1、BRITISH STANDARD BS 123300-003: 2001 System of quality assessment Capability detail specification Rigid multilayer printed boards ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123300-003:2001 This British Standard, having been prepared under the direction of the
2、 Electrotechnical Standards Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to work on this British Standard: Committee reference EPL/501 Draft for comment 01/
3、204157 DC ISBN 0 580 38522 1 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Contract Electronics Manufacturers Fed
4、eration of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentBS 123300-003:2001 BSI 17 December 2001 i
5、 Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 1 4 Capability qualifying component 2 5 Range of capability approval 4 6 Capability test programme 4 7 Additional capability 5 8 Traceability 5 Annex A (n
6、ormative) Test pattern for marking inks 20 Annex B (normative) Test pattern for solder masks 21 Annex C (normative) Test pattern for bonded heatsinks 22 Annex D (normative) Use of ANSI/IPC A-600F 23 Annex E (normative) Test method for determination of characteristic impedence by Time Domain Reflecto
7、metry (TDR) 26 Annex F (informative) Sample handling considerations for TDR 33 Annex G (informative) Additional information about TDR 34 Bibliography 35 Figure A.1 Test pattern for marking inks 20 Figure B.1 Test pattern for solder masks 21 Figure C.1 Test pattern for bonded heatsinks 22 Figure E.1
8、Test specimen details 29 Figure E.2 Possible equipment configuration 30 Figure E.3 Schematic showing undisturbed interval in situ method 31 Figure E.4 Incident wave voltage showing 2 air line delay 32 Figure E.5 Schematic showing undisturbed interval 33 Table 1 Base materials 2 Table 2 Metallic fini
9、shes 3 Table 3 Organic finishes 3 Table 4 Capability approval test schedule and performance requirements General 6 Table 5 Capability approval test schedule and performance requirements Additional metallic conductor finishes 12 Table 6 Capability approval test schedule and performance requirements A
10、dditional contact finishes 15 Table 7 Capability approval test schedule and performance requirements Permanent organic finishes 16 Table 8 Capability approval test schedule and performance requirements Bonded heatsinks 18 Table D.1 Capability approval test schedule General and additional metallic co
11、nductor finishes 23 Table D.2 Capability approval test schedule Printed contacts 24 Table D.3 Capability approval test schedule Solder resist 25 Table D.4 Capability approval test schedule Flexible/flex-rigid printed boards 25BS 123300-003:2001 ii BSI 17 December 2001 Foreword This British Standard
12、has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circulated and voted on in CENELEC, but the CENELEC Technical Board decided not
13、to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publish national standards on the basis of the prEN 123000 series (Technical Board
14、 decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they are considered to be an improvement upon the EN series, for the following r
15、easons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in response to industry requests. c) References to obsolete CECC regula
16、tory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take account of new European Eco-Directives. This British Standard is a capabilit
17、y detail specification, based upon the sectional specification, BS 123300. It should be read in conjunction with the generic specification, BS 123000, and the sectional specification, BS 123300. Users of printed boards procured using this capability detail specification should satisfy themselves tha
18、t the sample sizes and frequencies are appropriate for the needs of their product. Alternative requirements should be included in the customer detail specification. ACKNOWLEDGEMENT. Many of the illustrations in this British Standard have been included courtesy of IPC. Moreover, selected requirements
19、 from ANSI/IPC A-600F have been incorporated into the requirements of this British Standard. Copies of this and other IPC publications are widely available, but in case of difficulties contact: IPC 2215 Sanders Road Northbrook Illinois USA Tel: +847 509 9700 Fax: +847 509 9798 www.ipc.orgBS 123300-0
20、03:2001 BSI 17 December 2001 iii Annex A, Annex B, Annex C, Annex D and Annex E are normative. Annex F and Annex G are informative. It has been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and experienced people
21、, for whose use it has been produced. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Sum
22、mary of pages This document comprises a front cover, an inside front cover, pages i to iv, pages 1 to 35 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued.iv blankBS 123300-003:2001 BSI 17 December 2001 1 1 Scope This British Standard s
23、pecifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to rigid multilayer printed boards. It is applicable for rigid multilayer printe
24、d boards made with the materials and surface finishes specified in clause 4. This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components. 2 Normative references The following normative documents contain provisions w
25、hich, through reference in this text, constitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, the latest edition of the publication referred to applies. BS 2011-2.1Ca (IEC 60068-2
26、-3), Environmental testing Part 2.1: Tests Test Ca Damp heat, steady state. BS 2011-2.1Ta (IEC 60068-2-54), Environmental testing Part 2.1: Tests Test Ta Soldering Solderability testing by the wetting balance method. BS 4584-103.1, Metal-clad base materials for printed wiring boards Part 103: Specia
27、l materials used in connection with printed circuits Section 103.1: Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour t
28、erms Part 1: Terms common to power, telecommunications and electronics Group 11: Printed circuits. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS 123000:2001, System of quality assessment Generic specification Printed boards. BS 123200-003:2001, System of qualit
29、y assessment Capability detail specification Rigid double-sided printed boards with plated-through holes. BS 123300:2001, System of quality assessment Sectional specification Rigid multilayer printed boards. BS EN 60249-2-11 (IEC 60249-2-11), Specifications Part 2-11: Specification for thin epoxide
30、woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. BS EN 60249-2-12 (IEC 60249-2-12), Specifications Part 2-12: Thin epoxide woven glass fabric copper-clad sheet of defined flammability, for use in the fabrication of multil
31、ayer printed boards. BS EN 61249 (IEC 61249) (all parts), Materials for interconnection structures. BS EN ISO 1463:1982, Metallic and oxide coatings Measurement thickness Microscopical method. BS EN ISO 3543:1981, Metallic and non-metallic coatings Measurement thickness Beta backscatter method. BS Q
32、C 221100, Radio frequency connectors RF coaxial connectors with inner diameter of outer conductor 4,13 mm (0,163 in) with screw coupling Characteristic impedance 50 ohms (Type SMA). ANSI/IPC A-600F, Acceptability of printed boards. 3 Terms and definitions For the purposes of this British Standard th
33、e terms and definitions given in BS 4727-1:Group 11, BS 123000 and BS 123300 together with the following apply. 3.1 referee method test method, where a choice of methods is given, to be used in the case of disputed test data arising from the two methodsBS 123300-003:2001 2 BSI 17 December 2001 4 Cap
34、ability qualifying component 4.1 General Test boards to be used as capability qualifying components for basic capability shall: a) be made from a combination of the materials specified in 4.2. The construction shall be as given in BS 123300:2001, 9.4; b) bear the composite test pattern specified in
35、BS 123300:2001, 9.3 (or equivalent composite test pattern), for basic and other metallic finishes, organic surface finishes and external bonded heat sinks; c) have one of the surface finishes specified by groups 11 to 19 in 4.3. Test boards to be used as modified capability qualifying components for
36、 the demonstration of additional capability shall be as specified in clause 7. 4.2 Base materials For the demonstration of basic capability, the base materials specified in Table 1 shall be used and shall conform to the performance requirements specified in Table 4, Table 5, Table 6, Table 7 and Tab
37、le 8. For the demonstration of additional capability, if base materials other than those specified in Table 1 are used, they shall be detailed in the manufacturers capability manual. Base materials used for the demonstration of additional capability shall conform to the performance requirements spec
38、ified in Table 4, Table 5, Table 6, Table 7 and Table 8 unless they have inherent electrical or physical characteristics that prevent the performance requirements from being met, in which case they shall conform to the criteria detailed in the relevant base material specification. Table 1 Base mater
39、ials Material group designation Material specified in Base material type Grade Base material thickness range Copper thickness mm m A BS EN 60249-2-11 Epoxide woven glass General purpose 0.05 to 0.8 18, 35, 70, 105 BS EN 60249-2-12 Epoxide woven glass Defined flammability BS 4584-103.1 Prepreg Genera
40、l purpose 0.05 Not applicable BS 4584-103.1 Prepreg Defined flammabilityBS 123300-003:2001 BSI 17 December 2001 3 4.3 Surface finishes 4.3.1 Metallic finishes 4.3.1.1 General Metallic finishes shall be as specified in Table 2. Table 2 Metallic finishes The demonstration of metallic group finishes 21
41、, 22, 23 or 24 shall be combined with a finish from groups 11 to 19. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the same material, where claimed, shall be demonstrated separately. 4.3.1.2 Accelerated ageing The ability of finish
42、groups 11 to 19 to solder after extended or adverse storage conditions shall be demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. NOTE Each finish that conforms to the requirements of the ageing test is highlighted by the inc
43、lusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the qualified product list. 4.3.2 Organic finishes Organic finishes, where claimed, shall be as specified in Table 3. Table 3 Organic finishes The demonstration of organic finish groups a, b
44、, c or d shall be over a finish from groups 11 to 19. All claimed types of solder resist shall be tested separately. Finish group designation Surface finish Abbreviation Revalidation period a 11 Bare copper Cu 1 month 12 Copper with solderable organic surface protection Cu (opc) 6 months 13 Copper w
45、ith oxide Cu (CuO) Not applicable 14 Tin, TinLead Sn, SnPb 12 months 15 TinLead (fused) SnPb (f) 12 months 16 TinLead (dipped and levelled) SnPb (dl) 18 months 17 Immersion tin Sn (smt) 3 months 18 Immersion gold over electroless nickel AuNi (smt) 3 months 19 Immersion silver Ag (smt) 3 months 20 Ot
46、her 21 Specimen K b5 m, gold-plated on copper; all other specimens using finish group 11 to 19 c 5 AuCu 22 Specimen K b0.7 m, gold-plated on 5 m nickel; all other specimens using finish group 11 to 19 c 0.7 Au5Ni 23 Specimen K b2.5 m, gold-plated on copper; all other specimens using finish group 11
47、to 19 c 2.5 AuCu 24 Specimen K b2.5 m, gold-plated on 5 m nickel; all other specimens using finish group 11 to 19 c 2.5 Au5Ni a See BS 123000:2001, 4.4. b The specimens are defined in BS 123300:2001, Figure 1 to Figure 7. c See clause 5. Finish group designation Organic finish Abbreviation a Dry fil
48、m solder mask DSM b Wet resist solder mask WSM c Liquid photopolymer solder mask LSM dM a r k i n g i n k M I e Conductive ink CIBS 123300-003:2001 4 BSI 17 December 2001 5 Range of capability approval Capability approval granted on the testing of one variant shall be deemed to be valid within the l
49、imits specified in BS 123000:2001, 5.5 for: a) metal-clad base materials within one group designation; b) all base material thicknesses and all foil thicknesses of the material in accordance with 4.2. NOTE In some cases, a demonstration of one metallic surface finish may also be taken as being representative of others, as listed below: 1) finish group 11 covers finish group 11 only; 2) finish group 12 covers finish groups
