1、MIL-C-LY872 12 = 7777706 0277809 5 1 I - , MIL-C-14872 (MU) I 2 March 1970 MILITARY SPECIFICATION CIRCUIT CARD ASSEMBLY: 105593 15 (LINE DRIVER) - -. 1 ,. , ._ 1. SCOPE 1. 1 This specification covers one type of electronic assembly known as Circuit Card Assembly: 2. 10559315, (Line Driver) (see 6, 1
2、). APP LICA BLE DOCUME NT S 2. 1 The following documents, of the issue in effect on date of invitation for bids or request for proposal, form a part of this speci- fication to the extent specified herein, SPECIFICATIONS Military MIL - F - 1 3 92 6 MIL-P - 1423 2 MIL-I -45 607. STANDARDS Fire Control
3、 Materiel: General Specification Governing the Manufacture and Inspection of Parts, Equipment and Tools for Army Materiel: Packaging and Packing of Inspection Eqiipment, Supply and Maintenance of I -I Military MIL-STD-105 Sampling Procedures and Tables MIL-STD-109 Quality Assurance Terms and MIL-STD
4、- 8 1 O for Inspection by Attributes Definitions I Environmental Test Methods DRAWINGS U. S. Army, Frankford Arsenal F10559315 Circuit Card Assembly - Line Driver FSC 1240 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-14872 12 M 9779706 02978
5、05 7 = MEL-C -14872(MU) PACKAGING bATA SHEET 105593 15 Packaging of Circuit Card Assembly- (Line Driver): 10559315 . (Copies of specifications, standards, drawings, and packaging data shee ta required by supplie 8 in connection with specific procurement functions should be obtained from the procurin
6、g activity or as directed by the contracting officer, ) 3. REQUXRE MENTS 3, 1 Fabrication. - The circuit card assembly shall be manu- factured in accordance with Drawing F10559315 and drawings pertaining the re to. 3. 2 General specification. - The circuit card assembly shall meet the following requ
7、irements, where applicable, of MIL-F-13926: (a) Order of precedence (b) Dimensions and tolerances (c) Part identification and marking 3, 2. 1 Electronic workmanship. - The circuit card assembly shall meet the workmanship requirements of Drawing F10559315 and drawings pertaining thereto, . 3. 3 Perfo
8、rmance. - Unless otherwise specified, the circuit card assembly shall meet the performance requirements of this speci- ficatign at standard ambient temperatures between 60 degrees Fahren- heit ( F) and 90F. 3. 3, 1 Loads,power and signals. - The circuit card assembly shall perform as specified herei
9、n when the loads, power, and signals of Table f are applied as specified. - 2 I . . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-LLI872 12 9999906 0297806 9 i ITEM 1. - 1.1 1.2 2. 2. 1 2. 2 2. 3 3. 3. 1 CONDITION Loads : Full load: re sis to
10、r (1 2 required) re sis tor (1 2 required) Reduced load: Power sources: 15 *O, 5 Vdc 5 *O. 2 Vdc 7.5 *O, 2 Vdc Signal sources: Digital type A TABLE I, CHARACTERISTICS 300 ,ohms Maximum p-p ripple 25 mV 25 mV 25 mV I Logical one:- 4*1 Vdc Log i c a 1 zero: O, 2 *O, 2 Vdc MIL-C-14872 (MU) INSTRUCTIONS
11、 Full or reduced load as specified, connected tc each output terminal listed in Table II, with the returns to P1-16B (see 3. 3, 1. 1 and 3,3, 1. 2) _. Connected between the following pins of P1: 14B(t) and 16B(-) 15A(t) and 16B(-) 19A(t) and 16B(-) Applied to the input terminals listed in Table II w
12、hen speci- fied herein. 3. 3. 1. 1 High level output. - With the full load and reduced load operating conditionand the logical zero type-A signal of Table I applied singly or in sequence to the input terminals listed in Table II, 7. 5 10. 5 Vdc shall appear singly or in sequence at the corresponding
13、 output terminals of Table If. -. - I 3 / . . . . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-14872 12 W 7777706 0277807 O W MIL-C-14872 (MU) TABLE- II INPUT PINS OF P1 28 3A 4B 5A 6B 7A 8B 9A 1 OB 11A 12B 13A OTPUT PINS OF P1 32B 31A 30B 2
14、9A 28B 27A 26B 25A 24B 23A 22B 21A _ - I - .I “Ici; . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-C-L4872 L2 U 9979906 0297808 2 m MIL-C-14872 (MU) 3. 3. 1. 2 Low level output, - With the full load operating condi- tion and the logical one t
15、ype-A signal of Table I applied singly or in sequence to each input terminal listed in Table II, O, O io. 5 Vdc shall appear singly or in sequence at the corresponding output terminals of Table 11. 3.3, 2 Environmental. 3. 3. 2. 1 Storage temperature, - The circuit card agsemblyoshall meet the requi
16、rements of 3. 3, 1 at ambient temperature (60 F to 90 F) after exposure and thermal stabilization at -800F and 1600F. . 3. 3. 2. 2 Operating temperatures, - The circuit card assembly shall meet the requirementsoof 3. 3, 1 while exposed to and thermally stabilized at -40F and 4-125 F, subsequent to ;
17、hich it %hall meet the above requirements at ambient temperature (60 F to 90 FI, 3. 3. 2. 3 Vibration. - The circuit card assembly shall show no physical failure and shall meet the requirements of 3. 3. 1 after being exposed to the following vibratory conditions: (a) Amplitude : (b) Acceleration: 4g
18、 maximum (c) Crossover frequency: 12, 5 Hertz (d) Sweep time: O, 5 inch maximum 5 to 500 to 5 Hertz in 15 minutes, Two sweeps in each of the three mutually perpendicular axes, 4. QUALITY ASSURANCE PROVISIONS 4. 1 Responsibility for inspection, - Unless otherwise speci- fied in the contract or purcha
19、se order, the supplier is responsible for the performance of all inspection requirements as specified herein. Except as otherwise specified, the supplier may utilize his own or any other facilities suitable for the performance of the inspection requirements specified herein, unless disapproved by th
20、e Government. The Government reserves. the right to perform any of the inspections set forth in the specification where such inspections are deemed necessary to assure supplies and services conform to prescribed - . . requirements. 5 / . Provided by IHSNot for ResaleNo reproduction or networking per
21、mitted without license from IHS-,-,-MIL-C-14872 (MU) 4.4,l General provisions. - The component and subassembly inspection requirements of MIL-F-13926 form a part of the quality .assurance provisions of this specification, terms shall be as listed in MIL-STD-109. Definitions of inspection 4, 2 First
22、article (initial production) approval, - The require- ment for first article approval and the responsibility (Government or contractor) for first article testing shall be as specified in the contract, The sample for first article approval tests shall consist of three circuit card assemblies, The sam
23、ple shall be manufactured in the same man- ner, using the same materials, equipment, processes, and procedures as used in regular production. All parts and materials, including packaging and packing, shall be obtained from the same source of supply as used in regular production. 4. 2. 1 Government t
24、esting, - When he Government is responsi- ble for conducting first article approval tests, the contractor, prior to submitting the sample to the Government, shall inspect the sample to insure that it conforms to all the requirements of the contract and sub- mit a record of this inspection with the s
25、ample, including certificates of conformance for mate rials, 4, 2, 2 Contractor testing. - When the contractor is responsible The sample The for conducting first article approval tests, the sample shall be inspected by the contractor for all the requirements of the contract, and a record of this ins
26、pection, including certificates of conformance for materials, shall be submitted to the Government for approval, Government reserves the right to witness the contractors inspection, 4, 3 Inspection provisions, 4. 3. 1 Submission of product. - Unless otherwise specified by the contracting officer, in
27、spection lot size, lot formation and presen- tation of lots shall be in accordance with “Submission of Product“ provisions of MIL-STD-105, 4, 3. 2 Examination and tests, 4, 3.2. 1 Components and subassemblies. - All components and subass emblies shall be inspected in accordance with the inspection p
28、rovisions contained in Supplementary Quality As surance PGovis ions (SQAP) listed in the technical data package (TDP). in the absence of Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1 MIL- C - 14872 (MU) SQAPs, the applicable Quality Assurance Pro
29、visions of MIL-F-13926 shall apply. 4.3.2.2 Final acceptance inspection. - Subsequent to first article approval, examination and tests related to Section 3 herein shall be per- formed on a single defect (individual characteristic) basis in accordance ixiith MIL-STD-105 and the sampling plans specifi
30、ed in Tables III, IV and V herein. Examination and test for pac.kaging and marking shall be in accordance with MIL-P-14232 and Section 5 herein. The tabulated classification of defects in Tables III, IV, and V shall constitute the . minimum inspection to be performed by the supplier after first arti
31、cle approval and prior to Government acceptance or rejection by item or lot. 4.3.2.3. Functional tests. - The requirements and tests in Table III shall be inspected on a 100% basis. All examinations and tests shall be conducted at the standard ambient temperature (60 to 9OOF). TABLE III (1 O0 percen
32、t inspection) - CHARACTERISTIC REQUIREMENT TEST PROCEDURES 1 O1 High level output 3.3.1.1 102. Low level output 3.3.1.2 4.6.2 4.6.3 4.3.3 - Acceptance and rejection. - Rejected lots shall be screened for all defective characteristics. defective units and resubmittance of rejected lots shall be in ac
33、cordance with “Acceptance and Rejection as specified in MIL-STD- 105. Removal or correction of 4 .4 Spec ia1 sampling. 4.4.1 General. - One circuit card assembly shall be selected at random by a Government representative as a control sample from each 100 produced. The control sample shall meet the r
34、equirements and tests in Table IV. I .* . -. . _ . 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. MIL-C-14872 12 = 7779706 0297833 2 I - TABLE IV CONTROL TEST REQUIREMENT TEST PROCEDURES 301. Fabrication 3. 1 Applicable drawings - 302. General s
35、pecification 3e2 MIL-F-13926 - Visual Visual 44. 2 Environmental, - Three circuit card assemblies shall be selected at random by a Government represen;ative as a control sample from each 50 produced or from each months production, which- ever occurs first. and tests in Table V. The control samples s
36、hall meet the requirements TA.BLE V CONTROL TEST REQUIREMENT TEST PROCEDURES i I 303. Storage temperature 3. 3. 2. 1 304. Operating temperature 3. 3. 2. 2 305. Vibration 3. 3. 2. 3 4. 6.4. 1 4. 6.4. 1 4. 6.4. 2 4.4. 3 Failure sample. - Should any one item of a special sampling fail to meet the speci
37、fied test requirements, acceptance of the product shall be suspended by the Government until necessary corrections have been made by the contractor and the resubmitted item has been approved (see 4.3. 3). 4. 5 Inspection equipment. - Except as otherwise provided for by the contract, the contractor s
38、hall supply and maintain inspection equipment in accordance with the applicable requirements of . MIL-1-45607. 4. 5. 1 Government furnished inspection equipment. - Where the contract movides for Government furnished test equipment, supply and- maintenahce of test equipment shall be in accordance-wit
39、h the applicable requirements specified in MIL-1-45607. 8 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL- C - 1487 2 (MU) 4. 5, 2 Contractor furnished inspection equipment. 4. 5. 2. 1 Government design. - Unless otherwise specified in the contra
40、ct, all inspection equipment specified by drawing number in specifications or SQAP forming a part of the contract shall be supplied by the contractor in accordance with applicable technical data listed in the technical data package (TDP). 4, 5. 2. 2 Contractor design. - The contractor shall design a
41、nd supply inspection equipment compatible with the “Test Methods and Procedures“ specified in 4. 6 of this specification and with the component inspection procedures specified in “Examination“ and “Test Facilities“ requirements of MIL-F-13926. Since tolerance of test equipment is normally considered
42、 to be within 10%of the product tolerance for which it is intended, this inherent error in the test equipment design must be considered as part of the prescribed pro- duct tolerance limit. Thus, concept, construction, materials, dimensions, and tolerances used in the design of test equipment shall b
43、e so selected and controlled as to insure that the test equipment will reliably indicate acceptability of a product which does not exceed 90% of the prescribed tolerance limit and permit positive rejection when nonconforming. routine calibration of test equipment. Construction shall be such as to fa
44、cilitate 4. 5. 3 Test equipment. - In conjunction with 4. 5. 2, the standard test equipment listed in Table VI shall be utilized in performing the applicable te.st of 4.6. NOMENCLATURE f. D-C power supply 2. D-C power supply .- 3. D-C power supply 4. D-C voltmeter 5, Signal source TABLE VI. DESCRIPT
45、ION Plus 5 *o. 2v Plus 7. 25 *O. 1 Vdc Plus 15 *o. 5v Range of O-lOV, Capable of providing a d-c Ripple: 25 mV p-p max . Ripple: 25 mV p-p max Ripple: 25 mV p-p max Accuracy of Il70 level of amplitude specified in item 3. 1, Table I I 9 ._ .- Provided by IHSNot for ResaleNo reproduction or networkin
46、g permitted without license from IHS-,-,-flIL-C-1472 12 9997706 0297833 b I 4,6 Test methods and procedures, 4. 6. 1 Test conditions. - Unless otherwise specified, the test conditions shall be in accordance with the “Test Facilities“ require- ments of MIL-F-13926. 4, 6. 1. 1 Initial conditions. - Co
47、nnect the power to the circuit card assembly as specified in Table 1. 4. 6. 2 High level output. - 4, 6. 2. 1 Full load, - (a) Apply the initial conditions of 4. 6. 1. 1. (b) Connect the load resistors specified in Table I ford full-load operation to the output pins listed in .Table II. (c) Apply th
48、e logical zero, type-A-signal of Table I singly or in sequence to the input pins listed in Table II and observe the voltage at the corresponding output pins listed in Table II. The output voltages shall be as specified in 3. 3. 1. 1. 4.6. 2. 2 Reduced load. - Repeat the test procedure of 4. 6. 2. 1
49、using the reduced-load resistors specified in Table I at the output I pins. The output voltages shall be as specified in 3. 3. 1. 1. 4. 6. 3 Low level output. - Repeat the test procedure of 4. 6. 2. 1 using the logical one (instead of logical zero), type-A signal of Tablei at the input terminals listed in Table II. as specified in 3. 3. 1. 2. The output voltages shall be 4.
