1、BRITISH STANDARD BS5131-1.7: 1991 Methods of test for Footwear and footwear materials Part1: Adhesives Section1.7 Preparation of test assemblies using hot melt adhesives for heat resistance (creep) and peel tests NOTEIt is recommended that this Section should be read in conjunction with BS5131-0, pu
2、blishedseparately.BS5131-1.7:1991 This BritishStandard, having been prepared under the directionof the Textiles and Clothing Standards Policy Committee, was published underthe authority ofthe Standards Board and comes intoeffect on 31 July1991 BSI12-1999 First published April1981 Second edition July
3、1991 The following BSI references relate to the work on this standard: Committee referenceTCM/39 Draft for comment89/36219DC ISBN 0 580 19605 4 Committees responsible for this BritishStandard The preparation of this BritishStandard was entrusted by the Textiles and Clothing Standards Policy Committe
4、e (TCM/-) to Technical Committee TCM/39, upon which the following bodies were represented: British Footwear Manufacturers Federation British Leather Confederation British Rubber Manufacturers Association British Steel plc Consumer Standards Advisory Committee of BSI Cork Industry Federation Footwear
5、 Components Federation Footwear Distributors Federation Institute of Trading Standards Administration Iron and Steel Trades Confederation Lancashire Footwear Manufacturers Association Mail Order Traders Association of Great Britain Ministry of Defence National Union of Footwear, Leather and Allied T
6、rades Office of Fair Trading SATRA Footwear Technology Centre The following bodies were also represented in the drafting of the standard, through subcommittees and panels: British Adhesives and Sealants Association British Paper and Board Industry Federation British Plastics Federation Multiple Shoe
7、 Retailers Association RAPRA Technology Ltd. Amendments issued since publication Amd. No. Date CommentsBS5131-1.7:1991 BSI 12-1999 i Contents Page Committees responsible Inside front cover Foreword ii 1 Scope 1 2 Principle 1 3 Number and size of test specimens, and surface preparation of adherends 1
8、 4 Application of adhesive and direct bonding of the test assembly 3 5 Application of adhesive and indirect bonding of the test assembly 6 6 Storage of test assemblies 10 7 Cutting of test specimens 10 Figure 1 Hot melt applicator gun and roller press 4 Figure 2 Test assembly and test specimen prepa
9、red by direct bonding for peel test 5 Figure 3 Test assembly support jig for use with roller press 6 Figure 4 Test assembly (of single test specimen width) prepared by indirect bonding for peel test as described in BS5131-1.2 7 Figure 5 Test assembly (of single test specimen width) prepared by indir
10、ect bonding for heat resistance (creep) test as described in BS5131-1.1 8 Publication(s) referred to Inside back coverBS5131-1.7:1991 ii BSI 12-1999 Foreword This Section of BS5131 has been prepared under the direction of the Textiles and Clothing Standards Policy Committee. It supersedes BS5131-1.7
11、:1981, which is withdrawn. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pag
12、es This document comprises a front cover, an inside front cover, pagesi andii, pages1 to10, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover.BS5
13、131-1.7:1991 BSI 12-1999 1 1 Scope This Section describes methods for the preparation of test assemblies with various forms of hot melt adhesive by methods which simulate their use in shoe manufacturing for sole attaching, adhesive lasting and the laminating of upper components. Where the test assem
14、blies are prepared by indirect bonding, they are intended for use in either the resistance to heat (creep test) described in BS5131-1.1 or the resistance to peeling test described in BS5131-1.2. However, where the test assemblies are prepared by direct bonding, they are intended for use in BS5131-1.
15、2 only, since the temperature given in BS5131-1.1 is not sufficient to soften the adhesive. The methods of preparation are applicable to a wide variety of combinations of adhesives and materials, but the peel and creep tests of BS5131-1.1 and BS5131-1.2 require at least one adherend to be flexible.
16、NOTEThe titles of the publications referred to in this standard are listed on the inside back cover. 2 Principle 2.1 General Rectangular pieces of adherend materials are prepared and bonded to form a test assembly. Thetest assemblies are of a suitable size to provide test specimens in accordance wit
17、h the methods given in BS5131-1.1 and BS5131-1.2. They differ from those for the solvent-based adhesives described in BS5131-1.3 as follows. a) The methods of adhesive application and bonding are different. b) For some methods of adhesive application, there are limitations to the width of the band o
18、f adhesive which can be applied. As a consequence, certain test assemblies have the same width as a test specimen (instead of having twice the width of a test specimen, as preferred in BS5131-1.3 and illustrated in Figure1 of BS 5131-1.3:1991). Bonding may be by direct or indirect methods, depending
19、 on the form of the adhesives and the intended conditions of use. 2.2 Direct bonding The adhesive is applied to one adherend as a molten ribbon and the assembly is closed and bonded immediately. NOTEThis method should normally be used for peel testing of lasting adhesives and may be appropriate for
20、peel testing of sole-attaching adhesives. 2.3 Indirect bonding A solidified layer of adhesive is applied to one or both adherends in the form of one of the following: a) a precoating already applied; b) a coating applied as described in5.2.3.1; c) a film attached to or laid on the adherends. The adh
21、esive is either heat reactivated immediately before pressing to form a bond or is activated by hot pressing an assembly of both adherends. NOTE 1The indirect bonding method is used for heat resistance (creep) testing and peel testing of sole attaching adhesives and for the peel testing of upper lami
22、nating adhesives. NOTE 2The bonding methods given in2.2 and2.3 are in commercial use. The choice of method for preparing test assemblies should be determined by the recommendations of the adhesive supplier, the shoe factory practice being simulated, or the possible conditions of use which are being
23、studied. Further variations of these procedures are permissible, if necessary, to correspond to particular factory conditions or to simulate the use of hot melt adhesives for operations other than lasting or sole attaching. In all cases the bonding conditions should be stated as described in the app
24、ropriate test report, i.e.clause11 of BS5131-1.1:1991 or clause10 of BS5131-1.2:1991. 3 Number and size of test specimens, and surface preparation of adherends 3.1 Indirect bonding 3.1.1 Creep testing 3.1.1.1 General The surface preparation techniques (thatis,roughing and solvent wiping) are carried
25、 out in the same manner as described in4.1.3 and4.1.4 of BS5131-1.3:1991. Similarly, the surface preparation methods for specific materials (that is, which preparation technique is to be used for a particular type of material) are the same as in4.2 of BS5131-1.3:1991. 3.1.1.2 Procedure For each test
26、 condition being investigated, produce sufficient test assemblies to enable15 test specimens30.0 0.5mm by approximately100mm to be prepared. (Seeclause9 of BS5131-1.1:1991.)BS5131-1.7:1991 2 BSI 12-1999 Mechanical surface preparation (referred to as roughing) often produces irregular edges, conseque
27、ntly, where roughing of adherend material is required (see4.2 of BS5131-1.3:1991), first cut the adherend material into rectangles approximately70mm by approximately100mm. Then prepare the surface of the adherend material as described in4.1.3 of BS5131-1.3:1991. If the adhesive applicator(5.1.2) can
28、 satisfactorily coat material which is70mm wide, do not cut this roughed rectangle further. However, if the adhesive applicator cannot satisfactorily coat material which is70mm wide, cut two strips approximately5mm by100mm from the edges of the rectangle, and cut the remainder into two rectangular s
29、trips30.0 0.5mm by approximately100mm (ensuring that all strips have been cut in the same direction and that their edges are regular and undamaged). Where roughing of adherend material is not required (see4.2 of BS5131-1.3:1991) either adopt the above order of procedures (with the exception that sur
30、face preparation of the adherend material is as described in4.1.4 of BS5131-1.3:1991), or alternatively cut the adherend material into rectangular strips30.0 0.5mm by approximately100mm (ensuring that all strips have been cut in the same direction and that their edges are regular and undamaged) and
31、then prepare the surfaces as described in4.1.4 of BS5131-1.3:1991. NOTERoughing before cutting into strips results in the edges of the test specimen being cut after mechanical surface preparation of the adherend has been carried out, thereby ensuring that the test specimens do not have any irregular
32、 edges. 3.1.2 Peel testing Proceed as in3.1.1 with the following exceptions. a) Produce sufficient test assemblies, from which four test specimens30.0 0.5mm by approximately50mm (preferred) or20.0 0.5mm by approximately50mm (allowed) can be prepared (where3.1.1 states sufficient test assemblies, fro
33、m which15test specimens30 0.5mm by approximately100mm can be prepared). b) Cut the adherend material into rectangular strips30.0 0.5mm by approximately50mm (preferred) or20.0 0.5mm by approximately50mm (allowed) (where3.1.1 states rectangular strips30.0 0.5mm by approximately100mm). NOTERecent devel
34、opments relating to indirect bonding using hot melt adhesives are such that in some cases it may be difficult or inconvenient to prepare test assemblies wide enough to produce test specimens30mm wide. In such cases, the allowed test specimen is as described in the note to5.2.1. 3.2 Direct bonding Pr
35、oceed as in3.1.2 with the following exceptions. a) Cut the adherend material into rectangles approximately50mm by approximately100mm in those cases where3.1.2 refers to3.1.1 which states approximately70mm by approximately100mm (see3.1.1.2). b) Produce sufficient test assemblies from which four test
36、specimens20.0 0.5mm by approximately100mm can be prepared in those cases where3.1.2 states sufficient test assemblies from which four test specimens30.0 0.5mm by approximately50mm (preferred) or20.0 0.5mm by approximately50mm (allowed) can be prepared see3.1.2 a). NOTEAt present, direct bonded hot m
37、elt adhesives are not used in those footwear applications which need to be assessed by the creep test. 3.3 Additional procedures for direct and indirect bonded test specimens where these are for lasting purposes NOTEThe bond in lasting is normally between the reverse of an upper material and the rev
38、erse (non-wearing) surface of a leather or board insole material. These surfaces are not normally prepared before application of the adhesive. Board properties may be directional and, for peel tests where one of the materials is board, prepare test assemblies in each of the following three direction
39、s: a) in the machine direction and with the run of the sheet; b) in the machine direction and against the run of the sheet; c) in the cross direction. In such cases, regard each of these three directions as a separate test condition (thereby requiring three times the number of test specimens). 3.4 A
40、dditional procedures for direct and indirect bonded test specimens where these are for sole-attaching purposes Prepare the materials prior to adhesive application by the procedures described in4.2 of BS5131-1.3:1991. If mechanical preparation (roughing as described in4.1.3 of BS5131-1.3:1991) is nec
41、essary, carry this out in the two opposite longitudinal directions. Do not allow the two directions of preparation to overlap outside the area subsequently covered by the paper or tape insert.BS5131-1.7:1991 BSI 12-1999 3 4 Application of adhesive and direct bonding of the test assembly 4.1 Apparatu
42、s and material 1) 4.1.1 Paper and strip. Strip of gummed or self-adhesive paper or adhesive tape for defining the bonding area. 4.1.2 Adhesive applicator. A hot melt applicator gun or other apparatus equipped with a melting chamber and an application nozzle with the following features. a) The melt c
43、hamber accepts adhesive in granular form. The chamber is of such a size that less than100g of adhesive is sufficient to purge the apparatus. b) The melt chamber and nozzle are electrically heated and are capable of melting the adhesive and heating it to the desired application temperature. This is n
44、ormally in the range100 C to300 C. The adhesive temperature at the nozzle is maintained to within5 C of the desired application temperature. c) A pneumatic or mechanical system enables molten adhesive to be expelled at a steady rate. The quantity applied in one pass is sufficient to ensure that a sl
45、ight excess exudes from the edges of the test assembly on pressing. NOTE 1A typical applicator gun is shown diagrammatically in Figure 1. NOTE 2Apparatus working at one particular temperature is not generally suitable, but may be used for producing test assemblies when the adhesive is to be applied
46、at this particular temperature. NOTE 3Apparatus requiring the adhesive to be in precise forms, e.g.sticks or a continuous rod of fixed dimensions, is not suitable in all cases, but may be used for producing test assemblies when the adhesive is available in these particular forms. 4.1.3 Pyrometer. Th
47、ermocouple wire pyrometer suitable for checking the temperature of the applied adhesive. 4.1.4 Bonding press. The bonding press is as described in eithera) orb) as follows. a) A power driven roller press with roller peripheral speed of between200mm/s and500mm/s. A suitable press of double roller for
48、m is shown diagrammatically in Figure 1. Thepress is pneumatically or spring loaded and capable of applying a force of between30N and100N per centimetre width of test assembly. NOTE 1This will usually be sufficient to spread the adhesive across the full width of the test assembly as a layer of unifo
49、rm thickness. This thickness is normally about0.4mm but should be not less than0.2mm and not more than1.0mm. b) A rapid acting platen press capable of applying a pressure of between0.3MPa and1.0MPa. NOTE 2This will usually be sufficient to spread the adhesive across the full width of the test assembly as a layer of uniform thickness. This thickness is normally about0.4mm but should be not less than0.2mm and not more than1.0mm. The bottom platen of the press is equipped with a pad of rubber at least10mm thick, and of hardness between30IRHD and50IR
