1、MIL-HDBK-175 I MAY 1968 MILITARY STANDARDIZATION HAN0600K MICROELECTRONIC DEVICE DATA .HANDBOOK I FSC-5962 I Y Copyright Communications - Electronics Command Provided by IHS under license with CRAI Not for Resale No reproduction or networking permitted without license from IHS -,-,-DEPARTMENT OF DEF
2、ENSE WASHINGTON D. C. 20360 MIL-HDBK-175 MICROELECTRONIC DEVICE DATA HANDBOOK 1 o This handbook was developed by the Department of Defense and the National Aeronautics and Space Administration-1968 in accordance with established procedure. 2. This publication was approved on for printing and inclusi
3、on in the military standardization handbook series. 3. This document provides general information on microelectronic devices and their applicaiions. It will provide valuable information and guidance- to personnel concerned with the design, development, and production of equipment and systems emptoyi
4、ng microcircuits. 4. Every effort has been made to reflect the latest information on technology, reliability, testing and design considerations. It is the intent to review this handbook periodically to insure its completeness and currency. Users of this document are encouraged to report any errors d
5、iscovered and any recommendations for changes or inclusions to the Commanding General, U. S. Army Electronics Command, Fort Monmouth, New Jersey Attention: AMSEL-TD-S. I Copyright Communications - Electronics Command Provided by IHS under license with CRAI Not for Resale No reproduction or networkin
6、g permitted without license from IHS -,-,-MIL-HDBK-175 57 II 9777770 OOOOLI77 4 m Page number II of this document was missing upon receipt. The document has been reor- dered and will be refilmed when received. #,J INFORMATION HANDLING SERVICES IHS 110236A (11/81) Copyright Communications - Electroni
7、cs Command Provided by IHS under license with CRAI Not for Resale No reproduction or networking permitted without license from IHS -,-,-r-“ MIL-HDBK-175 1 May 1968 FOREWORD This document provides guidance for the selection and application of microetectronic devices in Military systems. Emphasis is p
8、laced upon con- siderations affecting reliability of systems employing such devices. This handbook comprises six sections of user-oriented technical discussion, ranging from design, manufacture, use of the devices in subsystems, and specifications to reliability and failure physics. 8 Some of the ma
9、terial u+ is copyrighted; permission for its use is gratefully acknowledged, and acknowledgement is also made to all publications and microelectronic- device manufacturers, who responded generously to all requests for information from ARlNC Corporation working under contract to NASA. Copyright Commu
10、nications - Electronics Command Provided by IHS under license with CRAI Not for Resale No reproduction or networking permitted without license from IHS -,-,-MIL-HDBK-175 1 May 1968 APPLICABLE DOCUMENTS The following documents of the latest issue in effect form a part of this Handbopk to -the extent
11、described herein: :SI?ECIFICAT.IONS .MILITARY .MtL-S49500 Semiconductor Devices, General Specifications For MIL-“55565 STANDARDS -MILITARY MIL-STD-105 MIL-STD-202 MIL-STD-750 MI L-STD-883 MIL-STD-1313 HAND!BOOK MIL-HDBK-108 Microcircuits, Packaging of Samp.ling Procedures And Tables for Inspection B
12、y Attributes Test Methods For Electronic And Electrical Component Parts Test Methods For Semiconductor Devices Test Methods And Procedures For Microelectronics Microelectronic Terms And Definitions Sampling Procedures And Tables For Life And Reliability Testing iv Copyright Communications - Electron
13、ics Command Provided by IHS under license with CRAI Not for Resale No reproduction or networking permitted without license from IHS -,-,-1. MIL-HDBK-I 75 1 May 1968 CONTENTS INTRODUCTION 1.1 Bysical Description of Microelectronic Devices 1.2 Performance Characteristics 1.3 Cost 1.4 Elcroelectronic D
14、evelopments 1.4.1 Urge-scale Integration ;.4.2 The Computer as a WLcroelectronic-Design Tool 1.4.3 Microwave Integrated Circuits 1.4.4 Hybrid Microcircuits Bibliography: Chapter 1 2. BASIC PROCESSES AND DESIGN CONSIDERATIONS 2.1 Bipolar Transistor Devices 2.1.1- Preparation of Semiconductor Material
15、s 2.1.2 Measuring Conductivity 2.1.3 Alloying 2.1.4 Diffusion 2.1.5 Oxide Masking 2.1.6 Precision Evaporation 2.1.7 Epitaxial Techniques 2.1.8 Isolation 2.1.9 Specifying the Circuit 2.1.10 Linear Amplifier Checklist 2.1.11 Applications 2.2 bDS Field-Effect Devices 2.2.1 N-Channel Enhancement MIS 2.2
16、.2 P-Channel Enhancement MOS 2.2.3 N-Channel Depletion MOS 2.2.4 P-Channel Depletion MOS 2.2.5 Drain Current 2.2.6 Pinch-off 2.2.7 Determining VT “- 2.2.8 Diitetermining the gd and h 2.2.9 Frequency Limitations of an MOS Device 2.2.10 Equivalent Circuit of the VOS 2.2.11 Amplifier Circuits Page 1-1
17、1-2 1-4 1-5 1-6 1 -7 1-10 3 -12 1-14 1-17 2 -1 2 -2 2 -2 2 -3 2-5 2 -6 2 -9 2 -9 2 -10 2 -11 2 -16 2 -18 2 -21 2 -34 2 -35 2 -35 2 -36 2 -37 2 -39 2 -40 2 -42 i -43 2 -44 2 -44 2 -46 V Copyright Communications - Electronics Command Provided by IHS under license with CRAI Not for Resale No reproducti
18、on or networking permitted without license from IHS -,-,-MIL-HDBK-175 1 May 1968 CONTENTS (continued) 2.2.12 Variable Resistor 2.2.13 Switching Times 2.2.14 Switching Applications 2.2.15 MOS Digital Circuits 2 2.16 Single -Channel Arrays 2.2.17 M3S Noise 2.3 Bilm Microcircuits . 2,3.1 Introduction 2
19、.3.2 Thin-Film Components 2.3.3 Thick-Film Components 2.4 Comparison of Microelectronic Component Characteristics . Bibliography: Chapter 2 3. SYSTEM DESIGN C0NSIDU)ERATIONS 3.1 Introduction 3.2 Packaging 3.2.1 General Requirements of the IC Package 3.2.2 Available Package !Types 3.2.3 Comparison of
20、 the IC Packages 3.3 Interconnection Techniques 3.3.1 Conventional Printed-Wiring Boards 3.3.2 Welded-Wire Planes and Assemblies 3.3.3 Mltilayer Printed-Wiring Boards 3.3.4 Package Tie-Down Techniques 3.3.5 Elultilayer Board Fabrication 3.3.6 Density 3.3.7 Heat Distribution 3.3.8 Electrical Characte
21、ristics of Multilayer Boards 3.3.9 Ground Planes and Shielding 3.3.10 Board Design Consideration 3.3.11 Device Mounting Considerations 3.3.22 Delivery Time 3.3.13 LSI Considerations -. 5 4 Intraconnections 3.5 Operating Frequency 3.6 Thermal Considerations 3.6.1 . LST Thermal Considerations 2 -48 2
22、-48 2 -50 2 -51 2 -54 2 -55 2 -55 2 -55 2 -55 2 -57 2 -58 2-61 3 -1 3 -1 3 -4 3 -4. 3 -6 3-15 3 -16 3-17 .3-17 3-18 3-21 3-21 3 -25 3-25 3-26 3 -28 3-28 3 -28 3-29 3 -29 3 -32 3 -35 3 -36 3 -3“ vi Copyright Communications - Electronics Command Provided by IHS under license with CRAI Not for Resale N
23、o reproduction or networking permitted without license from IHS -,-,-r I 3.7 3.8 3.9 MIL-HDBK-175 1 May 1968 CONTENTS (continued) Logic Selection 3.7.1 Introduction 3.7.2 Direct-Coupled-Transistor Logic (DCTL) 3.7.3 Resistor Transistor Logic (RTL) 3.7.4 Diode-Transistor hgic (DCL) 3.7: 5 Current-Mod
24、e Logic (CML) 3.7.6 Complemenkary Transistor Logic (CTL) 3.7.7 Transistor-Transistor Logic (ITL) 3.7.8 Comparison of Logic Types Redundancy Techniques 3.8.1 Introduction 3.8.2 Mathematical Methods 3.8.3 Forms of Redundancy 3.8.4 Measures of Redundancy Gain Maintainability and Logistics 3.9.1 Introdu
25、ction 3.9.2 Maintenance Concepts Bibliography: Chapter 3 4. TESTING 4.1 Introduction 4.2 Quality-Assurance Tests 4.2.1 Introduction 4.2.2 Wafer Testing 4.2.3 Dice Visual Inspection 4.2.4 the remaining chapters are titled as follows: Two: . Basic Processes and Design Considerations Three: System .Des
26、ign Considerations Four: Testing F ive: Specifications and Procurement six: Reliability and Physics of Failure 1-1 Copyright Communications - Electronics Command Provided by IHS under license with CRAI Not for Resale No reproduction or networking permitted without license from IHS -,-,-Page number o
27、f this document was missing upon receipt. The document has been reor- dered and will be refilmed when received. - INFORMATION HANDLING SERVICES . IHS #0236A (11181) Copyright Communications - Electronics Command Provided by IHS under license with CRAI Not for Resale No reproduction or networking per
28、mitted without license from IHS -,-,-MIL-HDBK-275 G W 7779770 0053651 2 m MIL-HDBK-175 1 May 1968 A flat pack requires a surface area of at least 125 x 250 mils, excluding leads, while the dual-in-line package (DIP) typically requires 250 x 700 mils of surface area, excluding leads. Leads require ad
29、ditional surface area. When simple circuits are packaged separately, the surface-area and volume efficiency is poor. Space efficiency can be improved when multiple circuits are contained in a single package. Identical circuits (typically up to four) in a single package are frequently used. Circuit d
30、ensity is limited by the number of package leads on standard -packages. The hybri8 microcircuit is one technique currently being pursued to increase circuity density. The ultimate approach is that of LSI - in which perhaps as many as a thousand circuits could be packaged in a space no larger than 3
31、X 3 inches. The surface-area and volume requirements of film and multichip circuits are usually greater t+n those of the monolithic integrated circuit. The rnultichips are typically put into a modified TO-5 package with a surface-area requirement of about lo5 square vils. Film circuits typically req
32、uire CL minimum of 250 x 250 mils of surface area, excluding leads. The weight of the smallest integrated-circuit package in general use is approximately 0.1 gram. Again, the assembled equipment averages a much higher weight - an estimated 1 gram per unit - than the simple sum of the weights of the
33、integrated-circuit packages. As with volume, the weight of multichip and thin-film dicrocircuits is greater than that of the monolithic integrated circuit. Nevertheless, microelectronic circuits weigh 1/5 to 1/50 as much as conventional circits when connected into equipments. The estimates given abo
34、ve are quite rough and are valid-only for comparisons at the circuit level. A given equipments volume or weight may be changed drastically or only slightly with microelectronics conversion, depending mainly on the weight and volume of the parts that are not converted. Further, there is a strong tren
35、d to increase the functional complexity of the integrated circuit; increased complexity can often be achieved without materially increasing overall package weight or volume. It is often mistakenly believed that an integrated circuit consumes much less power than an equivalent conventional circuit. W
36、hile microelectronic equipments are often designed to consume considerably less power than conventional versions, this reduction cannot be attributed to an inherent .power efficiency in the individual microelectronic circuits. Any power-speed combination available today in a microelectronic circuit
37、can also be achieved with conventional com- ponents. The sharp reductions in power that often accompany conversibn of an i a Copyright Communications - Electronics Command Provided by IHS under license with CRAI Not for Resale No reproduction or networking permitted without license from IHS -,-,-MIL
38、-HDBK-L75 “_ 57 MIL-HDBK-175 1 May 19.58 U 7777770 0053652 L1 m equipment to microelectronic form are the result of changes in design. There is also a reduction in lead lengths and mechanical joints in the integrated circuit, with a corresponding reduction in power loss. This power difference is neg
39、ligible in most cases at present, but as the power levels continue to decrease, the difference will become significant. If nanowatt circuits become available, the microelectronic circuit will indeed be significantly more Efficient than conventional circuitry. 1.2 PERFORMANCE CHARACTERISTICS The inte
40、grated-circuit technology has concentrated on digital circuitry because such circuitry does not require passive elements with tight tolerances and broad ranges of values and because there is usually a high degree of repeti- tion of the same circuit in digital equipment. All digital functions are cur
41、rently available in integrated-circuit form. More than 2000 items are available off-the-shelf although many of these circuits overlap in function. This is not to say, however, that such circuits are interchangeable; most of the major manufacturers have developed their own compatible circuit family t
42、o provide most of the required digital functions. Mixing items from different families is generally not feasible; thus, in working from the standard inventory, a designer must initially choose the logic scheme and characteristics that best suit his needs and then design his system around a single fa
43、mily of circuits, Special requirements, not covered by the stock circuits, can be met by custom-connecting (metalizing) the elements of standard matrix wafers, which are maintained in inventory for this purpose by some manufacturers. To fill even more exacting needs, fully custa circuits can be made
44、 by all manufacturers. , Although the monolithic structures are especially appropriate for digital circuitry, some multichip and hybrid circuits are used - generally for the extremes of the operating frequency range. Because simple monolithic cirxxits are satisfactory for digital applications, they
45、received almost the full attention of manufacturers for a number of years. While an unsatisfied demand for digital circuits continued, other applications were neglected. Recently, however, the rush to establish positions in the pioneering digital market has leveled off somewhat, allowing effort to b
46、e directed into other areas - notably linear circuits and cmplex arrays such as LSI and hybrid microcircuits. Significant progress has been made in the application of microelectronics to analog functions. Circuits for performing linear functions are becoming 1-4 Copyright Communications - Electronics Command Provided by IHS under license with CRAI Not for Resale No reproduction or networking permitted without license from IHS -,-,-
