1、Designation: D5109 99 (Reapproved 2004) D5109 12 An American National StandardStandard Test Methods forCopper-Clad Thermosetting Laminates for Printed WiringBoards1This standard is issued under the fixed designation D5109; the number immediately following the designation indicates the year oforigina
2、l adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope Scope*1.1 These test methods cover the procedures for testing copper-
3、clad laminates produced from fiber-reinforced, thermosettingpolymeric materials intended for fabrication of printed wiring boards.1.2 The procedures appear in the following sections:Procedure SectionReferenced Documents 2Conditioning 4Dielectric Breakdown Voltage Parallel to Laminations 13Dimensiona
4、l Instability 19Dissipation Factor 14Flammability Rating Test 16Flexural Strength, Flatwise at Elevated Temperature 15Flexural Strength, Flatwise at Room Temperature 15Oven Blister Test 17Peel Strength Test at Elevated Temperature 10Peel Strength Test at Room Temperature 9Permittivity 14Pin Holes in
5、 Copper Surface 20Purity of Copper 5Scratches in Copper Surface 21Solder Float Test 8Solvent Resistance 7Surface Resistivity 11Volume Resistivity 11Terminology 3Thickness a positive value is growth.100 after etch LW! 2O 2LW!#O 2LW!# (2)19.5.2 Compute the arithmetic average from the three sets of “af
6、ter etch” measurements. This average is the test measurementfor dimensional instability due to etch on one specimen. Repeat the calculation for each specimen. The average of the three testmeasurements is the test result for dimensional change due to etch for the lengthwise direction.19.5.3 For the c
7、rosswise direction dimensional instability after etch, repeat the calculations of 19.5.1 and 19.5.2 usingappropriate crosswise direction dimensions.19.5.4 For the after etch and bake dimensional instability values repeat the calculations of 19.5.1 and 19.5.2 using thedimensional data obtained after
8、etch and bake on each specimen and in each of the two directions.19.6 ReportReport the following information:19.6.1 Complete identification of the laminate,19.6.2 The lengthwise dimensional instability after etch, %,19.6.3 The lengthwise dimensional instability after etch and bake, %,19.6.4 The cros
9、swise dimensional instability after etch, %,FIG. 2 Target MarksD5109 121019.6.5 The crosswise dimensional instability after etch and bake, %, and19.6.6 Any deviations from the procedures set forth in these test methods.19.7 Precision and Bias:19.7.1 This test has been in use for many years, but no i
10、nformation has been presented to ASTM upon which to base a statementof precision. No activity has been planned to develop such information.19.7.2 This test method has no bias because the value for dimensional instability is determined solely in terms of this testmethod itself.20. Keywords20.1 copper
11、-clad laminate; dielectric breakdown parallel to laminations; dimensional instability; dissipation factor; fiberreinforced; flexural strength; industrial laminate; laminate; oven blister; peel strength; permittivity; printed circuit boards; printedwiring boards; rigid laminate; solder float; surface
12、 resistivity; thermoset; thickness variation; trace; twist; volume resistivity; warp;water absorptionSUMMARY OF CHANGESCommittee D09 has identified the location of selected changes to this specification since the last issue,D5109 99R04, that may impact the use of this specification. (Approved Novemb
13、er 1, 2012.)(1) The conditioning standard D6054 has been replaced by the conditioning standard D618.(2) Non mandatory terms have been eliminated.ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of
14、this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five
15、years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical com
16、mittee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 1
17、9428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org). Permission rights to photocopy the standard may also be secured from the ASTM website (www.astm.org/COPYRIGHT/).D5109 1211
