1、.MIIAWD-1547B (USAF)01DEC 1992SUPERSEDINGMIL-STD-1547ADATED 01DEC 1987MILITARY STANDARDELECTRONIC PARTS, MATERIALS, AND PROCESSESFOR SPACE AND LAUNCH VEHICLESAMSC WA FSC 1820DISTRIBUTION STATEMENT A: Approvedforpublicrekwe,distributionunlimitedProvided by IHSNot for ResaleNo reproduction or networki
2、ng permitted without license from IHS-,-,-MIL-STD-1547BDEPARTMENT OF THE AIR FORCEWashington, D.C. 20330MIL-STD-1547B (USAF)Electronic Parts, Materials, and Processes for Space and LaunchVehicles1. This Military Standard is approved for use by theDepartment of the Air Force, and is available for use
3、 by allDepartments and Agencies of the Department of Defense.2. Beneficial comments (recommendations, additions,deletions) and any pertinent data which may be of use inimproving this document should be addressed to:USAF Space and Missile Systems Center, SMC/SDFPP. O. BoX 92960Worldway Postal CenterL
4、os Angeles, CA 90009-2960by using the self-addressed Standardization Document ImprovementProposal (DD Form 1426) appearing at the end of this document orby letter.iiProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-IMIL-STD-1547BFOREWORDThe requirement
5、s of this standard were developed for longlife and/or high reliability space and launch vehicles andequipment. To ensure successful operations of space equipment,attention to every detail is required at every level of assemblythroughout development, manufacture, qualification, and testing,starting w
6、ith the parts, materials, and processes used. Forspace and launch vehicles, if parts, materials and processes havedefects or lack the required reliability, success may never beachieved.Analysis of space mission failures and on orbit anomalies bythe USAF Space Systems Division revealed that the nonav
7、ailabilityof reliable space quality electronic piece parts was a seriousdeterrent to achieving space mission success. In responding tothis problem, the USAF Space.Systems Division initiated a programwith the objective of establishing a “space quality baseline” ofparts, materials, and processes that
8、have a proven track recordof high reliability. In addition, this standard was developed todocument the technical requirements for parts, materials, andprocesses for space and launch vehicles.The objective of this parts, materials, and processescontrol program standard is to ensure technical baseline
9、 in theselection, application, procurement, control and standardizationof parts (electrical and mechanical), materials, and processesfor space and launch vehicles. The requirements presented hereinshould reduce program costs and should improve the reliability ofspace and launch vehicles.iiiProvided
10、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1547BCONTENTSSECTION1.11.21.32.2.12.22.33.3.13.23.33.43.5“ 3.63.73.83.93.103.113.12SCOPE . . . .PURPOSE . . .APPLICATION OFPMP MANAGEMENT. . . . . . . . . . . . .THE STANDARDAUTHORITYREFERENCED DOCUMENTS
11、 .GOVERNMENT DOCUMENTS .NONGOVERNMENT DOCUMENTS.ORDER OF PRECEDENCEDEFINITIONS . . . .ACQUISITION ACTIVITYCASE TEMPERATURE .CONTRACTING OFFICERDERATING . . . . .DESTRUCTIVE PHYSICALELECTRONIC PARTS .a71.a71a15a15a15a15.a71.a71.,END-OF-LIFE DESIGN LIMITHOT-WELDED CAN . . . .MANUFACTURING BASELINEMATE
12、RIAL .MATERIAL IAITPART . . . .* . . . . . . . . . . . . . .*. . .a71.(DPA). . .0. . . . .*. . . . .a71a15a15a15a15a15a15a15a15a15a15a15a15a15a15a15a15a15a15.a71a15a15a15a15a15a15a15a15a15a15a15a15a15a15a15a15a71a15a15.*.a71a15a15a15a15a15a15.a71a15a15a15a15a15a15a15a15a15a15a15a15a15a15a15a15PAGE.a
13、71a15a15a15a15a15a15a15a15a15a15a15a15a15a15a15a15.1.1. 1.1. 2. 2111213131313131314141414141515Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SECTION3.13.3.143.153.163.174.4.14.1.14.1.24.1.34.1.44.1.54.1.64.1.74.1.84.1.94.1.104.24.34.3.14.3.24.3.3MI
14、L-STD-1547BCONTENTSPAGEPARTS, MATERIALS, AND PROCESSES CONTROL BOARD(PMPCB) . . . . . . . . . . . . . . . . . . .PERCENT DEFECTIVE ALLOWABLE (PDA) . . . . . .PROCESS . . . . . . . . . . . . . . . . . . .PRODUCTION LOT . . . . . . . . . . . . . . .REGISTERED PART, MATERIAL AND PROCESSES (PMP)GENERAL
15、REQUIREMENTS . . . . . . . . . . . .APPLICATION REQUIREMENTS . . . . . . . . . .Electrical Derating . . . . . . . . . . . . .Mechanical derating . . . . . . . . . . . . .End-of-life . . . . . . . . . . . . . . . . .Aging Sensitivity . . . . . . . . . . . .Sealed Packages , . . . . . . . . . . . . .
16、.RecjisteredPMP . . . . . . . . . . . . . . .Handling . . . . . . . . . . . . . . . . . .Marking . . . . . . . . . . . . . . . . . . .Outgassing . . . . . . . . . . . . . . . . .Alternate QCI Test/Sampling Plan . . . . . .PART REQUIREMENTS . . . . . . . . . . . . . .PART DESIGN AND CONSTRUCTION . .
17、. . . . . .Design . . . . . . . . . . . . . . . . . . .Material Hazards . . . . . . . . . . . . . .Tin-Coated Surfaces . . . . . . . . . . . . .v15151515151717171717171818181818182020202020Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SECTION4.3.3.
18、14.3.3.24.3.3.2.14.3.3.34.3*44.3.54.44.4.14.4.24.4.34.4.44.4.54.54.5.14.5.24.5.34.5.44.64.75.100MIL-STD-1547BCONTENTSJ?lK.EPure Tin Coatings . . . . . . . . . . . . . .Electronic Part Terminals and Leads . . . . .Electronic Part Terminals and Leads and SolderLugs Subject to Compressive Forces . . .
19、. .Exception . . . . . . . . . . . . . . . . . .Processes and Controls -. . . . . . . . .Rework During Manufacture of Electronic PartsPART QUALITY ASSURANCE PROVISIONS . . . . . .In-Process controls . . . . . . . . . . . . .Screening (100 Percent) . . . . . . . . . . .Id Conformance Tests(/Quality C
20、onformanceInspection) . . . . . . . . . . . . . . . . .Destructive Physical Analysis (DPA) . . . . .Qualification Tests , . . . . . . . . . . . .MATERIAL QUALITY ASSUIUOJCE PROVISIONS . . . .In-Process Controls . . . . . . . . . . . . .Screening (100 Percent) . . . . . . . . . . .Lot Conformance Tes
21、ts(Quality ConformanceInspection) (Sampling or Periodic) . . . . .Qualification Tests . . . . . . . . . . . . .PACKAGING . . . . . . . . . . . . . . . . . .ELECTROSTATIC-SENSITIVE ITEMS . . . . . . . .DETAILED REQUIREMENTS . . . . . . . . . . . .BOARDS, PRINTED WIRING . . . 0 . . . . . . .2020202020
22、21212121222222222222232323232425viProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SECTION2002102152302322402502602702752803004005006007008009009109601000MIL-STD-1547BCONTENTS-CAPACITORS, GENERAL . . . . . . . . . . . . . 32CERAMIC CAPACITORS (CKS) .
23、. . . . . . . . . 35CERAMIC CAPACITORS, HIGH VOLTAGE (HVR) . . . 37METALLIZED FIUJ!CAPACITORS (CRS) . . . . . . 41METALLIZED FILM CAPACITORS (CHS) . . . . . . 44GLASS DIELECTRIC CAPACITORS (CYR) . . . . . . 46FIXED MICA CAPACITORS (CMS) . . . . . . . . . 48FIXED TANTALUM FOIL CAPACITORS (CLR 25, 27,
24、 35,and37) . . . . . . . . . . . . . . . . . . . 50SOLID TANTALUM CAPACITORS (CSS) . . . . . . . 55SOLID TANTALUM CHIP CAPACITORS (CWR) . . . . 57FIXED TANTALUM-TANTALUM CAPACITOR (SINTERED WETSLUG, CLS79, General Test MethodsPreparation for and Installation of Rivetsand Screws, Rocket and Missile S
25、tructuresTest Methods for Semiconductor DevicesGrinding of Chrome Plated Steel and SteelParts Heat Treated to 180,000 psi or OverTest Methods and Procedures forMicroelectronicsDissimilar Metals8Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-
26、1547BMIL-STD-976MIL-STD-981MIL-STD-1132MIL-STD-1331MIL-STD-1346MIL-STD-1353MIL-STD-1523MIL-STD-1580MIL-STD-1595MIL-STD-1686MIL-STD-1835MIL-STD-2000MIL-STD-2118MIL-STD-2175MIL-STD-2219Certification Requirements for JANMicrocircuitsDesign, Manufacturing, and Quality Standardsfor Custom Electromagnetic
27、 Devices for SpaceApplicationsSwitches and Associated Hardware, Selectionand Use ofParameters To Be Controlled for theSpecification of MicrocircuitsRelays, Selection and ApplicationElectrical Connectors and AssociatedHardware, Selection and Use ofAge Controls of Age Sensitive ElastomericMaterials fo
28、r Aerospace ApplicationsDestructive Physical Analysis for SpaceQuality PartsQualification of Aircraft, Missile andAerospace Fusion WeldersElectrostatic Discharge Control Program forProtection of Electrical and ElectronicParts, Assemblies and Equipment (ExcludingElectrically Initiated Explosive Devic
29、es)(Metric)Microcircuit Case OutlinesStandard Requirements for Soldered Electricaland Electronic AssembliesFlexible and Rigid-Flex Wiring for ElectronicEquipment, Design Requirements forCastings, Classification and Inspection ofFusion Welding forMILITARY HANDBOOKSMIL-HDBK-5 Metallic MaterialsVehicle
30、 StructuresSECTION 2 9Aerospace Applicationsand Elements for AerospaceProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1547BMIL-HDBK-17 Plastics for Aerospace VehiclesMIL-HDBK-23 Structural Sandwich CompositesMIL-HDBK-217 Reliability Predictio
31、n of ElectronicEquipmentDOD-HDBK-263 Electrostatic Discharge Control Handbook forProtection of Electrical and ElectronicParts, Assemblies, and Equipment.MIL-HDBK-339 Custom Large Scale Integrated CircuitDevelopment and Acquisition for SpaceVehicles(Copies of specifications, standards, drawings, and
32、publicationsrequired by contractors in connection with specific procurementfunctions should be obtained from the contracting office or asdirected by the contracting officer.)AIR FORQIL_l10 AUTICAL LABORATORIESN (AmADD436124L DOD/NASA Structural Composites FabricationGuide Vol IADD436125L DOD/NASA St
33、ructural Composites FabricationGuide Vol IIDOD/NASA Advanced Composite Design Guide, VolI-IVNASA MANNED SPACECRAFT CENTERStandard 125 Cadmium Restriction on UseNASA PUBLICATIONSTM X-64755 Part Derating Guidelines; Department of theAir Force, Air Force Systems Command (AFSC)Pamphlet 800-27Application
34、 for copies should be addressed to: Department of theAir Force, Headquarters Air Force Systems Command, Andrews AirForce Base, DC 20334MSFC-SPEC-250 Protective Finishes for Space Flight VehicleStructures and Equipment, GeneralSpecification forMSFC-STD-355 Radiographic Inspection of Electronic PartsS
35、ECTION 2 10Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1547BMSFC-SPEC-469 Titanium and TitaniumofAlloys, Heat TreatmentMSFC-SPEC-522 Design Criteria for Controlling StressCorrosion CrackingNASA-SP-8063 Lubrication, Friction and WearNHB 53
36、00.4(3A-2) Requirements for Soldered ElectricalConnectionsNHB 8060.1 Office of Space Transportation SystemsFlammability, odor and OffgassingRequirements and Test Procedures forMaterials in Environments that SupportCombustionSP-R-0022A General Specificationsl vacuum-stabilityRequirements of Polymine
37、Materials for SpaceCraft ApplicationsApplication for copies should,- addressed to: 14arshall SpaceFlight Center, Document ReposxtorY (A524D), Hunt-llle, AL 35812(Copies of specifications, standards, handbooks, drawings, and,publications required by contractors in connection with speclfledaccfuisitio
38、n functions should be obtained from the contractingactivity or as directed by the contracting officer.)2.2 NONGOVERNM ENT DOCUMENTSThe following documents form a part of this standard to theextent specified herein. Unless otherwise indicated, the issuein effect on the date of invitation for bids or
39、request forproposal shall applY.ERICAN NATIONAL STANDARD INST-CF-152 Composite Metallic Materials Specificationfor Printed Wiring BoardsApplication for copies should be addressed to: American NationalStandard Institute, 11 West 42nd Street, New York, NY 10036SECTION 2Provided by IHSNot for ResaleNo
40、reproduction or networking permitted without license from IHS-,-,-MIL-STD-1547BAMERTCAN SOCIETY FOR TESTING MATERIASTM E 595-84 Standard Test Method for Total Mass Loss andCollected Volatile Condensable Material FromOutgassing in a Vacuum EnvironmentApplication for copies should be addressed to: Ame
41、rican Societyfor Testing Materials, 1916 Race Street, Philadelphia, PA 191113LECTRONICS INDUSTRIES ASSOCIATIONRS-469 DPA of Ceramic CapacitorsRS-477 Cultured QuartzIND-STD-557 Statistical Process Control SystemsApplication for copies should be addressed to: ElectronicIndustries Association, 2001 Pen
42、nsylvania Ave, N.W., Washington,D.C. 20006XNTATIO AL EL CTROTN E ECHNICAL COMMISSIONIEC 302 Standard Definitions and Methods ofMeasurement for Piezoelectric VibratorsOperating Over the Frequency Range Up to 30MegahertzApplication for copies should be addressed to: American NationalStandards Industri
43、es, 1430 Broadway, New York, NY 10CI182.3 ORDER OF PRECEDENCEIn the event of a conflict between the text of this standardand the references cited herein, the text of this standard shall“take precedence.SECTION 2 12Provided by IHSNot for ResaleNo reproduction or networking permitted without license f
44、rom IHS-,-,-MIL-STD-1547BSECTION 3DEFINITIONSTerms are in accordance with the following definitions:3.1 CGXJISITION ACTIVIThe acquisition activity is the Government office orcontractor acquiring the equipment, system, or subsystem forwhich this standard is being contractually applied.3.2 CASE TEMPER
45、ATUREThe case temperature is the hottest temperature on theexternal surface of the devices package. The case temperatureshall be determined in accordance with the applicable militaryspecification standard.3.3 CONTRACTING OFFICERA contracting officer is a person with the authority toenter into, admin
46、ister, or terminate contracts and make relateddeterminations and findings. The term includes authorizedrepresentatives of the contracting officer acting within thelimits of their authority as delegated by the contractingofficer.3.4 ERATINGDerating of a part is the intentional reduction of itsapplied
47、 stress, with respect to its rated stress, for the purposeof providing a margin between the applied stress and the“demonstrated limit of the parts capabilities. Maintaining thisderating margin reduces the occurrence of stress-related failuresand helps ensure the parts reliability.3.5 TRUCTIVE PHYSIC
48、AL ANALYSIS (A Destructive Physical Analysis (DPA) is a systematic,logical, detailed examination of parts during various stages ofdisassembly, conducted on a sample of completed parts from agiven lot, wherein parts are examined for a wide variety ofdesign, workmanship, and processing problems that may not show upduring normal screening tests. The purpose of these analyses isto maintain configuration control and determine those lots ofparts, delivered by a vendor, which have anomalies or defectsSECTION 3 13Provided by IHSNot for ResaleNo r
