1、Designation: E801 06 (Reapproved 2011)Standard Practice forControlling Quality of Radiological Examination ofElectronic Devices1This standard is issued under the fixed designation E801; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revisio
2、n, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1. Scope1.1 This practice relates
3、to the radiological examination ofelectronic devices for internal discontinuities, extraneous ma-terial, missing components, crimped or broken wires, anddefective solder joints in cavities, in the encapsulating materi-als, or the boards. Requirements expressed in this practice areintended to control
4、 the quality and repeatability of the radio-logical images and are not intended for controlling the accept-ability or quality of the electronic devices imaged.NOTE 1Refer to the following publications for pertinent informationon methodology and safety and protection: Guides E94 and E1000, and“Genera
5、l Safety Standard for Installation Using Non-Medical X Ray andSealed Gamma Ray Sources, Energies Up to 10 MeV Equipment Designand Use,” Handbook No. 114.21.2 If a nondestructive testing agency as described inPractice E543 is used to perform the examination, the testingagency should meet the requirem
6、ents of Practice E543.1.3 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior
7、to use.2. Referenced Documents2.1 ASTM Standards:3E94 Guide for Radiographic ExaminationE543 Specification for Agencies Performing Nondestruc-tive TestingE1000 Guide for RadioscopyE1255 Practice for RadioscopyE1316 Terminology for Nondestructive Examinations3. Terminology3.1 DefinitionsRefer to Term
8、inology E1316, Section D.4. Direction of Radiation4.1 When not otherwise specified, the direction of thecentral beam of radiation shall be as perpendicular (65%)aspossible to the surface of the film or detector.5. Image Quality Indicators (IQIs)5.1 The quality of all levels of radiological examinati
9、onshall be determined by IQIs conforming to the followingspecifications:5.1.1 The IQIs shall be fabricated of clear acrylic plasticwith steel covers, lead spheres, gold or tungsten wires, and leadnumbers. The steel covers serve as shims.5.1.1.1 The IQIs shall conform to the requirements ofFig. 1.5.1
10、.1.2 The IQIs shall be permanently identified with theappropriate IQI number as shown in Fig. 1. The number shallbe affixed by mounting a 0.125-in. (3.18-mm) tall lead numberon the flat bottom of a 0.250-in. (6.35-mm) diameter hole. Theidentification number shall be located as shown in Fig. 1 andsha
11、ll be of sufficient contrast to be clearly discernible in theradiological image.5.1.1.3 Each semiconductor IQI will have a serial numberpermanently etched or engraved on it. Each serial number willbe traceable to the calibration image supplied by the manufac-turer. The manufacturer shall radiograph
12、the IQI with leadmarkers identifying the serial number. See Fig. 2.6. Application of the Image Quality Indicator (IQI)6.1 The application of the IQIs shall be made in such amanner as to simulate as closely as possible the device beingexamined. To accomplish this objective, a set of eight IQIs isprov
13、ided. These provide a range of cover thickness (of steelshim stock) that is radiologically equivalent to the range ofdevices from glass diodes or plastic-encapsulated circuits(number one) to large power or hybrid circuit devices (numbereight). Wire size increases with shim stock thickness because1Th
14、is practice is under the jurisdiction of ASTM Committee E07 on Nonde-structive Testing and is the direct responsibility of Subcommittee E07.01 onRadiology (X and Gamma) Method.Current edition approved Dec. 1, 2011. Published March 2012. Originallyapproved in 1981. Last previous edition approved in 2
15、006 as E801 - 06. DOI:10.1520/E0801-06R11.2Available from National Institute of Standards and Technology (NIST), 100Bureau Dr., Stop 1070, Gaithersburg, MD 20899-1070, http:/www.nist.gov.3For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at servicea
16、stm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.higher power devices that have thicker coverings normally u
17、selarger interconnecting wires than small signal devices that usethin coverings. Particle size is normally independent of devicetype, so these remain constant.6.2 The IQI used shall be the one with a radiographicdensity or grey level nearest to that of the electronic devicebeing examined. The radiog
18、raphic density or grey level ismeasured on an area of the IQI image that contains no wire orFIG. 1 Image Quality Indicator for Electron DevicesDimensions, in. (mm)a. 0.187 ( 4.750) f. 1.00 (25.40) k. 1.125 (28.575)b. 0.375 ( 9.525) g. 0.375 ( 9.525) l. 1.313 (33.350)c. 0.500 (12.700) h. 0.500 (12.70
19、0) m. 1.50 (38.10)d. 0.625 (15.875) i. 0.625 (15.875) n. 0.125 ( 3.175)e. 0.813 (20.650) j. 0.938 (23.825) p. 0.250 ( 6.350)Particle Diameter, in. (mm)G. 0.015(0.381) J. 0.006(0.152)H. 0.010(0.254) K. 0.004(0.102)I. 0.008(0.203) L. 0.002(0.051)Shim and Wire SpecificationsIQINumberShimThickness, in.
20、(mm)Wire Diameters, in. (mm)ABCDEF1 0 0.002 0.001 0.0005 0.0005 0.001 0.0020 (0.051) (0.025) (0.0127) (0.0127) (0.025) (0051)2 0.002 0.002 0.001 0.0005 0.0005 0.001 0.002(0.051) (0.051) (0.025) (0.0127) (0.0127) (0.025) (0.051)3 0.005 0.002 0.001 0.0005 0.0005 0.001 0.002(0.127) (0.051) (0.025) (0.0
21、127) (0.0127) (0.025) (0.051)4 0.007 0.002 0.001 0.0005 0.0005 0.001 0.0020.178 (0.051) (0.025) (0.0127) (0.0127) (0.025) (0.051)5 0.010 0.003 0.002 0.001 0.001 0.002 0.003(0.254) (0.076) (0.051) (0.025) (0.025) (0.051) (0.076)6 0.015 0.003 0.002 0.001 0.001 0.002 0.003(0.381) (0.076) (0.051) (0.025
22、) (0.025) (0.051) (0.076)7 0.025 0.005 0.003 0.002 0.002 0.003 0.005(0.635) (0.127) (0.076) (0.051) (0.051) (0.076) (0.127)8 0.035 0.005 0.003 0.002 0.002 0.003 0.005(0.889) (0.127) (0.076) (0.051) (0.051) (0.076) (0.127)NOTE 1Use additional layers of shim material as required. The layers shall be 1
23、 by 1.625 in. (25.4 by 41.275 mm). The additional shim material shallbe identified by the placement of lead numbers which denote the thickness immediately adjacent to the IQI during exposure, or as an alternative,documented on the radiographic technique.NOTE 2Tolerance is 60.001 in. (0.025 mm) where
24、 dimensions are 0.000 and 60.003 in. (0.076 mm) where dimensions are 0.00.NOTE 3Bond materials together with cyanoacrylic or equivalent fast-drying epoxy.NOTE 4Particle holes are 0.031 in. (0.787 mm) nominal diameter.NOTE 5Tolerance on particle diameter is + 0.0003 in. (0.0076 mm).NOTE 6Wire grooves
25、 are 0.007 in. (0.178 mm) depth with 90 inclusive angle.NOTE 7The number hole is 0.25 in. (0.635 mm) nominal diameter and 0.125 in. (0.318 mm) deep.E801 06 (2011)2particle images. It shall be measured using a calibrateddensitometer in the case of film, or by pixel grey level value inthe case of radi
26、oscopic examination. When necessary to meetthe requirements of 8.1.1, additional shim stock shall be used.The shim(s) shall be of the same type of steel as in the IQI andshall be placed under the IQI. The additional shim(s) shallexceed the IQI outside dimensions by at least 0.125 in. (3.18mm) on at
27、least one side. The thickness of the shims shall benoted with lead numerals placed adjacent to the shimmed IQIor documented on the radiographic technique.NOTE 2Radiographic film densities shall be measured with a cali-brated densitometer. When films are exposed simultaneously in one filmholder, dens
28、ity variations should be determined on the single or combinedfilms, depending on the manner in which they are read and interpreted.Radiographic film density shall be in the range of 1.0 to 3.5, unlessotherwise specified.6.3 The image distortion shall not exceed 10 % unless ahigher or lower percentag
29、e is agreed upon between thepurchaser and the supplier. Measurements for computation ofimage distortion shall be made in the grid formed by thecrossing wires.6.3.1 Determine percent image distortion (Note 3) as fol-lows:D 5 SM2 SA!/SA# 3 100where:D = percent distortion,SM= wire spacing as measured o
30、n the radiograph, andSA= actual wire spacing.NOTE 3Distortion may be positive or negative.6.4 Particles G through L shall be visible in the image whenIQIs 1 through 7 are used and particles G through K shall bevisible in the image when IQI number 8 is used.6.4.1 If shims are required, the number and
31、 size of particlesthat can be resolved shall be agreed on between the purchaserand the supplier.7. Positioning of IQIs7.1 The IQIs shall be placed so that the plane of the IQI isnormal to the radiation beam.7.1.1 The IQIs used for each exposure or field of view shallbe positioned at the outer edges
32、of the film or field of view butnot impeding the area of interest being examined.8. Number of IQIs8.1 Two IQIs shall be used for each radiograph as shown inFig. 3. The IQIs shall be located at diagonally opposite cornersof the film as shown in Fig. 3. In radioscopic examinations, IQIqualification is
33、 required at least once during examination ofsimilar parts. The procedure for radioscopic IQI qualificationshall be established to subject the IQIs to the same imagemagnification and distortion as the parts will be subjected toduring inspection and the procedure shall be documented onthe radioscopic
34、 scan plan/technique.8.1.1 The radiographic density or grey level of the IQIsshall bracket the radiographic density or grey level of thedevices being examined. Additional shim(s) may be used asdescribed in 6.2 to achieve this requirement.9. Part Identification9.1 In radiography, the image of identif
35、ication markers forthe coordination of the part with the film shall appear on thefilm, so as not to interfere with the interpretation of theradiograph and so that it is evident that the complete part orderwas obtained. These marker positions shall coincide with thepart serial number.9.2 In radioscop
36、y, the image header for each part imageshall include a part serial number for traceability and to ensurethat the complete part order was obtained.10. Identification of the Image10.1 In both radiography and radioscopy, a system ofpositive identification of the image shall be provided inaddition to Se
37、ction 9. Any or all of the following may appear:the name of the examining laboratory, the date, the partnumber, the serial number, the date code, the view, and whetheroriginal or subsequent exposure.11. Multiple-Film Techniques11.1 Film techniques with two or more films of equal ordifferent speeds i
38、n the same holder will be permitted, providedthat the appropriate wires and particles in the IQI for a specificarea are demonstrated.12. Non-Film Techniques12.1 The use of non-film imaging techniques will be per-mitted, provided that the applicable IQI wires and particles aredemonstrated in the resu
39、ltant image.13. Image Quality13.1 The radiographic image shall be free of blemishes thatinterfere with its interpretation.14. Source-Film Distance14.1 Any source-film distance will be satisfactory providedthat the required IQI quality level is attained.NOTE 1Permanently etched or engraved serial num
40、ber.NOTE 218 in. lead markers corresponding to serial number.FIG. 2 Arrangement of IQI and Lead Serial Number for CalibrationImageE801 06 (2011)315. Records15.1 Complete records of the radiological technique or scanplan details, or both, shall be maintained by the examininglaboratory.15.2 A calibrat
41、ion image shall be made by exposing theindividual semiconductor IQI at the proper distance from thefocal spot. The IQI shall be centered in the beam during thisexposure. The certificate shall show the actual dimensions ofthe grids formed by the cross wires and the parallel varianceswithin the grid.
42、It shall also state the actual size of eachparticle.16. Keywords16.1 electronic devices; IQIs; radiography; radioscopy;shim; wireASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard ar
43、e expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years andif not
44、revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which yo
45、u may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United
46、 States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org). Permission rights to photocopy the standard may also be secured from the ASTM website (www.astm.org/COPYRIGHT/).FIG. 3 Typical Image Quality Indicator Arrangement for Electronic DeviceE801 06 (2011)4
