1、BRITISH STANDARD BS 123500-003: 2001 System of quality assessment Capability detail specification Flexible single-sided and double-sided printed boards with through-connections ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123500-003:2001 This British Standard,
2、having been prepared under the direction of the Electrotechnical Standards Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to work on this British Standard: Co
3、mmittee reference EPL/501 Draft for comment 01/204161 DC ISBN 0 580 38526 4 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Associ
4、ation of Contract Electronics Manufacturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date C
5、ommentBS 123500-003:2001 BSI 17 December 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 2 4 Capability qualifying component 2 5 Range of capability approval 5 6 Capability test programme 5 7 Addi
6、tional capability 6 8 Traceability 6 Annex A (normative) Test pattern for marking inks 21 Annex B (normative) Test pattern for solder masks 22 Annex C (normative) Assembly of test pattern for rigidizers or stiffeners 23 Annex D (normative) Use of ANSI/IPC A-600F 25 Annex E (normative) Test method fo
7、r solder resistance of organic coatings 27 Bibliography 29 Figure A.1 Test pattern for marking inks 21 Figure B.1 Test pattern for solder mask or coverlayer 22 Figure C.1 Assembly of test pattern for rigidizers or stiffeners 23 Figure C.2 Component parts of test pattern for rigidizers or stiffeners
8、24 Table 1 Base materials 3 Table 2 Metallic finishes 4 Table 3 Organic finishes 4 Table 4 Capability approval test schedule and performance requirements General 7 Table 5 Capability approval test schedule and performance requirements Additional metallic conductor finishes 12 Table 6 Capability appr
9、oval test schedule and performance requirements Additional contact finishes 16 Table 7 Capability approval test schedule and performance requirements Permanent organic finishes 17 Table 8 Capability approval test schedule and performance requirements Bonded stiffeners and rigidizers 19 Table D.1 Cap
10、ability approval test schedule General and additional metallic conductor finishes 25 Table D.2 Capability approval test schedule Printed contacts 26 Table D.3 Capability approval test schedule Solder resist 27 Table D.4 Capability approval test schedule Flexible/flex-rigid printed boards 27BS 123500
11、-003:2001 ii BSI 17 December 2001 Foreword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circulated and
12、voted on in CENELEC, but the CENELEC Technical Board decided not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publish national
13、standards on the basis of the prEN 123000 series (Technical Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they are consid
14、ered to be an improvement upon the EN series, for the following reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in res
15、ponse to industry requests. c) References to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take account of
16、new European Eco-Directives. This British Standard is a capability detail specification, based upon the sectional specification, BS 123500. It should be read in conjunction with the generic specification, BS 123000, and the sectional specification, BS 123500. Users of printed boards procured using t
17、his capability detail specification should satisfy themselves that the sample sizes and frequencies are appropriate for the needs of their product. Alternative requirements should be included in the customer detail specification. ACKNOWLEDGEMENT. Selected requirements from ANSI/IPC A-600F have been
18、incorporated into the requirements of this British Standard. Copies of this and other IPC publications are widely available, but in case of difficulties contact: IPC 2215 Sanders Road Northbrook Illinois USA Tel: +847 509 9700 Fax: +847 509 9798 www.ipc.orgBS 123500-003:2001 BSI 17 December 2001 iii
19、 Annex A, Annex B, Annex C, Annex D and Annex E are normative. It has been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and experienced people, for whose use it has been produced. A British Standard does not pur
20、port to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front
21、cover, pages i to iv, pages 1 to 29 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued.iv blankBS 123500-003:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies the capability qualifying component, its characteristics to
22、be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flexible single-sided and double-sided printed boards with through-connections. It is applicable for flexible single-sided and double-sided printe
23、d boards with through-connections made with the materials and surface finishes specified in clause 4. This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components. 2 Normative references The following normative docum
24、ents contain provisions which, through reference in this text, constitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, the latest edition of the publication referred to applies. B
25、S 2011-2.1Ca (IEC 60068-2-3), Environmental testing Part 2.1: Tests Test Ca Damp heat, steady state. BS 2011-2.1T:1981 (IEC 60068-2-20:1979), Environmental testing Part 2.1: Tests Test T Soldering. BS 2011-2.1Ta (IEC 60068-2-54), Environmental testing Part 2.1: Tests Test Ta Soldering Solderability
26、testing by the wetting balance method. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and electronics Group 11: Printed circuits. BS 6221-2:1991 (IEC 60326-2:1990), Print
27、ed wiring boards Part 2: Methods of test. BS 123000:2001, System of quality assessment Generic specification Printed boards. BS 123500:2001, System of quality assessment Sectional specification Flexible single-sided and double-sided printed boards with through-connections. BS EN 60249-2-1 (IEC 60249
28、-2-1), Specifications Part 2-1: Specification for phenolic cellulose paper copper-clad laminated sheet, high electrical quality. BS EN 60249-2-2 (IEC 60249-2-2), Specifications Part 2-2: Specification for phenolic cellulose paper copper-clad laminated sheet, economic quality. BS EN 60249-2-3 (IEC 60
29、249-2-3), Specifications Part 2-3: Metal-clad base materials for printed wiring boards Copper-clad base material Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test). BS EN 60249-2-4 (IEC 60249-2-4), Specifications Part 2-4: Specificat
30、ion for epoxide woven glass fabric copper-clad laminated sheet, general purpose grade. BS EN 60249-2-5 (IEC 60249-2-5), Specifications Part 2-5: Specification No. 5 Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test). BS EN 60249-2-6 (IEC 60249-2-6)
31、, Specifications Part 2-6: Specification No. 6 Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test). BS EN 60249-2-7 (IEC 60249-2-7), Specifications Part 2-7: Specification No. 7 Phenolic cellulose paper copper-clad laminated sheet of defined flammab
32、ility (vertical burning test). BS EN 60249-2-8 (IEC 60249-2-8), Base material for printed circuits Specifications Part 2-8: Specification for flexible copper-clad polyester (PETP) film. BS EN 60249-2-13 (IEC 60249-2-13), Base material for printed circuits Specifications Part 2-13: Flexible copper-cl
33、ad polyimide film, general purpose grade. BS EN 60249-2-14 (IEC 60249-2-14), Specifications Part 2-14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality. BS EN 60249-2-15 (IEC 60249-2-15), Specifications Part 2-15: Flexible copper-
34、clad polyimide film, of defined flammability. BS EN 60068-2-2 (IEC 60068-2-2), Environmental testing Test methods Part 2-2: Tests B Dry heat. BS 123500-003:2001 2 BSI 17 December 2001 BS EN ISO 1463:1982, Metallic and oxide coatings Measurement thickness Microscopical method. BS EN ISO 3543:1981, Me
35、tallic and non-metallic coatings Measurement thickness Beta backscatter method. ANSI/IPC A-600F, Acceptability of printed boards. 3 Terms and definitions For the purposes of this British Standard the terms and definitions given in BS 4727-1:Group 11, BS 123000 and BS 123500 together with the followi
36、ng apply. 3.1 referee method test method, where a choice of methods is given, to be used in the case of disputed test data arising from the two methods 4 Capability qualifying component 4.1 General Test boards to be used as capability qualifying components for basic capability shall: a) be made of o
37、ne of the copper-clad base materials specified in 4.2, with a nominal base film thickness of 75 m polyester film or 50 m polyimide film; b) bear the composite test pattern specified in BS 123500:2001, 9.3 (or equivalent composite test pattern); c) have one of the surface finishes specified by groups
38、 11, 12, 13, 14, 15, 16 or 17 in 4.3. Test boards to be used as capability qualifying components for additional capability shall be modified to demonstrate the claimed capability. See BS 123000:2001, 5.3.3. 4.2 Base materials For the demonstration of basic capability, the base materials specified in
39、 Table 1 shall be used and shall conform to the performance requirements specified in Table 4, Table 5, Table 6, Table 7 and Table 8. For the demonstration of additional capability, if base materials other than those specified in Table 1 are used, they shall be detailed in the manufacturers capabili
40、ty manual. Base materials used for the demonstration of additional capability shall conform to the performance requirements specified in Table 4, Table 5, Table 6, Table 7 and Table 8 unless they have inherent electrical or physical characteristics that prevent the performance requirements from bein
41、g met, in which case they shall conform to the criteria detailed in the relevant base material specification.BS 123500-003:2001 BSI 17 December 2001 3 Table 1 Base materials 4.3 Surface finishes 4.3.1 Metallic finishes 4.3.1.1 General Metallic finishes shall be as specified in Table 2. Material grou
42、p designation Material specified in Base material type a Grade Base material thickness range Copper thickness mm m A BS EN 60249-2-8 Polyester film General purpose 12.5 to 125 18, 35, 70 B BS EN 60249-2-13 Polyimide film General purpose BS EN 60249-3-15 Polyimide film Defined flammability (vertical)
43、 C BS EN 60249-2-8 Polyester film General purpose 0, 18, 35, 70 D BS EN 60249-2-13 Polyimide film General purpose BS EN 60249-2-15 Polyimide film Defined flammability (vertical) E BS EN 60249-2-1 Phenolic paper High electrical 200 to 6 400 BS EN 60249-2-2 Phenolic paper Economic BS EN 60249-2-3 Epox
44、ide paper Defined flammability (vertical) BS EN 60249-2-6 Phenolic paper Defined flammability (horizontal) BS EN 60249-2-7 Phenolic paper Defined flammability (vertical) BS EN 60249-2-14 Phenolic paper Economic, defined flammability (vertical) F BS EN 60249-2-4 Epoxide woven glass General purpose 20
45、0 to 6 400 0, 18, 35, 70 BS EN 60249-2-5 Epoxide woven glass Defined flammability a Material group designations: A and B cover the base materials for flexible circuits; C and D cover materials for film stiffeners; E and F cover rigid board materials used for the fabrication of rigidizers.BS 123500-0
46、03:2001 4 BSI 17 December 2001 Table 2 Metallic finishes The demonstration of metallic group finishes 21, 22, 23 or 24 shall be combined with a finish from groups 11, 12, 13, 14, 15, 16 or 17. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finis
47、hes of the same material, where claimed, shall be demonstrated separately. 4.3.1.2 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16 or 17 to solder after extended or adverse storage conditions shall demonstrated using accelerated ageing. This test shall be carried out on those
48、finishes where accelerated ageing is claimed. NOTE Each finish that conforms to the requirements of the ageing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the qualified product list. 4.3.2 Organic finishe
49、s Organic finishes, where claimed, shall be as specified in Table 3. Table 3 Organic finishes The demonstration of organic finish groups a, b, c, d or e shall be over a finish from groups 11, 12, 13, 14, 15, 16 or 17. All claimed types of solder resist shall be tested separately. Film coverlayers having different adhesive types shall be demonstrated separately. Finish group designation Surface finish Abbreviation Revalidatio
