1、2ASHRAE Datacom Series, Book 21791 Tullie Circle, NEAtlanta, GA 30329-2305www.ashrae.org/bookstoreASHRAE Datacom Series2The Book Datacom Facility Designers Need Now to Be Ready for the FutureDatacom equipment technology is advancing at a rapid pace, resulting in relatively short product cycles and a
2、n increased frequency of datacom equipment upgrades. Because datacom facilities and their associated HVAC infrastructure are typically built to have longer life cycles, any mod-ern datacom facility needs the ability to seamlessly accommodate the mul-tiple datacom equipment deployments it will experi
3、ence during its lifetime. Based on the latest information from leading datacom equipment manufac-turers, this second edition of Datacom Equipment Power Trends and Cooling Applications provides new and expanded datacom equipment power trend charts through 2020 to allow datacom facility designers to m
4、ore accurately predict the equipment loads their facilities will need to accommodate in the future and supplies ways of applying the trend information to datacom facility designs today.This edition also enhances the server power trends by including trends for the number of sockets and includes a new
5、 chapter with practical informa-tion on how to apply the trends in a data center environment.Also included is an overview of various air- and liquid-cooling system op-tions for handling future loads and an invaluable appendix containing terms and definitions used by datacom equipment manufacturers,
6、the facilities operation industry, and the cooling design and construction industry. This book is the second in the ASHRAE Datacom Series, authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Technol-ogy Spaces and Electronic Equipment. This series provides comprehensive treatmen
7、t of datacom cooling and related subjects.ISBN 978-1-936504-28-29 781936 504282Product code: 90451 6/12Datacom Equipment Power Trends and Cooling ApplicationsSecond Edition Datacom Equipment Power Trends and Cooling Applications | Second EditionCover_PowerTrends_2ndEd.indd 1 5/15/2012 1:33:40 PMData
8、com Equipment PowerTrendsand Cooling ApplicationsSecondEdition 2012 ASHRAE (www.ashrae.org). For personal use only. Additional reproduction, distribution, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission.This publication was prepared in cooper
9、ation with TC 9.9, Mission Critical Facilities,Technology Spaces, and Electronic Equipment.Any updates/errata to this publication will be posted on theASHRAE Web site at www.ashrae.org/publicationupdates.For more information on the ASHRAE Datacom Series, visitwww.ashrae.org/datacenterefficiency.For
10、more information on ASHRAE TC 9.9, visithttp:/tc99.ashraetcs.org. 2012 ASHRAE (www.ashrae.org). For personal use only. Additional reproduction, distribution, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission.Datacom Equipment PowerTrendsand Coo
11、ling ApplicationsSecond EditionASHRAE Datacom SeriesBook 2 2012 ASHRAE (www.ashrae.org). For personal use only. Additional reproduction, distribution, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission.ISBN: 978-1-936504-28-2 2005, 2012 ASHRAE17
12、91 Tullie Circle, NEAtlanta, GA 30329www.ashrae.orgAll rights reserved.Printed in the United States of AmericaCover image by Joe Lombardo of DLB Associates._ASHRAE has compiled this publication with care, butASHRAE has not investigated, andASHRAEexpresslydisclaimsanydutytoinvestigate,anyproduct,serv
13、ice,process,procedure,design,orthelikethat may be described herein. The appearance of any technical data or editorial material in this publi-cation does not constitute endorsement, warranty, or guaranty by ASHRAE of any product, service,process, procedure, design, or the like. ASHRAE does not warran
14、t that the information in the publi-cation is free of errors, andASHRAE does not necessarily agree with any statement or opinion in thispublication. The entire risk of the use of any information in this publication is assumed by the user.No part of this publication may be reproduced without permissi
15、on in writing from ASHRAE, exceptby a reviewer who may quote brief passages or reproduce illustrations in a review with appropriatecredit, nor may any part of this publication be reproduced, stored in a retrieval system, or transmittedin any way or by any meanselectronic, photocopying, recording, or
16、 otherwithout permission inwritingfromASHRAE.Requestsforpermissionshouldbesubmittedatwww.ashrae.org/permissions._Library of Congress Cataloging-in-Publication DataDatacom equipment power trends and cooling applications. - 2nd ed.p. cm. - (ASHRAE datacom series ; bk. 2)Includes bibliographical refere
17、nces and index.ISBN 978-1-936504-28-2 (softcover : alk. paper)1. Electronic apparatus and appliances-Cooling. 2. Telecommunication-Equipment and supplies-Cooling. 3. Air conditioning-Design and construction. 4. Electronic data processing departments-Design and construction. I. American Society of He
18、ating, Refrigerating and Air-ConditioningEngineers.TK7870.25.D38 2012697.9316-dc232012014005ASHRAE STAFFSPECIAL PUBLICATIONSMark OwenEditor/Group Manager ofHandbook and Special PublicationsCindy Sheffield MichaelsManaging EditorMatt WalkerAssociate EditorElisabeth WarrickAssistant EditorMeaghan ONei
19、lEditorial AssistantMichshell PhillipsEditorial CoordinatorPUBLISHING SERVICESDavid SoltisGroup Manager of Publishing Servicesand Electronic CommunicationsTracy BeckerGraphics SpecialistJayne JacksonPublication Traffic AdministratorPUBLISHERW. Stephen Comstock 2012 ASHRAE (www.ashrae.org). For perso
20、nal use only. Additional reproduction, distribution, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission.Foreword viiPreface .ixAcknowledgmentsxi1 Introduction1.1 Purpose/Objective .12 Background2.1 Datacom Facility Planning .32.2 Simple Example
21、of Datacom Equipment Growth Impacton a Facility .62.3 Overview of Power Density Definitions.112.4 IT and Facility Industry Collaboration 122.5 IT Industry Background.133 Component PowerTrends3.1 Introduction153.2 Servers and Their Components 153.3 Server Power Distribution .203.4 Component Power Tre
22、nds.213.5 Power Supplies.314 LoadTrends andTheir Application4.1 IntroductionASHRAE Updated and ExpandedAir-Cooling Power Trends 354.2 Definition of Watts per Equipment Square Foot Metric.374.3 The 2005 ASHRAE Power Trend Chart 374.4 Power Trend Chart Evolution 394.5 Volume Servers.394.6 Idle Power F
23、or Servers .424.7 ASHRAE Liquid-Cooling Power Trends 47Contents 2012 ASHRAE (www.ashrae.org). For personal use only. Additional reproduction, distribution, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission.vi Contents4.8 Product Cycle vs. Build
24、ing Life Cycle 484.9 Predicting Future Loads.494.10 Provisioning for Future Loads .495 Air Cooling of Computer Equipment5.1 Introduction 515.2 Air Cooling Overview .525.3 Underfloor Distribution525.4 Overhead Distribution 535.5 Managing Supply and Return Airflows555.6 Local Distribution 585.7 Air-Co
25、oling Equipment615.8 Air-Cooling Controls615.9 Reliability 636 Liquid Cooling of Computer Equipment6.1 Introduction 656.2 Liquid Cooling Overview 666.3 Liquid-Cooled Computer Equipment .666.4 Liquid Coolants for Computer Equipment .686.5 Datacom Facility Chilled-Water System.706.6 Reliability 727 Pr
26、actical Example ofTrends to Data Center Design7.1 Introduction 73Introduction to Appendices81Appendix AGlossary .83Appendix BAdditional PowerTrend Chart Information/Data 101Appendix CElectronics, Semiconductors, Microprocessors, ITRSC.1 Cost-Performance Processors 113C.2 High-Performance Processors
27、117C.3 Post CMOS .119References/Bibliography .123Index .125 2012 ASHRAE (www.ashrae.org). For personal use only. Additional reproduction, distribution, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission.Datacom (data processing and telecommunica
28、tions) equipment technology isadvancing at a rapid pace, resulting in relatively short product cycles and anincreased frequency of datacom equipment upgrades. Because datacom facilitiesthat house this equipment, along with their associated HVAC infrastructure, arecomposed of components that are typi
29、cally built to have longer life cycles, anymodern datacom facility design needs the ability to seamlessly accommodate themultiple datacom equipment deployments it will experience during its lifetime.Based on the latest information from all the leading datacom equipment manu-facturers, Datacom Equipm
30、ent Power Trends and Cooling Applications, SecondEdition, authored by ASHRAE Technical Committee (TC) 9.9, Mission CriticalFacilities, Technology Spaces, and Electronic Equipment, provides a new andexpanded datacom equipment power trend chart to allow the datacom facilitydesignertomoreaccuratelypred
31、ictthedatacomequipmentloadsthatthefacilitycanexpecttohavetoaccommodateinthefutureandprovideswaysofapplyingthetrendinformation to datacom facility designs today. Trends for individual componentssupplementtheprevioustrendinformation,providinganunderstandingoftheforcesdriving overall information techno
32、logy equipment (ITE) power consumption.This book also includes an overview of various air- and liquid-cooling systemoptions that may be considered to handle future loads and an invaluable appendixcontaining a collection of terms and definitions used by datacom equipment manu-facturers, the facilitie
33、s operation industry, and the cooling design and constructionindustry.Foreword 2012 ASHRAE (www.ashrae.org). For personal use only. Additional reproduction, distribution, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission. 2012 ASHRAE (www.ashra
34、e.org). For personal use only. Additional reproduction, distribution, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission.This second edition of Datacom Equipment Power Trends and Cooling Appli-cationsupdatesthepowertrendsforservers,storage,andco
35、mmunicationequipmentthrough 2020 (the trends in the first edition go only to 2014). TheASHRAE TC 9.9IT subcommittee, made up of information technology (IT) manufacturers, createdthese trend charts and was primarily responsible for the updates to this secondedition.The primary changes to the second e
36、dition are the updates to the power trends,but there is also the addition of a new chapter (Chapter 3) on component powertrends. The components included in Chapter 3 are processors, memory, graphicscards, hard drives, and nonvolatile storage, including solid-state drives. Forces driv-ing the compone
37、nt power trends are discussed along with power trends for eachcomponent.Chapter 4 contains the books major changes, including the updated trends forservers, storage, and communication equipment. The comparisons between thepowertrendsshowninthefirsteditionandthisupdatedsecondeditionaredisplayed.Inadd
38、ition,theserverpowertrendshavebeenenhancedbytheadditionoftrendsforthe number of sockets deployed within the server. Servers that are designed andmanufactured in a more common footprint are now displayed in watts per server orwatts per rack rather than the watts per equipment square foot used in the
39、firstedition.However,forthosestorageandtapesandcommunicationequipmentthatarenotdesignedtoamorecommonracksize,thewattsperequipmentsquarefootmetriccontinues to be used.ToprovidethereadersomeguidanceonapplyingthepowertrendsinChapter 4,Chapter 7 has been added, providing practical applications of the po
40、wer trends andhow to apply them in a real-world data center environment.Appendix C has been extensively updated. The latest information from theInternational Technology Roadmap for Semiconductors (ITRS, ) hasbeen added in a series of graphs that show trends of the silicon technologies overtime.Inadd
41、ition, theresearcheffortsatmajor academicinstitutionsaswellas majorITmanufacturersthatareinvestigatingthenextswitchafterthecurrentcomplemen-tary metal oxide semiconductor (CMOS) technology are described.Preface 2012 ASHRAE (www.ashrae.org). For personal use only. Additional reproduction, distributio
42、n, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission. 2012 ASHRAE (www.ashrae.org). For personal use only. Additional reproduction, distribution, or transmission in either print or digital form is not permitted without ASHRAEs prior written per
43、mission.ASHRAETC9.9wouldliketoparticularlythankthosewhocontributedgreatlyto this updated second edition from the TC 9.9 IT subcommittee: Dave Moss, JonFitch, and PaulArtman from Dell; David Copeland from Oracle/Sun; Tim McCannfromSGI;BillFrenchfromEMC;MikePatterson,MichaelNelson,SunnyLam,andRobin St
44、einbrecher from Intel; Greg Pautsch from Cray; Roger Schmidt, DanSimco, and Jason Matteson from IBM; John Lanni and Mike Mangan from DLBAssociates; JeiWei from Fujitsu; Declan ORiodan and David Moore from HP; JimDonaldson from Hitachi; and Marlin Vogel from Juniper.In addition,ASHRAE TC 9.9 wishes t
45、o thank the following people for helpingwith the final editing and formatting of the book: Roger Schmidt from IBM, RobinSteinbrecher from Intel, and Don Beaty and Neil Chauhan from DLB Associates.TC 9.9 also wishes to thank Jonathan Kellen, Carol Hutchison, David Wang,LangYuan, and Mike Ellsworth.Ac
46、knowledgments 2012 ASHRAE (www.ashrae.org). For personal use only. Additional reproduction, distribution, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission. 2012 ASHRAE (www.ashrae.org). For personal use only. Additional reproduction, distribut
47、ion, or transmission in either print or digital form is not permitted without ASHRAEs prior written permission.1.1 PURPOSE/OBJECTIVEIt is important to consider the fundamental definition of trend, which for thisbook is defined as the general direction in which something tends to move. Thetrends refe
48、renced or presented in this book should not be taken literally but ratherconsidered as a general indication of both the direction and the magnitude of thesubject matter. The intended audience for this document includesplanners and managers of datacom facilities,facility design teams planning and des
49、igning datacom facilities, andfacility architects and engineers who require insight on datacom equipmentenergy density and installation planning trends.Thevarietyofbackgroundsandeducationalandpracticalexperienceamongtheintended audience can result in many different methods used to apply the informa-tion in this book. Fortunately, the book is designed for these multiple methods withtheunderstandingthatanymethodologyemployedfocusesontheconceptofgrow
