1、BRITISH STANDARD BS 123600:2001 System of quality assessment Sectional specification Flex-rigid multilayer printed boards with through-connections ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123600:2001 This British Standard, having been prepared under the dir
2、ection of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to the work on this British Standard: Committee reference EPL/501 Draft f
3、or comment 01/204162 DC ISBN 0 580 38529 9 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Contract Engineers Manuf
4、acturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentsBS 123600:2001 BSI 17 Decemb
5、er 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 1 4 General requirements 1 5 Capability approval 1 6 Relevant specification 2 7 Capability test programme 2 8 Quality conformity inspection 2 9 T
6、est patterns and test boards 6 Bibliography 29 Figure 1 Composite test pattern Layer 1 8 Figure 2 Composite test pattern Layer 2 9 Figure 3 Composite test pattern Layer 3 10 Figure 4 Composite test pattern Layer 4 11 Figure 5 Composite test pattern Layer 5 12 Figure 6 Composite test pattern Layer 6
7、13 Figure 7 Composite test pattern Specimens A, B and C 14 Figure 8 Composite test pattern Specimen D 15 Figure 9 Composite test pattern Specimen E 16 Figure 10 Composite test pattern Specimens F, G and H 17 Figure 11 Composite test pattern Specimen J (layers 1 to 3) 18 Figure 12 Composite test patt
8、ern Specimen J (layers 4 to 6) 19 Figure 13 Composite test pattern Specimen M 20 Figure 14 Composite test pattern Specimens K and N 21 Figure 15 Composite test pattern Specimen L (layer 3) 22 Figure 16 Composite test pattern Specimen L (layer 4) 23 Figure 17 Examples of multiple arrangements 24 Figu
9、re 18 Examples of soldered holes 25 Figure 19 Methods of reinforcing lands 26 Figure 20 Examples relating to access holes 27 Figure 21 Examples of delamination 28 Table 1 Group A quality conformity inspection 3 Table 2 Group B quality conformity inspection 4 Table 3 Group C quality conformity inspec
10、tion 5 Table 4 Test specimen details 6 Table 5 Structure of a typical test board 7BS 123600:2001 ii BSI 17 December 2001 Foreword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft p
11、roposals to revise the EN 123000 series dated 1992 and 1997. These were circulated and voted on in CENELEC, but the CENELEC Technical Board decided not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to
12、grant derogation from standstill to the British National Committee to publish national standards on the basis of the prEN 123000 series (Technical Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they
13、 are replaced by revised EN standards. They have been published because they are considered to be an improvement upon the EN series, for the following reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made
14、to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in response to industry requests. c) References to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industr
15、y requires standards that are subject to ongoing revision, in order to take account of new European Eco-Directives. This British Standard is a sectional specification. It should be read in conjunction with the generic specification, BS 123000, and any associated capability detail specification. It h
16、as been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and experienced people, for whose use it has been produced. A British Standard does not purport to include all the necessary provisions of a contract. Users o
17、f British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages 1 to 29 and a back cover. The BSI copy
18、right notice displayed in this document indicates when the document was last issued.BS 123600:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies characteristics to be assessed and test methods to be used for capability approval testing and for quality conformity inspection (lot-by-l
19、ot and periodic inspection). It is applicable for all flex-rigid multilayer printed boards with through-connections, irrespective of their method of manufacture, when they are ready for the mounting of components. This British Standard is a sectional specification intended for use with the IECQ syst
20、em of quality assessment for electronic components. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of these publica
21、tions do not apply. For undated references, the latest edition of the publication referred to applies. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and electronics Grou
22、p 11: Printed circuits. BS 6001-1:1999 (ISO 2859-1:1999), Sampling procedures for inspection by attributes Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS 6221-3 (IEC 60
23、326-3), Printed wiring boards Guide for the design and use of printed wiring boards. BS 123000:2001, System of quality assessment Generic specification Printed boards. 3 Terms and definitions For the purposes of this British Standard the terms and definitions given in BS 4727-1:Group 11 and BS 12300
24、0 together with the following apply. 3.1 relevant specification product specification for an actual batch of printed boards, i.e. a customer detail specification as well as a capability detail specification applied to a specific material, surface finish etc., as applicable 4 General requirements The
25、 following specifications for flex-rigid multilayer printed boards with through-connections shall be prepared, unless a suitable capability detail specification already exists, using this British Standard as a basis: a) capability detail specifications for general use or applying to specific applica
26、tions; b) customer detail specifications, which shall be prepared in accordance with BS 123000:2001, 7.2. NOTE 1 BS 123600-003 is an example of a capability detail specification for flex-rigid multilayer printed boards with through-connections. NOTE 2 A capability detail specification is prepared ei
27、ther by an international or national body or by a manufacturer (see also BS CECC 00111-4). A customer detail specification should preferably be written by the customer and allocated a number within the customers own system. Further details are given in BS 123000 and BS CECC 00114-3. 5 Capability app
28、roval 5.1 Basic capability Testing shall be carried out on the composite test pattern given in clause 9. 5.2 Additional capability BS 123000:2001, 5.3.3 shall apply. NOTE For multiple arrangements see also clause 9. 5.3 Maintenance of capability approval BS 123000:2001, 5.6 shall apply.BS 123600:200
29、1 2 BSI 17 December 2001 6 Relevant specification The relevant specification shall contain all the information necessary to define the printed board clearly and completely. Care shall be taken to avoid unnecessary proscriptions. Tolerances shall be stated as necessary. Nominal values without toleran
30、ces, or simple maximum or minimum values, shall be given where these are sufficient. Where tolerances are necessary for certain areas or parts of the printed board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation, of tolerance cla
31、sses etc., the selections given in BS 6221-3 shall be applied as practical. In the case of discrepancy between the customer detail specification and other pertinent specifications (e.g. generic specification, sectional specification or capability detail specification), the customer detail specificat
32、ion shall prevail. 7 Capability test programme For initial demonstration and subsequent re-demonstration, the capability approval test programme shall be in accordance with the relevant capability detail specification. Demonstration of additional capability shall be in accordance with BS 123000:2001
33、, 5.3.3. NOTE For composite test pattern specimens, see clause 9 and Figure 1, Figure 2, Figure 3, Figure 4, Figure 5, Figure 6, Figure 7, Figure 8, Figure 9, Figure 10, Figure 11, Figure 12, Figure 13, Figure 14, Figure 15 and Figure 16. Examples of multiple arrangements of test patterns are shown
34、in Figure 17. Examples of soldered holes are shown in Figure 18, methods of reinforcing lands in Figure 19, examples relating to access holes in Figure 20, and examples of delamination in Figure 21. There shall be no more than three failures throughout the entire sequence of tests. 8 Quality conform
35、ity inspection 8.1 General Quality conformity inspection shall be conducted on samples which are either taken from the production batch, or which are representative of the production batch (i.e. manufactured using the same processes, having the same features, and concurrent with the released batch).
36、 8.2 Sampling plans The sampling plans of BS 6001-1, as referenced in Table 1, Table 2 and Table 3, shall be used. In all cases there shall be no defects. NOTE 1 Unless otherwise specified, production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lo
37、t and periodic inspection. NOTE 2 Where specially designed test patterns are used, they may be included in the panel. They may be based upon the appropriate pattern of the composite test pattern as detailed in clause 9. 8.3 Inspection groups Inspection level C shall be used, unless another inspectio
38、n level is specified in the customer detail specification. Other inspection levels shall be in accordance with Table 1 and Table 2. Printed boards shall be aggregated into inspection lots in accordance with BS 123000:2001, 6.1. NOTE For definition of the inspection groups, see BS 123000:2001, 6.3. Q
39、uality conformity inspection shall be carried out in accordance with Table 1, Table 2 and Table 3.BS 123600:2001 BSI 17 December 2001 3 Table 1 Group A quality conformity inspection Inspection group Characteristics Test no. aAssessment level A Assessment level B Assessment level C Assessment level D
40、 IL b AQL c IL AQL IL AQL IL AQL Sub-group A1 Visual inspection See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Conformity 1 S2 2.5 % 100 % Identification 1 S2 2.5 % 100 % Appearance 1a S2 2.5 % 100 % Workmanship 1a S2 2.5 % 100 % Board edges 1a S2 2.5 % 100 % Eyelets 1a S2 2.5 % 100 % Bonding,
41、conductor to substrate 1a S2 2.5 % 100 % Bonding, coverlayer to substrate and pattern 1a S2 2.5 % 100 % Conductor defects 1b S2 2.5 % 100 % Particles between conductors 1b, 1c S2 2.5 % 100 % Sub-group A2 Dimensional examination Board dimensions 2 S1 4.0 % S4 2.5 % Holes 2 S1 4.0 % S4 2.5 % Access ho
42、les 2 S1 4.0 % S4 2.5 % Slots, notches 2 S1 4.0 % S4 2.5 % Conductor width 2 S1 4.0 % S4 2.5 % Conductor spacing 2 S1 4.0 % S4 2.5 % Misalignment of hole and land 2 S1 4.0 % S4 2.5 % Positional tolerance of hole centres 2 S1 4.0 % S4 2.5 % Sub-group A3 Spare group for additional group A tests NOTE T
43、his listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999, Table 1). c Acceptability quality level.BS 123600:2001 4 BSI 17 December 2001 Table 2
44、 Group B quality conformity inspection Inspection group Characteristics Test no. a Assessment level A Assessment level B Assessment level C Assessment level D IL b AQL c IL AQL IL AQL IL AQL Sub-group B1 Dimensional interchangeability See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Not applicabl
45、e Sub-group B2 Solderability As received 14a S2 2.5 % S3 2.5 % After accelerated ageing 20a S2 2.5 % S3 2.5 % Sub-group B3 Shock tests Not applicable Sub-group B4 Mechanical tests Peel strength, conductor to base material 10c S2 2.5 % Pull-off strength, lands with plain holes (if applicable) 11a S2
46、2.5 % Sub-group B5 Surface finish tests (if applicable) Adhesion of plating 13a S1 2.5 % S2 2.5 % Thickness of plating, contact areas 13f S2 2.5 % Sub-group B6 Spare group for additional group B tests NOTE This listing may be subject to continuing review, as required by the publication and revision
47、of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999, Table 1). c Acceptability quality level.BS 123600:2001 BSI 17 December 2001 5 Table 3 Group C quality conformity inspection Inspection group Characteristics Test no. a Assessment
48、 level A Assessment level B Assessment level C Assessment level D No. b Defects c No. Defects No. Defects No. Defects Sub-group C1 Tests in 3-month intervals See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Insulation resistance before and after damp heat 6a 3 1 Change in resistance of plated-thr
49、ough holes 3c 6 1 Sub-group C2 Tests in 12-month intervals Not applicable Sub-group C3 Spare group for additional intervals NOTE This listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Number of specimens to be tested. c Maximum permissible number of defects.BS 123600:2001 6 BSI 17 December 2001 9 Test patterns and test boards 9.1 Gener
