1、BRITISH STANDARD BS 5350-H3: 1984 Methods of test for Adhesives Part H3: Determination of heat resistance of hot-melt adhesives UDC 665.93:620.176.251BS5350-H3:1984 This British Standard, having been prepared under the directionof the Adhesives Standards Committee, was published under the authority
2、ofthe Board of BSI and comes intoeffect on 29 February 1984 BSI 07-1999 The following BSI references relate to the work on this standard: Committee reference ADC/9 Draft for comment 81/53126 DC ISBN 0 580 13597 7 Amendments issued since publication Amd. No. Date of issue CommentsBS5350-H3:1984 BSI 0
3、7-1999 i Contents Page Foreword ii 0 Introduction 1 1 Scope and field of application 1 2 Principle 1 3 Supplementary information 1 4 Apparatus 1 5 Test materials 1 6 Procedure 2 7 Expression of results 2 8 Test report 2 Figure 1 Bonded test assembly and weight 2 Figure 2 Assembly under shear 3 Publi
4、cation referred to Inside back coverBS5350-H3:1984 ii BSI 07-1999 Foreword This Part of this British Standard has been prepared under the direction of the Adhesives Standards Committee. It is one of a series of methods for the assessment of physical properties of hot-melt adhesives published as sepa
5、rate Parts of group H of this standard. WARNING NOTE. This British Standard calls for the use of substances and/or procedures that may be injurious to health if adequate precautions are not taken. It refers only to technical suitability and does not absolve the user from legal obligations relating t
6、o health and safety at any stage. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary
7、 of pages This document comprises a front cover, an inside front cover, pages i and ii, pages1 to4, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front c
8、over.BS5350-H3:1984 BSI 07-1999 1 0 Introduction Because hot-melt adhesives are thermoplastic their performance alters with temperature. One of the more noticeable changes is the loss of bond strength with increasing temperature. This loss is influenced by a number of factors that include the type o
9、f adhesive, the temperature(s) involved, the length of time of exposure to elevated temperature, the magnitude and direction of the stresses imposed on the bond line and the nature of the adherends. As a result of these factors only general guidance can be given as to the heat resistance of specific
10、 adhesives. The procedure described in this Part of this standard may be used to compare different adhesives. The text of this method is written with carton board as the specified adherend, so that the method is particularly suited to packaging applications. However the method will also be useful to
11、 other users and other adherends suitable to the application may be specified when the method is called up. 1 Scope and field of application This Part of this British Standard describes a method for determining the temperature at which a lap joint bonded with a hot-melt adhesive fails when subjected
12、 to a constant shear force. The method is applicable to hot-melt adhesives which are sufficiently stable to enable a film to be prepared. The results by this method do not necessarily indicate the performance of the adhesive in any particular service condition. NOTEThe title of the publication refer
13、red to in this standard is given on the inside back cover. 2 Principle A previously prepared film of the test adhesive is melted on a carton board substrate at a specified temperature and is immediately made into a lap joint using a second carton board adherend. The joint is subjected to a constant
14、shear force which is a small fraction of that required to produce rupture at ambient temperature. The stressed joint is supported in an oven and the temperature is raised progressively until failure of the joint occurs. The temperature of failure is taken as a measure of the heat resistance. 3 Suppl
15、ementary information This method of test requires the following supplementary information which shall be specified when the method is called up. a) Details of the carton board or other adherend to be used including any specified properties. b) The temperature at which the bond is to be made. c) The
16、weight or shear force to be applied to the bonded test assembly. 4 Apparatus 4.1 Normal laboratory apparatus 4.2 Oven, fitted with a circulation fan and an indicating thermometer, capable of maintaining a temperature to within 2 C over a range of temperatures appropriate to the melting point of the
17、test adhesive. 4.3 Weights, 1 kg (for bonding) and 100 g or other weights appropriate to the adhesive and adherends concerned. If required the load may be applied to the bonded test piece by a suitable device. 4.4 Adjustable rollers, or other suitable equipment for the preparation of the adhesive fi
18、lm. 5 Test materials 5.1 Adherend. The adherend shall be carton board of suitable surface strength 1)(see note). The material to be used shall be specified when this method is called up. Unless otherwise specified the carton board shall be white lined chipboard of thickness about 500 4m. NOTEThe tes
19、t is comparative and the result will depend on the cohesive strength of the board surfaces and their ability to be wetted by molten adhesive. The surface strength may be characterized by specifying the wax pick number determined according to the method described in ASTM Method D 2482-76. Separate te
20、st results will be required for the lined and unlined surfaces of the board. It is not however possible to specify a particular wax pick number. A suitable value is one which provides a joint that shows a sharp transition from complete fibre tear to no tear in the test. 5.2 Test pieces. Cut test pie
21、ces from the board25mm wide and at least 50 mm long. Two test pieces shall be used for each test. 1) Information on the availability of a suitable board is available on application to the Enquiry Section (London), British Standards Institution.BS5350-H3:1984 2 BSI 07-1999 5.3 Preparation of adhesive
22、 film. Gently heat a quantity of adhesive until molten and maintain it in this state until any entrained air is removed. Prepare a uniform film from the molten adhesive0.2mm thick at least 25 mm wide and of sufficient length to allow several test pieces25mm 25mm to be cut from it. A recommended meth
23、od for preparing the film is to sandwich a small quantity of adhesive between two layers of a suitable release paper previously dried at60 C to 80 C for 30 min. Pass the composite through a pair of adjustable rollers, allow the film to cool and remove the release paper. 6 Procedure Cut from the adhe
24、sive film a piece 25 mm 25 mm and place it on the lined surface of a test piece of carton board at one end. Place a second test piece of carton board, the unlined surface in contact with the adhesive so as to form a lap joint (see Figure 1). Heat the oven to the temperature specified for making the
25、bond. Transfer the joint assembly to the oven and maintain at the specified temperature for5min. Remove the assembly from the oven without disturbing the alignment and immediately position the 1 kg weight over the bonded area as shown in Figure 1. Maintain at room temperature for 24 h. Remove the we
26、ight and support the bonded assembly by one end in a vertical position and attach to the other end a weight of 100 g or other weights as specified (see Figure 2). Alternatively attach the test assembly in the device selected to apply the necessary shear force. Set the oven to a temperature of 30 C.
27、NOTEIf the failure temperature is known approximately, the oven may be set initially to a temperature 30 C below the expected failure temperature to reduce testing time. Transfer the suspended bonded test assembly to the oven and maintain it for 15 min at this temperature. Raise the oven temperature
28、 progressively by 5 C increments, maintaining the temperature after each increment for 15 min. Note the temperature at which the bond fails. Examine the mode of failure. If this is other than cohesive, the test is invalid and should be repeated. Carry out three tests. If the temperatures at which th
29、e bond fails are not within two adjacent 5 C intervals reject the series of tests. 7 Expression of results Express the heat resistance of the test adhesive as (T 5) C where T is the mean temperature at which bond failure occurred. 8 Test report The report shall state the following: a) a designation
30、of the adhesive giving all necessary information for the complete identification of the sample; b) the items of supplementary information given in clause 3; c) the result of the test; d) that the method of test complied with the requirements of this standard, i.e. BS 5350-H3, or, if it did not, the
31、respects in which it did not comply. Figure 1 Bonded test assembly and weightBS5350-H3:1984 BSI 07-1999 3 Figure 2 Assembly under shear4 blankBS5350-H3:1984 BSI 07-1999 Publication referred to ASTM Method D 2482-76 Wax pick test for surface strength of paper, Annual Book of ASTM. Standards1982-20.BS
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