1、Guidelines for principal component reliability testing for LED light sources and LED luminaires PD IEC/TS 62861:2017 BSI Standards Publication WB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National foreword This Published Document is the UK implementation of IEC/TS 62861:2017. The UK parti
2、cipation in its preparation was entrusted by Technical Committee CPL/34, Lamps and Related Equipment, to Subcommittee CPL/34/1, Electric lamps. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the nece
3、ssary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2017. Published by BSI Standards Limited 2017 ISBN 978 0 580 90084 6 ICS 29.140.99 Compliance with a British Standard cannot confer immunity from legal obligations. This Published Doc
4、ument was published under the authority of the Standards Policy and Strategy Committee on 31 March 2017. Amendments/corrigenda issued since publication Date Text affected PUBLISHED DOCUMENT PD IEC/TS 62861:2017 IEC TS 62861 Edition 1.0 2017-03 TECHNICAL SPECIFICATION Guidelines for principal compone
5、nt reliability testing for LED light sources and LED luminaires INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 29.140.99 ISBN 978-2-8322-4017-5 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. P
6、D IEC/TS 62861:2017 2 IEC TS 62861:2017 IEC 2017 CONTENTS FOREWORD . 6 INTRODUCTION . 8 1 Scope 9 2 Normative references 9 3 Terms and definitions 10 4 Component test conditions 13 5 LED package and interconnects 14 5.1 General . 14 5.2 Sampling requirements . 14 5.3 Production requirements . 14 5.4
7、 Assembly of LED packages on test boards 15 5.5 Moisture preconditioning . 15 5.6 Thermal characteristics . 15 5.7 Pre- and post-stress electrical and photometric requirements . 15 5.8 Pre- and post-stress visual inspection . 15 5.9 Solderability and resistance to soldering heat . 15 5.9.1 Solderabi
8、lity. 15 5.9.2 Resistance to soldering heat (RSH-reflow) test 15 5.10 Failure criteria . 16 5.11 Initial qualification tests for LED packages 16 5.11.1 General . 16 5.11.2 Temperature and operation stress . 17 5.11.3 Thermo-mechanical stress . 18 5.11.4 Temperature and humidity stress . 18 5.11.5 El
9、ectrical stress ESD-HBM . 19 5.11.6 Environmental stress . 19 5.12 Initial qualification test for LED package interconnects VVF . 20 5.13 Accelerated stress tests for LED package interconnects . 20 5.13.1 General . 20 5.13.2 Interconnect temperature cycling (TMCL) 21 6 Optical materials 21 6.1 Gener
10、al . 21 6.2 Optical material test samples 22 6.3 Moisture preconditioning . 22 6.4 Pre- and post-stress photometric measurements . 22 6.5 Adhesion test 23 6.6 Pre- and post-stress visual inspection . 23 6.7 Failure criteria . 23 6.8 Initial qualification tests 23 6.8.1 Relative humidity (RH) . 23 6.
11、8.2 Boiling water (BW) . 24 6.8.3 Oven water (OW) . 24 6.8.4 High temperature exposure (HTE) . 24 6.9 Accelerated stress tests 24 6.9.1 Prediction models 24 6.9.2 Temperature and humidity (TH) . 25 PD IEC/TS 62861:2017IEC TS 62861:2017 IEC 2017 3 6.9.3 Temperature and light exposure (TL) . 25 6.10 L
12、ight-transmitting materials . 26 6.11 Light-reflecting materials . 26 6.11.1 Dichroic-coated glass and aluminium-coated glass 26 6.11.2 Aluminium-coated plastic . 26 6.11.3 White plastic/non-coated plastic 26 6.12 Optical converters . 27 7 Electronic subassemblies 27 7.1 General . 27 7.2 Sampling re
13、quirements . 27 7.3 Production requirements . 27 7.4 Pre- and post-stress electrical requirements . 28 7.5 Pre- and post-stress visual inspection . 28 7.6 Failure criteria . 28 7.7 Initial qualification tests 28 7.7.1 Temperature and operation stress (PTC) . 28 7.7.2 Humidity and operation stress (H
14、OT) . 29 7.8 Accelerated stress tests 29 7.8.1 Prediction models 29 7.8.2 Temperature, humidity and operation stress (sequential ALT) 29 8 Active and passive cooling systems . 30 8.1 General . 30 8.2 Cooling system test samples . 31 8.3 Moisture preconditioning . 32 8.4 Thermal resistance test . 32
15、8.5 Performance parameter test 32 8.6 Pre- and post-stress cooling performance requirements 32 8.7 Pre- and post-stress visual inspection . 32 8.8 Failure criteria . 32 8.9 Initial qualification tests 33 8.9.1 General . 33 8.9.2 Dust. 33 8.10 Accelerated stress tests 34 8.10.1 General . 34 8.10.2 Cy
16、clic temperature test (CT) with humidity and with/without operational stress 34 8.10.3 Temperature life test (TLT) passive cooling system . 34 8.10.4 Temperature life test (TLT) active cooling system 35 9 Construction materials . 35 9.1 General . 35 9.2 Mechanical components and interconnects . 36 9
17、.3 Mechanical interfaces between different components 36 9.4 Chemical interactions 37 10 Final product testing 38 10.1 General . 38 10.2 Principal component reliability in the final product . 38 10.3 Minimum validated AST time . 39 10.4 Final product qualification for reliability . 40 11 Product upd
18、ates 40 PD IEC/TS 62861:2017 4 IEC TS 62861:2017 IEC 2017 (informative) Application profiles 42 Annex A(informative) Acceleration models 43 Annex BGeneral . 43 B.1Arrhenius model 43 B.2Eyring model . 44 B.3Coffin-Manson model 44 B.4Norris-Landzberg model 44 B.5(Inverse) power law. 45 B.6Peck model .
19、 45 B.7Generalized Eyring model . 45 B.8Sample size calculation 46 B.9Basic guidelines 47 B.10Example 47 B.11(informative) System reliability . 49 Annex CGeneral . 49 C.1Basic principles . 49 C.2Testing on the system level . 49 C.3System reliability prediction 50 C.4 C.4.1 General . 50 C.4.2 Block d
20、iagrams 50 C.4.3 Fault tree . 51 C.4.4 Markov chains . 51 C.4.5 Bayesian networks . 51 C.4.6 Chi-square . 52 (informative) Qualification flowcharts . 54 Annex DGeneral . 54 D.1Qualification flowcharts of principal components . 54 D.2(informative) Physical analysis for principal components 59 Annex E
21、General . 59 E.1DPA for LED packages and interconnects . 59 E.2DPA for optical materials 60 E.3PA for electronics . 60 E.4PA for active and passive cooling systems 61 E.5DPA for mechanical 61 E.6(normative) Principal component test report . 62 Annex F Bibliography 64 Figure D.1 Qualification flowcha
22、rt for LED package and interconnects . 54 Figure D.2 Qualification flowchart for optical materials . 55 Figure D.3 Qualification flowchart for electronic subassemblies . 56 Figure D.4 Qualification flowchart for active and passive cooling systems 57 Figure D.5 Qualification flowchart for constructio
23、n materials 58 Table 1 Mapping the LED package interconnects qualification tests to the useable acceleration model with typical range of the acceleration factor 20 Table 2 Duration (cycles) of temperature application 21 Table 3 Mapping of the optical-material related accelerated stress tests 24 PD I
24、EC/TS 62861:2017IEC TS 62861:2017 IEC 2017 5 Table 4 Mapping the electronic subassembly qualification tests to the useable acceleration model with typical range of the acceleration factor 29 Table 5 Example ALT profile for an electronic subassembly . 30 Table 6 Examples of stressors, affected part o
25、f the cooling systems and its reliability effect. . 31 Table 7 Mapping the cooling system qualification tests to the useable acceleration model with typical range of the acceleration factor 34 Table 8 List of undesired chemicals in LED products for general lighting. 38 Table 9 Influence of the princ
26、ipal components on the final product. 39 Table 10 Example list of validated AST times. 40 Table 11 Minor and major change list per principal component. . 41 Table A.1 Example of two application profiles 42 Table B.1 Sample sizes versus confidence and reliability level assuming L = T AF 47 Table B.2
27、Example of calculated acceleration factors . 48 Table C.1 Example test scheme and results for Chi-square 53 Table F.1 Example overview reporting format 63 PD IEC/TS 62861:2017 6 IEC TS 62861:2017 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TEST
28、ING FOR LED LIGHT SOURCES AND LED LUMINAIRES FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on al
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41、ification, has been prepared by subcommittee 34A: Lamps, of IEC technical committee 34: Lamps and related equipment. PD IEC/TS 62861:2017IEC TS 62861:2017 IEC 2017 7 The text of this Technical Specification is based on the following documents: Enquiry draft Report on voting 34A/1884/DTS 34A/1966/RVD
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44、A bilingual version of this publication may be issued at a later date. PD IEC/TS 62861:2017 8 IEC TS 62861:2017 IEC 2017 INTRODUCTION LED products depend generally on how balanced its principal components are in terms of their reliability. It is not only the LED components that determine product per
45、formance, but also other parts of the LED product play an equally important role. For instance, electronic subassemblies, optics, mechanics and the involved cooling method play such a role. This Technical Specification envisions a methodology, which addresses separate subcomponent reliability data,
46、to provide a basis for statistical system reliability design. Standardized reporting formats and flowcharts are presented. Next, protocols based on accelerated methods are given to estimate system reliability of the final product using subcomponent data. Verification of LED product lifetime is based
47、 on a test to pass principle, which means the components of the product under test are evaluated to give equivalent reliability confidence to that which would be achieved by real-time life testing of the complete LED product. The tests described in this Technical Specification are divided into: init
48、ial qualification tests (IQT) giving confidence of basic component robustness, but not linked to any specific lifetime projection, and accelerated stress tests (AST) giving confidence of reliability to a specific lifetime (within the specified constraints of the test). Since the approach foreseen in
49、 this Technical Specification covers a generic methodology, it can be seen as guidance related to relevant product performance standards, such as the LED lamp performance standard IEC 62612, the LED module performance standard IEC 62717 and LED luminaire performance standard IEC 62722-2-1. This Technical Specification is not recommended for use as a normative reference to the LED product performance standards. This Technical Specification addresses the need for a doc
