1、Designation: C881/C881M 15Standard Specification forEpoxy-Resin-Base Bonding Systems for Concrete1This standard is issued under the fixed designation C881/C881M; the number immediately following the designation indicates the yearof original adoption or, in the case of revision, the year of last revi
2、sion. A number in parentheses indicates the year of last reapproval.A superscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope*1.1 This specification covers two-component, epoxy-resinbonding systems for application to portland-cement concrete,which are able
3、 to cure under humid conditions and bond todamp surfaces.1.2 This specification does not cover epoxy-resin-basebonding systems that have been modified by addition ofcomponents such as cement, fine aggregate, or fiber reinforce-ment. Additional testing may be required to meet applicablespecifications
4、 for these applications.1.3 This specification does not address the effects of creepon epoxy-resin-base bonding systems while under load or thepotential for creep rupture. Additional testing is required forapplications where creep and creep rupture are critical.1.4 UnitsThe values stated in either S
5、I units or inch-pound units are to be regarded separately as standard. Thevalues stated in each system may not be exact equivalents;therefore, each system shall be used independently of the other.Combining values from the two systems may result in non-conformance with the standard. Some values have
6、only SI unitsbecause the inch-pound equivalents are not used in practice.1.5 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine
7、the applica-bility of regulatory limitations prior to use. For specific hazardsstatements, see Section 9.2. Referenced Documents2.1 ASTM Standards:2C882 Test Method for Bond Strength of Epoxy-Resin Sys-tems Used With Concrete By Slant ShearC884/C884M Test Method for Thermal Compatibility Be-tween Co
8、ncrete and an Epoxy-Resin OverlayD570 Test Method for Water Absorption of PlasticsD638 Test Method for Tensile Properties of PlasticsD648 Test Method for Deflection Temperature of PlasticsUnder Flexural Load in the Edgewise Position (With-drawn 2016)3D695 Test Method for Compressive Properties of Ri
9、gidPlasticsD2556 Test Method for Apparent Viscosity of AdhesivesHaving Shear-Rate-Dependent Flow Properties Using Ro-tational ViscometryD2566 Test Method for Linear Shrinkage of Cured Thermo-setting Casting Resins During Cure (Withdrawn 1993)33. Terminology3.1 Definitions of Terms Specific to This S
10、tandard:3.1.1 binder, nthe cementitious part of a grout, mortar, orconcrete that binds the aggregate or filler into a cohesive mass.3.1.2 bonding system, nthe product resulting from thecombination of all the components supplied for use as abonding material.3.1.3 component, na constituent that is int
11、ended to becombined with one or more other constituents to form abonding system.3.1.4 contact strength, nbond strength measured by slantshear after a specified contact and cure time.3.1.5 contact time, nspecified time between when theepoxy system is applied and when the two segments arebonded togeth
12、er and still achieve a specified bond strengthafter a specified curing time and temperature.3.1.6 curing agent, na substance that causes the conver-sion of a fluid resin system to a solid cured resin by means ofa chemical reaction.3.1.7 epoxy equivalent, nthe weight of resin containingone molecular
13、weight of epoxy groups.3.1.8 epoxy resin, na resin that contains or did containepoxy groups principally responsible for its polymerization.1This specification is under the jurisdiction of ASTM Committee C09 onConcrete and Concrete Aggregates and is the direct responsibility of SubcommitteeC09.25 on
14、Organic Materials for Bonding.Current edition approved Dec. 15, 2015. Published February 2016. Originallyapproved in 1978. Last previous edition approved in 2014 as C881/C881M14.DOI: 10.1520/C0881_C0881M-15.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer
15、 Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3The last approved version of this historical standard is referenced onwww.astm.org.*A Summary of Changes section appears at the end of this standardCopyr
16、ight ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States13.1.9 filler, na finely divided solid, predominantly passingthe 75-m No. 200 sieve, that is used to improve certainproperties of the bonding system or to reduce cost.3.1.10 formulator, nthe a
17、gency responsible for preparingthe separate components and for recommending the propor-tions to be used in preparing the final bonding system.3.1.11 lot or batch, nthat quantity of manufactured mate-rial which has been subjected to the same unit chemical orphysical processes intended to make the fin
18、al product substan-tially uniform.3.1.12 manufacturer, na producer of a basic constituentpart of a component.3.1.13 reactive diluent, na relatively free flowing liquidused to reduce the viscosity of the liquid resin or resin mixture,and which contains reactive groups that cause it to become anintegr
19、al part of the cured resin.3.1.14 working (pot) life, nthe time after mixing duringwhich a bonding system or mixture containing it retainssufficient workability for proper use.4. Classification4.1 This specification provides for the classification ofepoxy-resin bonding systems by type, grade, class,
20、 and color.4.2 TypesSeven types of systems that are distinguished bythe requirements of Table 1 are recognized:4.2.1 Type IFor use in non-load bearing application forbonding hardened concrete to hardened concrete and othermaterials, and as a binder in epoxy mortars or epoxy concretes.4.2.2 Type IIFo
21、r use in non-load bearing applications forbonding freshly mixed concrete to hardened concrete.4.2.3 Type IIIFor use in bonding skid-resistant materialsto hardened concrete and as a binder in epoxy mortars or epoxyconcretes used on traffic bearing surfaces (or surfaces subjectto thermal or mechanical
22、 movements).4.2.4 Type IVFor use in load bearing applications forbonding hardened concrete to hardened concrete and othermaterials and as a binder for epoxy mortars and concretes.4.2.5 Type VFor use in load bearing applications forbonding freshly mixed concrete to hardened concrete.4.2.6 Type VIFor
23、bonding and sealing segmental precastelements, as in segment-by-segment erection, and for span-by-span erection when temporary post tensioning is applied.4.2.7 Type VIIFor use as a nonstress carrying sealer forsegmental precast elements when temporary post tensioning isnot applied as in span-by-span
24、 erection.NOTE 1 Epoxy resin systems will adhere to a wide variety ofmaterials, including wood, metals, masonry, and most plastics.Polyethylene, TFE-fluorocarbon, cellophane, and greased or waxed sur-faces are among the few materials to which these systems will not adhere.4.3 GradesThree grades of s
25、ystems are defined accordingto their flow characteristics and are distinguished by theviscosity and consistency requirements of Table 1.4.3.1 Grade 1Low viscosity.4.3.2 Grade 2Medium viscosity.4.3.3 Grade 3Non-sagging consistency.4.4 ClassesClasses A, B, and C are defined for Types Ithrough V, and C
26、lasses D, E, and F are defined for Types VIand VII, in accordance with the range of temperatures forwhich they are suitable (Note 2).4.4.1 Class AFor use below 4C 40F the lowest allow-able temperature to be defined by the manufacturer of theproduct.4.4.2 Class BFor use between 4 and 15C 40 and 60F.4
27、.4.3 Class CFor use above 15C 60F the highestallowable temperature to be defined by the manufacturer of theproduct.4.4.4 Class DFor use between 4 and 18C 40 and 65Ffor Type VI and VII applications.4.4.5 Class EFor use between 15 and 30C 60 and 80Ffor Type VI and VII applications.4.4.6 Class FFor use
28、 above 25C 75F for Type VI andVII applications, the highest allowable temperature to bedefined by the manufacturer of the product.NOTE 2The temperature in question is usually that of the surface ofthe hardened concrete to which the bonding system is to be applied. Thistemperature may be considerably
29、 different from that of the air. Whereunusual curing rates are desired it is possible to use a class of bondingagent at a temperature other than that for which it is normally intended.For example, a Class A system will cure rapidly at room temperature.4.5 ColorEpoxy resin systems are normally unpigm
30、ented,but they can be colored or darkened. If a specific color isdesired, it should be so stated by the purchaser.5. Ordering Information5.1 The purchaser shall specify the type, grade, class, andcolor of bonding system desired and the size of units in whichthe components shall be furnished. Special
31、 requirements re-garding filling of either the components or the final bondingsystem should be stated. The product furnished under thisspecification is intended to be resistant to moisture andtherefore should be suitable for either indoor or outdoorexposure.5.2 The purchaser may specify a minimum ge
32、l time of 5 minfor Types I and IV when automatic proportioning, mixing, anddispensing equipment are used.6. Materials and Manufacture6.1 The systems covered by this specification shall befurnished in two components for combining immediately priorto use in accordance with written instructions of the
33、formulator.Component A shall contain an epoxy resin with or without areactive diluent. Component B shall contain one or morecuring agents, which on mixing with Component A shall causethe mixture to harden. A suitable inert filler may be uniformlyincorporated in one or both components. The filler sha
34、ll beeither nonsettling or readily dispersible in any component inwhich it is incorporated. All systems shall cure under humidconditions, and bond to damp surfaces.7. Chemical Composition7.1 The epoxy resin constituent of Component A shall havean epoxy equivalent of 155 to 275.C881/C881M 1528. Physi
35、cal Properties8.1 A mixture of Components A and B in the proportionsrecommended by the formulator shall conform to the propertiesprescribed in Table 1.9. Safety Hazards9.1 Caution: Epoxy resins contain irritants, especially tothe skin, eyes, and respiratory system. Persons handling thesematerials sh
36、all use appropriate protective clothing, includingrubber or plastic gloves. If an epoxy resin should contact theskin, it shall be removed immediately with a dry cloth or papertowel, and the area of contact washed thoroughly with soap andwater. Solvents shall not be used, because they carry the irrit
37、antinto the skin. Cured epoxy resins are innocuous.10. Sampling10.1 Take a representative sample of each of the twocomponents from a well-blended lot prior to packaging or bywithdrawing samples from no fewer than 5% of the containerscomprising the lot or shipment. Unless the samples of the sameTABLE
38、 1 Physical Requirements of Bonding SystemsPropertyTypeI II III IV V VI VIIViscosity, Pas P:Grade 1, max 2.0 20 2.0 20 2.0 20 2.0 20 2.0 20 . . . . . .Grade 2, min 2.0 20 2.0 20 2.0 20 2.0 20 2.0 20 . . . . . .Grade 2, max 10 100 10 100 10 100 10 100 10 100 . . . . . .Consistency, mm in.:Grade 3, ma
39、x 6.0 14 6.0 14 6.0 14 6.0 14 6.0 14 6.0 14 6.0 14 Gel Time, minutes, min 30A30 30 30A30 30 30Bond Strength,min, MPa psi:Hardened Concrete toHardened Concrete:2 days (moist cure) 7.0 1000 . . . . . . 7.0 1000 . . . 7.0 1000 . . .14 days (moist cure) 10.0 1500 . . . 10.0 1500 10.0 1500 . . . . . . 7.
40、0 1000Freshly Mixed Concrete toHardened Concrete:14 days . . . 10.0 1500 . . . . . . 10.0 1500 . . . . . .Absorption, 24 h, max, % 1 1 1 1 1 . .Heat Deflection Temperature,min, C F:7 days . . . . . . . . . 50 120 50 120 . . . . . .14 days . . . . . . . . . . . . . . . 50 120 50 120Thermal Compatibil
41、ity . . . . . . passes test . . . . . . . . . . . .Linear coefficient ofshrinkage on cure, max 0.005 0.005 . . . 0.005 0.005 . . . . . .Compressive Yield Strength,min, MPa psi:24 h . . . . . . . . . . . . . . . 14.0 2000 . . .36 h . . . . . . . . . . . . . . . . . . 7.0 100048 h . . . . . . . . . .
42、. . . . . 40.0 6000 . . .72 h . . . . . . . . . . . . . . . . . . 14.0 20007 days 55.0 8000 35.0 5000 . . . 70.0 10 000 55.0 8000 . . . . . .Compressive Modulus,MPa psi:min 1000 150 000 600 90 000 . . . 1400 200 000 1000 150 000 . . . . . .max . . . . . . 896 130 000 . . . . . . . . . . . .Tensile S
43、trength, 7 days min,MPa psiB35.0 5000 14.0 2000 . . . 50.0 7000 40.0 6000 . . . . . .Elongation at Break,%, minB1 1 30 1 1 . .Contact Strength,MPa psi, min2 days . . . . . . . . . . . . . . . 7.0 1000 . . .14 days . . . . . . . . . . . . . . . . . . 7.0 1000AMinimum gel time of 5 min when automated
44、proportioning, mixing, and dispensing equipment are used.BNot required for Viscosity Grade 3 Systems.C881/C881M 153component taken from containers show visual evidence ofvariability, they may be combined into a single compositesample. In place of the foregoing, packaged materials may besampled by a
45、random selection of containers of each compo-nent from each lot, provided such a procedure is acceptable tothe purchaser.11. Test Methods11.1 ConsistencyTest Method to Determine The Consis-tency of an Epoxy Resin System.11.1.1 ScopeThis test provides a method for determiningthe consistency of Grade
46、3 epoxy resin systems.11.1.2 Significance and UseThis test method is used todetermine compliance with the requirements of the specifica-tion.11.1.3 Apparatus:11.1.3.1 Paper CupApproximately 0.100L approxi-mately 3 oz. unwaxed paper cup.11.1.3.2 Mixing BladeOrdinary wooden tongue depressoror stick of
47、 similar size.11.1.3.3 Glass Panel.11.1.4 ConditioningCondition the individual componentsand any equipment with which they will come in contact to thefollowing temperatures: ClassA, 0 6 1C 32 6 2F; Class B,10 6 1C 50 6 2F; Class C, 23 6 1C 73 6 2F, Class D,18 6 1C 65 6 2F; Class E, 27 6 1C 80 6 2F;
48、Class F,32 6 1C 90 6 2F or to the temperature at which thematerial will be used (Note 2).11.1.5 ProcedurePrepare approximately 30 cm3of thebonding system. Weigh the necessary amounts of the compo-nents to an accuracy of 1% into a single, approximately100-cm33-oz, unwaxed paper cup. Mix immediately w
49、ith awooden tongue depressor or stick of similar size. Note the timeat which mixing begins. Mix for 3 min, taking care to scrapethe side and bottom of the cup periodically. Immediately applyabout 2 cm3of the mixture to a glass panel. Form a semicy-lindrical bead of the bonding system by drawing the applicatorblade through the sample in a straight
