1、BRITISH STANDARD BS QC790130: 1992 IEC748-2-3: 1992 Specification for Harmonized system of quality assessment for electronic components Semiconductor devices Integrated circuits Blank detail specification HCMOS digital integrated circuits (series54/74 HC,54/74 HCT,54/74 HCU)BSQC790130:1992 BSI10-199
2、9 ISBN 0 580 35529 2 Amendments issued since publication Amd. No. Date CommentsBSQC790130:1992 BSI 10-1999 i Contents Page National foreword ii Introduction 1 1 Marking and ordering information 2 2 Application related description 3 3 Specification of the function 3 4 Limiting values 3 5 Operating co
3、nditions 3 6 Electrical characteristics 3 7 Programming 4 8 Mechanical and environmental ratings, characteristics and data 4 9 Additional information 4 10 Screening 4 11 Quality assessment procedures 5 12 Structural similarity procedures 5 13 Test conditions and inspection requirements 5 14 Addition
4、al measurement method 9 Table I Group A 6 Table II Group B 7 Table III Group C 8 Table IV Group D 9BSQC790130:1992 ii BSI 10-1999 National foreword This British Standard has been prepared under the direction of the Electronic Components Standards Policy Committee, ECL/-. It is identical with IEC Pub
5、lication748-2-3 (QC790130) “Semiconductor devices.Integrated circuits. Part 2: Digital integrated circuits. Section 3 Blank detail specification for HCMOS digital integrated circuits (series54/74 HC,54/74 HCT,54/74 HCU)” published by the International Electrotechnical Commission (IEC) and is a harmo
6、nized specification within the IECQ system of quality assessment for electronic components. This blank detail specification is one of a series of blank detail specifications for semiconductor devices to be used with BS QC700000:1991 “Harmonized system of quality assessment for electronic components.
7、 Generic specification for discrete devices and integrated circuits”. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immu
8、nity from legal obligations. Cross-references International Standard a Corresponding British Standard IEC68-2-17 BS2011 Environmental testing Part2.1 Q:1981 Test Q. Sealing (Identical) IEC617-12 BS3939 Guide for graphical symbols for electrical power, telecommunications and electronics diagrams Part
9、12:1985 Binary logic elements (Identical) IEC747-10 BS QC700000:1991 Harmonized system of quality assessment for electronic components. Generic specification for discrete devices and integrated circuits (Identical) IEC748-11 BS QC790100:1991 Harmonized system of quality assessment for electronic com
10、ponents. Semiconductor devices. Sectional specification for semiconductor integrated circuits excluding hybrid circuits (Identical) IEC749 BS6493 Semiconductor devices Part3:1985 Mechanical and climatic test methods (Identical) QC001002 BS QC001002:1991 Rules of Procedure of the IEC Quality Assessme
11、nt System for Electronic Components (IECQ) (Identical) a Undated in the text. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages1 to9 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This
12、 will be indicated in the amendment table on the inside front cover.BSQC790130:1992 BSI 10-1999 1 Introduction The IEC Quality Assessment System for Electronic Components is operated in accordance with the statutes of the IEC and under the authority of the IEC. The object of this system is to define
13、 quality assessment procedures in such a manner that electronic components released by one participating country as conforming with the requirements of an applicable specification are equally acceptable in all other participating countries without the need for further testing. This blank detail spec
14、ification is one of a series of blank detail specifications for semiconductor devices and shall be used with the following IEC publication: 747-10/QC700000: Semiconductor devices. Part 10: Generic specification for discrete devices and integrated circuits. Required information Numbers shown in brack
15、ets on this and the following pages correspond to the following items of required information, which should be entered in the spaces provided. Identification of the detail specification 1 The name of the National Standards Organization under whose authority the detail specification is issued. 2 The
16、IECQ number of the detail specification. 3 The numbers and issue numbers of the generic and sectional specifications. 4 The national number of the detail specification, date of issue and any further information, if required by the national system. Identification of the component 5 Main function and
17、type number. 6 Information on typical construction (materials, main technology) and the package. If the device has several kinds of derivative products, those differences shall be indicated, e.g.features of characteristics in the comparison table. If the device is electrostatic sensitive, a caution
18、statement shall be added in the detail specification. 7 Outline drawing, terminal identification, marking and/or reference to the relevant document for outlines. 8 Category of assessed quality according to subclause2.6 of the generic specification. 9 Reference data. The clauses given in square brack
19、ets on the next pages of this standard, which form the front page of the detail specification, are intended for guidance to the specification writer and shall not be included in the detail specification. When confusion may arise as to whether a paragraph is only instruction to the writer or not, the
20、 paragraph shall be indicated between brackets.BSQC790130:1992 2 BSI 10-1999 1 Marking and ordering information 1.1 Marking Any particular information other than that given in box7 and/or subclause2.5 of the generic specification. 1.2 Ordering information The following minimum information is necessa
21、ry to order a specific device, unless otherwise specified: precise type reference (and nominal voltage value, if required); IECQ reference of detail specification with issue number and/or date when relevant; Name (address) of responsible NAI (and possibly of body from which specification is availabl
22、e). 1 Number of IECQ detail specification, plus issue number and/or date. QC 790130-. 2 ELECTRONIC COMPONENT OF ASSESSED QUALITY IN ACCORDANCE WITH: 3 National number of detail specification 4 Generic specification: Publication747-10/QC700000 Sectional specification: Publication748-11/QC790100 Famil
23、y specification: Publication748-2-2/QC790109 and national references if different. This box need not be used if national number repeats IECQ number. BLANK DETAIL SPECIFICATION FOR HCMOS DIGITAL INTEGRATED CIRCUITS, SERIES54/74 HC,54/74 HCT, 54/74 HCU Type number(s) of the relevant device(s). Orderin
24、g information: see subclause1.2 of this standard. 5 Mechanical description 7 Short description 6 Outline references: Standard package references should be given, IEC number (mandatory if available) and/or national number. Outline drawing may be transferred to or given with more details in clause8 of
25、 this standard. Application: see clause6 of this standard. Function: see clause3 of this standard. Typical construction: Si. Encapsulation: cavity or non-cavity. Comparison table of characteristics for variant products. CAUTION: Electrostatic sensitive devices. Terminal identification drawing showin
26、g pin assignments, including graphical symbols. Categories of assessed quality from subclause2.6 of the generic specification. 8 Marking: letters and figures, or colour code. The detail specification shall prescribe the information to be marked on the device, if any. See subclause2.5 of generic spec
27、ification and/or subclause1.1 of this standard. Reference data Reference data on the most important properties to permit comparison between types. 9 Information about manufacturers who have components qualified to this detail specification is available in the current Qualified Products List.BSQC7901
28、30:1992 BSI 10-1999 3 category of assessed quality as defined in subclause2.6 of the generic specification and in clause9 of the sectional specification and, if required, screening sequence as defined in clause8 of the sectional specification; any other particulars. 2 Application related description
29、 See information given in box6. 3 Specification of the function 3.1 Detailed block diagram A detailed block diagram of the device shall be given. The graphical symbol for the function shall be given. This may be obtained from a catalogue of standards of graphical symbols, or designed according to th
30、e rules of IEC Publication617-12. 3.2 Identification and function of terminals All terminals shall be identified on the block diagram (supply terminals, input or output terminals, input/output terminals). The terminal functions shall be indicated in a table as follows: 3.3 Functional description A f
31、unctional table shall be given here. 4 Limiting values (absolute maximum rating system) These values apply over the operating temperature range, unless otherwise specified. Curves shall preferably be given under clause9 of this standard. All voltages are referenced to V ss . 5 Operating conditions (
32、within the specified operating temperature range) See clause5 of the family specification, subclauses: 5.2, 5.3 (HC),5.13, 5.14 (HCT),5.24, 5.25 (HCU) and5.32.3 (HC, HCT). 6 Electrical characteristics See clause13 of this standard for inspection requirements. Recommended supply voltage range: see cl
33、ause5 of the family specification. The electrical characteristics apply over the operating temperature range, unless otherwise stated. All voltages are referenced to V ss . Terminal number Terminal symbol Terminal designation Function Function of terminal Input/output identification Type of output c
34、ircuit Subclause Limiting values Symbol Value Min. Max. 4.1 or 4.10 See family specification XBSQC790130:1992 4 BSI 10-1999 6.1 Static characteristics See clause5 of the family specification, subclauses: 5.1, 5.4 to5.8, 5.10, 5.11 (HC),5.12, 5.15 to5.19 (HCT),5.23, 5.25 to5.28, 5.30, 5.31 (HCU). 6.2
35、 Dynamic characteristics See clause5 of the family specification, subclauses5.32.1 and5.32.2 (HC, HCT). 6.3 Timing diagram See subclause5.32.4 of the family specification. 6.4 Capacitances See clause5 of the family specification, subclauses: 5.9: C IA , C OZ(HC),5.20: C I , C OZ(HCT) and5.29: C IA(H
36、CU). 7 Programming Not appropriate. 8 Mechanical and environmental ratings, characteristics and data See subclause12.2 of the sectional specification. 9 Additional information See also family specification. To be given only as far as necessary for the specification and use of the device, for instanc
37、e: temperature derating curves referred to in the limiting values; complete definition of a circuit for measurement, or of an additional method; detailed outline drawing. 10 Screening (if required) See clause8 of the sectional specification. Burn-in conditions: the following information shall be spe
38、cified: ambient temperature; supply voltage; frequency; Characteristics V DD V Symbol T amb Unit 54 HC/74 HC See note 1 74 HC See note 2 54 HC See note 3 Min. Max. Min. Max. Min. Max. Propagation time Output enable time Output disable time Set-up time Hold time Pulse width t PHL t PLH t PZH t PZL t
39、PHZ t PLZ t su t h t W x x x x x x x x x x x x x x x x x x x x x x x x x x x ns ns ns ns ns ns ns ns ns NOTE 1+25 C NOTE 240 C to+85 C NOTE 355 C to+125 C.BSQC790130:1992 BSI 10-1999 5 circuit diagram and conditions. 11 Quality assessment procedures 11.1 Qualification approval procedures See clause3
40、 of the generic specification and subclause5.1 of the sectional specification. 11.2 Capability approval procedures Under consideration. 12 Structural similarity procedures See clause6 of the sectional specification. 13 Test conditions and inspection requirements 13.1 General These are given in the f
41、ollowing tables, where the values and exact test conditions to be used shall be specified as required for a given type, and as required by the relevant test in the relevant publication. The choice between alternative tests or test methods shall be made when a detail specification is written. When se
42、veral devices are included in the same detail specification, the relevant conditions and/or values should be given on successive lines, where possible avoiding repetition of identical conditions and/or values. Endurance tests The conditions under which endurance tests are carried out shall be determ
43、ined as follows: The choice of power dissipation, operating temperature and supply voltage shall be made in the following order of precedence: a) the mean power dissipation in each functionally accessible section of the circuit shall be the maximum permitted by the detail specification; b) the ambie
44、nt or reference-point temperature shall be the maximum permitted by the detail specification at the power dissipation of a); c) the supply voltages shall be the maximum permitted by the detail specification unless limited by a) or b). 13.2 Sampling requirements See clause9 of the sectional specifica
45、tion. 13.3 Inspection tables Tests shall be made at25 C, unless otherwise specified. Tests marked (D) are destructive tests. BSQC790130:1992 6 BSI 10-1999 Table I Group A NOTE 4The manufacturer may use test results at25 C if he can demonstrate, on a periodic basis, the correlation with those at the
46、two extremes of temperature. Lot-by-lot Sub-group Examination or test Conditions of test Limits A1 External visual examination 747-10, subcl.4.2.1.1 A2 Verification of the function at25 C, unless otherwise specified In accordance with clause3 of this specification A2a (Not applicable to category I)
47、Verification of the function at minimum and maximum operating temperatures(seenote4) A3 Static characteristics at25 C See subclause6.1 of this specification See subclause6.1 of this specification and the relevant detail specification A3a Static characteristics at minimum and maximum operating temper
48、atures At T amb = T ambmax. and T ambmin. Same conditions as sub-group A3 above Limits may be different from those in sub-group A3 A4 Dynamic characteristics at25 C, unless otherwise specified See subclause6.2 of this specification See subclause6.2 of this specification A4a (Not applicable to catego
49、ry I) Dynamic characteristics at minimum and maximum operating temperatures(seenote4) At T amb = T ambmax. and T ambmin. Same conditions as sub-group A4 above Limits may be different from those in sub-group A4 BSQC790130:1992 BSI 10-1999 7 Table II Group B Lot-by-lot (in the case of category I, see the generic specification,subclause 2.6) Sub-group Examination or test IEC publication Details of condition
