1、BRITISH STANDARD BS QC 790106:1995 IEC 748-2-9: 1994 Specification for Harmonized system of quality assessment for electronic components Semiconductor devices Integrated circuits: Digital integrated circuits Blankdetail specification MOSultraviolet light erasable electrically programmable read-only
2、memoriesBSQC790106:1995 BSI 02-2000 ISBN 0 580 34463 0 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/47 Semiconductors, upon which the following bodies were represented: Federation of the Electronics Industry GAMBIC
3、A (BEAMA Ltd.) Ministry of Defence Society of British Aerospace Companies Limited The following bodies were also represented in the drafting of the standard, through subcommittees and panels: British Telecommunications Plc Federation of the Electronics Industry National Supervising Inspectorate (BSI
4、 QA) Amendments issued since publication Amd. No. Date CommentsBSQC790106:1995 BSI 02-2000 i Contents Page Committees responsible Inside front cover National foreword ii Text of IEC 748-2-9 1BSQC790106:1995 ii BSI 02-2000 National foreword This British Standard has been prepared under the direction
5、of the Electrotechnical Sector Board. It is identical with IEC Publication 748-2-9 (QC709106) Semiconductor devices Integrated circuits. Part 2: Digital integrated circuits. Section 9: Blank detail specification for MOS ultraviolet lighterasable electrically programmable read-only memories, publishe
6、d by the International Electrotechnical Commission (IEC) and is a harmonized specification within the IECQ system of quality assessment for electronic components. IEC 748-2-9 was prepared by subcommittee 47A Integrated circuits of Technical Committee No. 47 Semiconductor devices, and the United King
7、dom participation in the drafting was provided by Technical Committee EPL/47, Semiconductors. Scope This standard lists the test and inspection requirements, together with the essential descriptive parameters, limiting values, electrical characteristics and marking and ordering information which sha
8、ll be included as mandatory requirements in any detail specification for these components. The British Standard which implements the IECQ Rules of Procedure is BS 9000 General requirements for a system of electronic components of assessed quality Part 3:1991 Specification for the national implementa
9、tion of the IECQ System. Detail Specifications Detail specifications shall comply with the requirements of this Blank Detail Specification and BS QC 001002:1991 Rules of Procedure of the IEC Quality assessment System for Electronic Components (IECQ). Cross-references Publication referred to Correspo
10、nding British Standard IEC 68-2-17:1978 BS 2011 Environmental testing Part 2.1 Tests Part 2.1Q:1981 Test Q. Sealing IEC 617-12:1991 BS 3939 Graphical symbols for electrical power, telecommunications and electronics diagrams Part 12:1991 Guide for binary logic elements IEC 747-10:1991 BS QC 700000:19
11、91 Harmonized system of quality assessment for electronic components. Generic specification for discrete devices and integrated circuits IEC 748-2:1985 BS 6493 Semiconductor devices Part 2 Integrated circuits Section 2.2:1986 Recommendations for digital integrated circuits IEC 748-11:1990 BS QC 7901
12、00:1991 Harmonized system of quality assessment for electronic components. Semiconductor devices. Sectional specification for semiconductor integrated circuits excluding hybrid circuits IEC 749:1984 BS 6493 Semiconductor devices Part 3:1985 Mechanical and climatic test methodsBSQC790106:1995 BSI 02-
13、2000 iii A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document c
14、omprises a front cover, an inside front cover, pagesi toiv, theIEC title page, pages ii to iv, pages1 to15 and abackcover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover.iv blankBSQ
15、C790106:1995 ii BSI 02-2000 Contents Page Introduction 1 1 Marking and ordering information 3 2 Application related description 3 3 Specification of the function 3 4 Limiting values (absolute maximum rating system) 4 5 Operating conditions (within the specified operating temperature range) 5 6 Elect
16、rical characteristics 5 7 Programming 7 8 Mechanical and environmental ratings, characteristics and data 7 9 Additional information 7 10 Screening procedure (if required) 8 11 Quality assessment procedures 8 12 Structural similarity procedures 8 13 Test conditions and inspection requirements 8 14 Ad
17、ditional measurement method 12 Annex A (normative) Programming and erasing 14 Table 1 Group A: Lot-by-lot 9 Table 2 Group B: Lot-by-lot 10 Table 3 Group C: Periodic 11 Table 4 Group D 12 Table A.1 14BSQC790106:1995 BSI 02-2000 iii The following publications are quoted in this standard: IEC 68-2-17:1
18、978 Environmental testing Part 2: Tests Test Q: Sealing IEC 134:1961 Rating systems for electronic tubes and valves and analogous semi-conductor devices IEC 617-12:1991 Graphical symbols for diagrams Part 12: Binary logic elements IEC 747-10:1991 Semiconductor devices Discrete devices and integrated
19、 circuits Part 10: Generic specification for discrete devices and integrated circuits IEC 748-2:1985 Semiconductor devices Integrated circuits Part2:Digital integrated circuits Amendment No. 1 (1991). IEC 748-11:1990 Semiconductor devices Integrated circuits Part11:Sectional specification for semico
20、nductor integrated circuits excluding hybrid circuits IEC 749:1984 Semiconductor devices Mechanical and climatic test methods Amendment No. 1 (1991) Amendment No. 2 (1993).iv blankBSQC790106:1995 BSI 02-2000 1 Introduction The IEC Quality Assessment System for Electronic Components is operated in ac
21、cordance with the statutes of the IEC and under the authority of the IEC. The object of this system is to define quality assessment procedures in such a manner that electronic components released by one participating country as conforming with the requirements of an applicable specification are equa
22、lly acceptable in all other participating countries without the need for further testing. This blank detail specification is one of a series of blank detail specifications for semi-conductor devices and shall be used with the following publications: IEC 747-10/QC 700000: Semiconductor devices Discre
23、te devices and integrated circuits Part10:Generic specification for discrete devices and integrated circuits IEC 748-11/QC 790100: Semiconductor devices Integrated circuits Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits Required information Numbers s
24、hown in brackets on this page and the following pages correspond to the following items of required information, which should be entered in the spaces provided on the next page of this specification. Identification of the detail specification 1 The name of the National Standards Organization under w
25、hose authority the detail specification is issued. 2 The IECQ number of the detail specification. 3 The numbers and issue numbers of the generic and sectional specifications. 4 The national number of the detail specification, date of issue and any further information, if required by the national sys
26、tem. Identification of the component 5 Main function and type number. 6 Information on typical construction (materials, the main technology) and the package. If applicable, variants of the products shall be given here together with the variant characteristics. The detail specification shall give a b
27、rief description including the following: technology (N MOS, etc.); structure (words bits); type of output circuit (e.g.: three state); major functions. 7 Outline drawing, terminal identification, marking, and/or reference of the relevant document for outlines. 8 Category of assessed quality accordi
28、ng to 2.6 of the generic specification. 9 Reference data. The clauses given in square brackets on the next page of this standard, which forms the front page of the detail specification, are intended for guidance to the specification writer and shall not be included in the detail specification. When
29、confusion may arise as to whether the paragraph is only instruction to the writer or not, the paragraph shall be indicated between brackets.BSQC790106:1995 2 BSI 02-2000 Name (address) of responsible NAI (and possibly of body from which specification is available). 1 Number of IECQ detail specificat
30、ion, plus issue number and/or date. QC 790106-. 2 ELECTRONIC COMPONENT OF ASSESSED QUALITY IN ACCORDANCE WITH: 3 National number of the detail specification. 4 Generic specification: Publication 747-10/QC 700000 This box need not be used if national number repeats IECQ number. Sectional specificatio
31、n: Publication 748-11/QC 790100 and national references if different. BLANK DETAIL SPECIFICATION FOR MOS ULTRAVIOLET LIGHT ERASABLE ELECTRICALLY PROGRAMMABLE READ-ONLY MEMORIES 5 Type number(s) of the relevant device(s). Ordering information: see 1.2 of this standard. Mechanical description 7 Short
32、description 6 Outline references: Standard package references should be given, IEC number (mandatory if available) and/or national number. Application: Function: Typical construction: Si, monolithic, MOS. Encapsulation: cavity or non-cavity. Comparison table of characteristics for variant products.
33、Outline drawing may be transferred to or given with more details in clause 8 of this standard. CAUTION: Electrostatic sensitive devices Terminal identification Categories of assessed quality 8 drawing showing pin assignments, including graphical symbols. From 2.6 of the generic specification. Markin
34、g: letters and figures, or colour code. Reference data 9 The detail specification shall prescribe the information to be marked on the device, if any. See 2.5 of generic specification and/or 1.1 of this standard. Reference data on the most important properties to permit comparison between types. Info
35、rmation about manufacturers who have components qualified to this detail specification is available in the current Qualified Products List.BSQC790106:1995 BSI 02-2000 3 1 Marking and ordering information 1.1 Marking See 2.5 of the generic specification. 1.2 Ordering information The following minimum
36、 information is necessary to order a specific device, unless otherwise specified: precise type reference (and nominal voltage value, if required); IECQ reference of the detail specification with issue number and/or date when relevant; categories as defined in clause 9 of the sectional specification
37、and, if required, the screening sequence as defined in clause 8 of the sectional specification; packaging for delivery; any other particulars. A statement should be made in the ordering information stating that the device will be supplied either unprogrammed or programmed. Description of the program
38、me shall be supplied. 2 Application related description The following characteristics shall be given: nominal supply voltage; nominal current consumption (if applicable); stand-by current consumption; operating modes; electrical compatibility (if appropriate). It shall be stated whether the integrat
39、ed circuit memory is electrically compatible with other particular integrated circuits or families of integrated circuits, or whether special interfaces are required. The programming and erasing conditions are described in the annex of the detail specification. 3 Specification of the function 3.1 Bl
40、ock diagram The block diagram shall be sufficiently detailed to enable the individual functional units within the memory to be identified with their main input and output paths and the identification of their external connections (chip enable, address decode.). The graphical symbol for the function
41、shall be given. This may be obtained from a catalogue of standards of graphical symbols, or designed according to the rules of IEC 617-12. 3.2 Identification and function of terminals All terminals shall be identified on the block diagram (supply terminals, address, data and control terminals). The
42、terminal functions shall be indicated in a table as follows. Terminal number Terminal symbol Terminal designation Function Function of terminal Input/output identification Type of output circuitBSQC790106:1995 4 BSI 02-2000 3.3 Functional description The following characteristics shall be given: mem
43、ory size: the total number of bits of information capable of being stored in the memory circuit; memory organization: the number of bits per word capable of being stored in the memory circuit; addressing mode (e.g.: multiplexed, latched, etc.); chip select 1)(if applicable); output enable 1)(if appl
44、icable); stand-by mode (if applicable); truth table (this table shall show the output states versus the different combinations of the address inputs and the select inputs). The product is designed to be electrically programmed and UV light erasable. The initial logic state of the whole memory shall
45、be specified. It should be stated whether it is possible to modify the memory content of unprogrammed cells. The normalfunctioning of the memory shall not change its content. The programming conditions are defined in clause 7. The erasure allowing return to the unprogrammed logic state of memory cel
46、ls is done on all the memory cells. 4 Limiting values (absolute maximum rating system) See IEC 134. These values apply over the operating temperature range, unless otherwise specified. Unless otherwise specified, limiting values shall be given as follows: Any cautionary statement unique to an indivi
47、dual integrated circuit shall be included, for example the handling of MOS circuits. Any interdependence of limiting values shall be specified. All conditions for which the limiting values apply shall be stated. If transient overloads are permitted, their magnitude and duration shall be specified. A
48、ll voltages are referenced to a designated reference terminal. 1) The chip select and the output enable shall be distinguished. Parameters Symbols Min. a Max. a Unit Supply voltage V CC V Programming supply voltage V PP V Input voltages V I V Output voltages V O V Off-state voltage (note 1) V OZ V O
49、utput currents I O mA Input currents I I mA Power dissipation P D n.a. W Operating temperature T amb C Storage temperature T stg C NOTE 1Where appropriate. a Algebraic valuesBSQC790106:1995 BSI 02-2000 5 5 Operating conditions (within the specified operating temperature range) These conditions are not to be inspected but may be used for quality assessmen
