reserved vForeword ISO (the International Organization
24、for Standardization) and IEC (the International Electrotechnical Commission) form the specialized system for worldwide standardization. National bodies that are members of ISO or IEC participate in the development of International Standards through technical committees established by the respective
25、organization to deal with particular fields of technical activity. ISO and IEC technical committees collaborate in fields of mutual interest. Other international organizations, governmental and non-governmental, in liaison with ISO and IEC, also take part in the work. In the field of information tec
26、hnology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1. International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2. The main task of the joint technical committee is to prepare International Standards. Draft International Standa
27、rds adopted by the joint technical committee are circulated to national bodies for voting. Publication as an International Standard requires approval by at least 75 % of the national bodies casting a vote. Attention is drawn to the possibility that some of the elements of this document may be the su
28、bject of patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights. ISO/IEC 10373-3 was prepared by Joint Technical Committee ISO/IEC JTC 1, Information technology, Subcommittee SC 17, Cards and personal identification. This second edition cancels and rep
29、laces the first edition (ISO/IEC 10373-3:2001), which has been technically revised. ISO/IEC 10373 consists of the following parts, under the general title Identification cards Test methods: Part 1: General characteristics Part 2: Cards with magnetic stripes Part 3: Integrated circuit cards with cont
30、acts and related interface devices Part 5: Optical memory cards Part 6: Proximity cards Part 7: Vicinity cards Part 8: USB-ICC The following part is under preparation: Part 9: Optical memory cards: Holographic recording method BS ISO/IEC 10373-3:2010BS ISO/IEC 10373-3:2010 INTERNATIONAL STANDARD ISO
31、/IEC 10373-3:2010(E) ISO/IEC 2010 All rights reserved 1Identification cards Test methods Part 3: Integrated circuit cards with contacts and related interface devices 1 Scope This part of ISO/IEC 10373 defines test methods for characteristics of integrated circuit cards with contacts and related inte
32、rface devices according to the definition given in ISO/IEC 7816. Each test method is cross-referenced to one or more base standards, which can be ISO/IEC 7810 or one or more of the supplementary International Standards that define the information storage technologies employed in identification card
33、applications. NOTE Criteria for acceptability do not form part of this part of ISO/IEC 10373 but will be found in the International Standards mentioned above. This part of ISO/IEC 10373 defines test methods which are specific to integrated circuit technology with contacts. ISO/IEC 10373-1 defines te
34、st methods which are common to one or more card technologies and other parts define other technology-specific tests. Test methods defined in this part of ISO/IEC 10373 are intended to be performed separately and independently. A given card is not required to pass through all the tests sequentially.
35、The test methods defined in this part of ISO/IEC 10373 are based on ISO/IEC 7816-3. Conformance of cards and IFDs determined using the test methods defined in this part of ISO/IEC 10373 does not preclude failures in the field. Reliability testing is outside the scope of this part of ISO/IEC 10373. T
36、his part of ISO/IEC 10373 does not define any test to establish the complete functioning of integrated circuit cards. The test methods require only that the minimum functionality be verified. Minimum functionality is defined as follows. Any integrated circuit present in the card continues to show an
37、 Answer to Reset response which conforms to the base standard. Any contacts associated with any integrated circuit present in the card continue to show electrical resistance which conforms to the base standard. 2 Normative references The following referenced documents are indispensable for the appli
38、cation of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. ISO/IEC 7810:2003, Identification cards Physical characteristics ISO/IEC 7816-3:2006, Identification cards Integrat
39、ed circuit cards Part 3: Cards with contacts Electrical interface and transmission protocols BS ISO/IEC 10373-3:2010 ISO/IEC 10373-3:2010(E) 2 ISO/IEC 2010 All rights reservedISO/IEC 7816-4:2005, Identification cards Integrated circuit cards Part 4: Organization, security and commands for interchang
40、e 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1 card integrated circuit card with contacts as defined in ISO/IEC 7816 3.2 DUT device under test card or IFD that is subject to testing 3.3 etu-factor parameters negotiable by protocol and para
41、meters selection (PPS), described in ISO/IEC 7816-3:2006, 6.3.1 3.4 IFD interface device related to integrated circuit cards with contacts as defined in ISO/IEC 7816-3 3.5 normal use use as an identification card, as defined in ISO/IEC 7810:2003, 4.1, involving equipment processes appropriate to the
42、 card technology and storage as a personal document between equipment processes 3.6 test method method for testing characteristics of identification cards and related interface devices for the purpose of confirming their compliance with International Standards 3.7 test scenario defined typical proto
43、col and application specific communication to be used with the test methods defined in this part of ISO/IEC 10373 3.8 typical protocol and application specific communication communication between a DUT and the corresponding test-apparatus based on protocol and application implemented in the DUT and
44、representing its normal use 4 General items applicable to the test methods 4.1 Test environment Unless otherwise specified, testing of physical, electrical and logical characteristics shall take place in an environment of temperature 23 C 3 C, of relative humidity 40 % to 60 %. 4.2 Pre-conditioning
45、Where pre-conditioning is required by the test method, the identification cards to be tested shall be conditioned to the test environment for a period of 24 h before testing unless otherwise specified. BS ISO/IEC 10373-3:2010 ISO/IEC 10373-3:2010(E) ISO/IEC 2010 All rights reserved 34.3 Selection of
46、 test methods Tests shall be applied as required to test the attributes of the card defined by the relevant base standard (see 4.8). 4.4 Default tolerance Unless otherwise specified, a default tolerance of 5 % shall be applied to the quantity values given to specify the characteristics of the test e
47、quipment (e.g. linear dimensions) and the test method procedures (e.g. test equipment adjustments). 4.5 Total measurement uncertainty The total measurement uncertainty for each quantity determined by these test methods shall be stated in the test report. 4.6 Conventions for electrical measurements P
48、otential differences are defined with respect to the GND contact of the card and currents flowing to the card are considered positive. 4.7 Apparatus 4.7.1 Apparatus for testing the integrated circuit cards with contacts (card-test-apparatus) 4.7.1.1 Generating the VCC voltage ( U CC ) and timing Tab
49、le 1 voltage and timing for VCC Parameter Operating Condition Range Accuracy U CCClass A, B, C -1 V to 6 V 20 mV t R , t FClass A, B, C 0 s to 500 s 100 s 4.7.1.2 Measuring ICC Table 2 I CCparameters Characteristic Mode Range Accuracy Resolution Spike Measurement 0 mA to 200 mA 2 mA 20 ns Active mode 0 mA to 100 mA 1 mA Averaged over 1 ms I CCClock stop 0 A to 200 A 10 A Averaged over 1 ms4.7.1.3 Generating SPU (C6) voltage See 5.5 and ISO/IEC 7816-3. BS ISO/IEC 10373
