1、Designation: F 1709 97 (Reapproved 2002)Standard Specification forHigh Purity Titanium Sputtering Targets for Electronic ThinFilm Applications1This standard is issued under the fixed designation F 1709; the number immediately following the designation indicates the year oforiginal adoption or, in th
2、e case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope1.1 This specification covers pure titanium sputtering tar-gets used as a raw material in
3、 fabricating semiconductorelectronic devices.1.2 This standard sets purity grade levels, physical at-tributes, analytical methods, and packaging.1.2.1 The grade designation is a measure of total metallicimpurity content. The grade designation does not necessarilyindicate suitability for a particular
4、 application because factorsother than total metallic impurity may influence performance.2. Referenced Documents2.1 ASTM Standards:E 112 Test Methods for Determining Average Grain Size23. Terminology3.1 Definitions of Terms Specific to This Standard:3.1.1 finished product, nfor the purposes of this
5、standard,a “finished product” is a manufactured sputtering target, readyfor use.3.1.2 material lot, nfor the purpose of this standard,a“lot” is material melted into one ingot, and processed as onecontinuous batch in subsequent thermal-mechanical treat-ments.4. Classification4.1 Grades of titanium sp
6、uttering targets are defined inTable 1, based upon total metallic impurity content of theelements listed in Table 2. Impurity contents are reported inparts per million by weight (wt ppm). Higher purity grades, forexample “5N5” and“ 6N”, may be provided, as agreed uponbetween the purchaser and the su
7、pplier.4.2 Purity grade and total metallic impurity levels are basedupon the suite of elements listed in Table 2.5. Ordering Information5.1 Orders for pure titanium sputtering targets shall includethe following:5.1.1 Grade (see 4.1),5.1.2 Special requirements concerning impurities, if re-quired (see
8、 6.1, 6.2, 6.3, 6.4),5.1.3 Grain size, if required (Section 7),5.1.4 Configuration (Section 8),5.1.5 Certification required (Section 12), and5.1.6 Whether or not a sample representative of the finishedproduct is required to be provided by the supplier to thepurchaser.6. Impurities6.1 The minimum sui
9、te of metallic impurity elements to beanalyzed is defined in Table 2. Acceptable analysis methodsand detection limits are specified in Section 11. Elements notdetected will be counted and reported as present at theminimum detection limit (“mdl”). Additional elements may beanalyzed and reported as ag
10、reed upon between the purchaserand the supplier, but these shall not be counted in defining thegrade designation.6.2 Cesium, chlorine, phosphorus, and tantalum presentparticular analysis problems. The limits, analysis method, andmdl may be as agreed upon between the purchaser and thesupplier.1This s
11、pecification is under the jurisdiction of ASTM Committee F01 onElectronics and is the direct responsibility of Subcommittee F01.17 on SputterMetallization.Current edition approved Dec. 10, 2002. Published May 2003. Originallyapproved in 1996. Last previous edition approved in 1997 as F 1709 97.2Annu
12、al Book of ASTM Standards, Vol 03.01.TABLE 1 Titanium Sputtering Target GradesGrade Purity, % Maximum Total Metallic ImpurityContent, wt ppm4N 99.99 1004N5 99.995 505N 99.999 10TABLE 2 Suite of Metallic Elements to be Analyzed and Reportedaluminum iron silicon vanadiumchromium lead silver zinccobalt
13、 lithium potassium sodiumzirconium copper magnesium thoriumboron manganese tin molybdenumtungsten nickel uranium1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.6.3 Nonmetallic elements which shall be analyzed andreported are carbon,
14、hydrogen, nitrogen, oxygen, and sulfur.Maximum limits for nonmetallic impurities shall be as agreedupon between the purchaser and the supplier.6.4 Acceptable limits and analytical techniques for particu-lar elements in critical applications may be agreed uponbetween the purchaser and the supplier.7.
15、 Grain Size7.1 The average and the maximum grain size shall be asagreed upon between the purchaser and the supplier.7.2 Average grain size shall be measured and reported inaccordance with Test Methods E 112, or other equivalentmethod.7.3 Maximum grain size shall be established by making anoptical or
16、 scanning electron micrograph of a polished andetched specimen typical of the finished product. The magnifi-cation must be calibrated to 6 10 % of nominal using anappropriate gage. At least 50 grains must be resolved in themicrograph. The maximum grain size is the diagonal measureof the largest tita
17、nium crystal visible in the field of view,divided by the magnification.7.4 Average grain size and maximum grain size can alter-natively be established using computer-assisted image analysismethods. If image analysis methods are used, then the averagegrain size is defined as the mean value obtained f
18、rom the graindiameter distribution data. The maximum grain size is definedas the largest grain diameter recorded in the grain sizedistribution data set. At least 50 grains must be included in theimage analysis data set.8. Configuration8.1 Each product shall conform to an appropriate engineer-ing dra
19、wing, agreed upon between the purchaser and thesupplier.8.2 Nominal dimensions, tolerances, and other attributesshall be agreed upon between the purchaser and the supplier.9. Workmanship, Finish, Appearance9.1 Workmanship, finish, and appearance shall be agreedupon between the purchaser and the supp
20、lier.9.2 Surfaces must be free of any contaminates such as dirtor oils that could adversely effect the performance of thematerial, as agreed upon between the purchaser and thesupplier.10. Sampling10.1 Analysis for impurities and gasses shall be performedon samples that are representative of the fini
21、shed sputteringtarget.10.1.1 Unless otherwise agreed upon between the purchaserand the supplier, impurity analyses for metallic and nonmetal-lic impurities shall be made by the supplier for one or moresample specimens that are representative of the production lot.These data shall be averaged to esta
22、blish conformance with thegrade designation (4.1), other metallic impurity limits (6.1, 6.2,6.4), and the agreed upon limits for nonmetallic content (6.3).11. Analytical Methods11.1 Analysis for impurities listed in Section 6 and Table 2shall be performed as follows:11.1.1 Trace Metallic ImpuritiesB
23、y glow discharge massspectrometer (GDMS) with a nominal mdl # 0.05 weight ppm.NOTE 1The mdl for some metallic species by GDMS is 0.05 weightppm, as limited by interferences.11.1.2 Carbon, Oxygen, SulfurBy fusion and gasextraction/infrared spectroscopy3with an mdl of #10 weightppm.11.1.3 NitrogenBy f
24、usion and gas extraction with an mdlof #10 weight ppm.11.1.4 HydrogenBy fusion and gas extraction with an mdlof #3 weight ppm.11.1.5 Other analytical techniques may be used providedthey can be proved equivalent to the methods specified andhave mdl less than or equal to the specified methods.12. Cert
25、ification12.1 When required by the purchaser a certificate ofanalysis/compliance that documents the finished target shall beprovided by the supplier.12.2 The certificate of analysis/compliance shall state themanufacturers or suppliers name, the suppliers lot number,the grade level (Section 4), impur
26、ity levels (Section 6), methodof analysis (Section 11), and any other information as agreedupon between the purchaser and the supplier.12.2.1 Impurities Reporting Option 1:If agreed upon between the purchaser and the supplier,impurity levels may be reported using actual analytical resultsfor the mat
27、erial lot from which the sputtering target is made(10.1.1). All impurity levels, except thorium and uranium, shallbe reported in weight ppm. Thorium and uranium are generallycontrolled at very low levels in this material and may bereported in parts per billion by weight (weight ppb). Nonde-tected tr
28、ace impurities (Section 6) shall be reported as presentat the mdl concentration (Section 11).12.2.2 Impurities Reporting Option 2:If agreed upon between the purchaser and the supplier,impurity levels may be reported by citing typical results basedupon historical data for the same process.13. Packagi
29、ng13.1 Each piece shall be enclosed in packaging that insuresfreedom from contamination in handling and shipping. Eachpiece shall be packed for shipment in a shipping container thatinsures product integrity during transport.14. Keywords14.1 coating; sputtering; target; thin film; titanium3Analytical
30、 equipment manufactured by Leco Corporation, St. Joseph, MI hasbeen found satisfactory for making fusion and gas extraction analyses for carbon,oxygen, sulfur, nitrogen, and hydrogen at the required mdls.F 1709 97 (2002)2ASTM International takes no position respecting the validity of any patent righ
31、ts asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any
32、time by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments wil
33、l receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by AST
34、M International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org).F 1709 97 (2002)3
