1、BRITISH STANDARD BS CECC 23200-801: 1998 Harmonized system of quality assessment for electronic components Capability detail specification: Single and double-sided printed boards with plated through holes ICS 31.180BSCECC23200-801:1998 This British Standard, having been prepared under the directiono
2、f the ElectrotechnicalSector Board, was published underthe authorityof the Standards Boardand comes into effect on 15 June 1998 BSI 05-1999 ISBN 0 580 29892 2 National foreword This British Standard is the English language version of CECC23200-801:1998 published by the European Electronic Components
3、 Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). It supersedes BS EN123200-800:1992 which is withdrawn. This standard should be read in conjunction with the most recent editions of BS EN123000 and BS EN123200. The UK participation in its preparation was ent
4、rusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed;
5、monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this
6、document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users
7、of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theCECC title page, pages2to27 and a back c
8、over. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSCECC23200-801:1998 BSI 05-1999 i Contents Page National foreword In
9、side front cover Foreword 2 Text of CECC 23 200-801 3ii blankDETAIL SPECIFICATION SPCIFICATION PARTICULIRE BAUARTSPEZIFIKATION CECC 23 200-801 February 1998 Supersedes EN123200-800:1992 English version Capability detail specification: Single and double-sided printed boards with plated-through holes
10、Spcification particulire dAgrment: Cartes imprimes simple ou double face trousmtalliss Bauartspezifikation zur Anerkennung der Befhigung: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten Lchern This CECC Detail Specification was approved on1997-08-06. Up-to-date li
11、sts and bibliographical references of other detail specifications relating to EN123000:1991 and EN123200:1992 may be obtained on application to the Central Secretariat or to any CENELEC member. This CECC Detail Specification exists in three official versions (English, French, German). A version in a
12、ny other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Fi
13、nland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische
14、Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. CECC 23 200-801:1998 ECECC23200-801:1998 BSI 05-1999 2 Foreword This Capability Detail Specification has been prepare
15、d by CENELEC/TC CECC/SC52, Printed Boards (formerly designated CECC Working Group23). It was approved as CECC23 200-801 on1997-08-06. This Capability Detail Specification replaces EN123200-800:1992. It should be read in conjunction with EN123000:1991 and EN123200:1992 and with the current regulation
16、s for the CECC System. Contents Page Foreword 2 1 General 1.1 Scope 3 1.2 Object 3 2 Capability qualifying component 2.1 Materials 3 2.2 Surface finishes 4 2.2.1 Metallic finishes 4 2.2.1.1 Accelerated ageing 4 2.2.2 Organic finishes 4 2.3 Variant designation 5 3 Capability approval 3.1 Range of cap
17、ability approval 5 3.2 QPL information 5 4 Capability test programme 4.1 Capability demonstration 5 4.1.1 Other metallic surface finishes 5 4.1.2 Organic surface finishes 5 4.1.3 External bonded heatsinks 6 4.1.4 Demonstration of impedance control 6 5 Additional capability 6 Traceability Annex A Sui
18、table test pattern for marking inks 17 Annex B Suitable test pattern for solder masks 18 Annex C Suitable test pattern for bonded heatsinks 19 Annex D Edge connector imperfections 20 Annex E CTP subdivision for thermal shock 21 Annex F Circumferential defects in plated-through holes 22 Page Annex G
19、Determination of characteristicimpedanceby TDR 22 Figure G.1 Possible equipment configuration 25 Figure G.2 Schematic showing undisturbedinterval 26 Figure G.3 Schematic showing undisturbedinterval; in situ method 26 Figure G.4 Incident Wave Voltage showing(2x)Air Line delay 27 Figure G.5 Test speci
20、men details 27 Table I Capability approval test schedule 7 Table IIa Additional metallic conductor finishes 11 Table IIb Additional contact finishes 14 Table III Permanent organic finishes 15 Table IV Bonded heatsinks 16CECC23200-801:1998 BSI 05-1999 3 1 General 1.1 Scope This Capability Detail Spec
21、ification (CapDS) is based upon EN123200. It relates to rigid single and double-sided printed boards with plated-through holes, made with materials and surface finishes as specified in clause 2. 1.2 Object To specify the Capability Qualifying Component (CQC), its characteristics to be tested, the te
22、st methods and conditions to be applied and the requirements to be fulfilled for testing basic and extended capability. 2 Capability Qualifying Component (CQC) Test boards to be used as CQCs for basic capability shall: be made from one of the copper-clad base materials specified in 2.1 of this CapDS
23、, base material thickness of1,6mm 0,14mm and354m copper foil on both sides. bear the composite test pattern (CTP) specified in 8.2 of EN123200 (or equivalent CTP). have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16, 17 or 18 in 2.2 of this CapDS. Requirements for test boards
24、 to be used as modified CQCs for the demonstration of additional capability are detailed in clause 5 of this CapDS. 2.1 Materials Material Group designation Specification Base Material Base material thickness range (mm) Cu thickness (4m) Type Grade A EN 60249-2-1 Phenolic paper High Electrical EN 60
25、249-2-2 Phenolic Paper Economic EN 60249-2-6 Phenolic Paper Defined flammability (horizontal) 0,2 6,4 18, 35, 70, 105 EN 60249-2-7 Phenolic Paper Defined flammability (vertical) EN 60249-2-3 Epoxide Paper Defined flammability (vertical) EN 60249-2-4 Epoxide Woven Glass General purpose B 0,2 6,4 18,
26、35, 70, 105 EN 60249-2-5 Epoxide Woven Glass Defined flammability (vertical)CECC23200-801:1998 4 BSI 05-1999 2.2 Surface finishes 2.2.1 Metallic finishes The demonstration of metallic group finishes 21, 22, 23 or 24 shall be combined with a finish from groups11, 12, 13, 14, 15, 16, 17 or 18. Each cl
27、aimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the same material, where claimed, must be demonstrated separately. 2.2.1.1 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16, 17 or 18 to solder after extended or adverse s
28、torage conditions is demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. Each finish that has complied with the requirements of the ageing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the m
29、anufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes (where claimed) The demonstration of organic finish groups a, b, c or d shall be over a finish from groups 11, 12, 13, 14, 15, 16, 17 or 18. All claimed types of solder resist shall be tested separately. Finish group
30、 Designation Surface finish Abbreviation for QPL Remarks 11 Bare copper Cu 12 Copper with solderable organic surface protection Cu(osp) 13 Copper with oxide Cu(CuO) 14 Tin, Tin-Lead Sn, SnPb 15 Tin-Lead (fused) SnPb(f) 16 Tin-Lead (dipped and levelled) SnPb(dl) 17 Tin-Lead (roller coated) SnPb(rt) 1
31、8 Immersion Gold over Electroless Nickel AuNi(smt) 19 not assigned 20 not assigned 21 Specimen K 5 4m, gold plated on copper, remainder using finish group 11-17 (see below) 5AuCu 22 Specimen K 0,7 4m, gold plated on nickel, remainder using finish group 11-17 (see below) 0,7AuNi 23 Specimen K 2,5 4m,
32、 gold plated on copper, remainder using finish group 11-17 (see below) 2,5AuCu 24 Specimen K 2,5 4m, gold plated on nickel, remainder using finish group 11-17 (see below) 2,5AuNi Finish group designation Organic finish Abbreviation for QPL a Dry film solder mask DSM b Wet resist solder mask WSM c Li
33、quid photopolymer solder mask LSM d Marking ink MI e Conductive ink CICECC23200-801:1998 BSI 05-1999 5 2.3 Variant designation The combination of any material group designated in 2.1 and any of the surface finishes designated in2.2 constitutes a variant. The variant is designated by the combination
34、of both material and finish group designations. e.g. A12(b) or A12/21(c). 3 Capability approval 3.1 Range of capability approval Capability approval granted on the testing of one variant is valid within the limits specified in 3.7 of EN123000 for metal clad base material within one group designation
35、, all base material thicknesses and all foil thicknesses of the material in accordance with 2.1 of this CapDS; and all metallic surface finishes within one surface finish group as given in 2.2.1 of this CapDS, that is: 3.2 QPL information Information for the QPL (published as CECC00200) shall be giv
36、en in accordance with clause 3.4 of EN123000, and shall contain the following details relative to the CapDS: 4 Capability test programme NOTEIn all cases the number of failures permitted is zero. 4.1 Capability demonstration Capability shall be demonstrated using9 CTPs of one variant from each mater
37、ial group claimed. Testing shall be in accordance with Table I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface finishes, as designated in 2.2.1 shall be demonstrated by the manufacture and testing of3 CTPs plus sufficient extra A and H specimens to meet the requirements of
38、Table II. The maximum active board size for the finish shall be demonstrated. See also clause 5. 4.1.2 Organic surface finishes Each claimed organic surface finish, as designated in 2.2.2, shall be demonstrated by the manufacture and testing of3 CTPs using the pattern specified in Annex A (marking i
39、nks) or Annex B (solder masks). Testing shall be in accordance with Table III. finish group 11 Covers finish group 11 only finish group 12 Covers finish group 11 and 12 finish group 13 covers finish group 11 and 13 finish group 14 covers finish group 11 and 14 finish group 15 covers finish group 11
40、and 15 finish group 16 covers finish group 11 and 16 finish group 17 covers finish group 17 only finish group 18 covers finish group 18 only finish group 21 covers finish group 21 only finish group 22 covers finish group 22 and 24 finish group 23 covers finish group 21 and 23 finish group 24 covers
41、finish group 24 only reference to the CECC Generic Specification EN123000 reference to the CECC Sectional Specification EN123200 reference to the CECC CapDS CECC23200-801 base material for which approval is granted as given in 2.1 of this CapDS the surface finishes for which approval is granted as g
42、iven in 2.2 of this CapDS any additional capability 3.5.3 of EN123000 refersCECC23200-801:1998 6 BSI 05-1999 4.1.3 External bonded heatsinks Where claimed, each bonded heatsink and adhesive system shall be demonstrated by the manufacture of three CTPs using the pattern specified in Annex C. Testing
43、shall be in accordance with Table IV of this CapDS. 4.1.4 Demonstration of impedance control Special CQCs shall be constructed in accordance with Figure G.5, configured as either a “stripline” or “microstrip”. Demonstrations shall be made for the following variants, as required and defined by the ap
44、proved manufacturer: each base material type (e.g. woven glass epoxide); each impedance extreme, and a507 mandatory demonstration; conductor width and lateral separation minima; each metallic surface finish. Tolerances at507 and each impedance extreme shall be claimed prior to demonstration, and ach
45、ieved. For each solder resist type and thickness claimed, impedance value derating factors shall be declared. Impedance control shall be shown on the Capability Approval certificate as a separate annex. 5 Additional capability Maximum active board size see8.3 of EN123000 6 Traceability Traceability
46、of all specimens to the original product shall be maintained. The method used to identify individual test specimens shall not prejudice the test result. Plated through hole diameters Specimen C (microsection coupon) of CTP employed minimum drilled hole diameter; use2,0 mm pads minimum clearance diam
47、eter; use2,5 mm pads Maximum aspect ratio Minimum conductor width and spacing Specimen F of the CTP to be modified to provide additionally5 conductors and4 spacings, each of the claimed minimum. Initial foil thickness of less than354m may be used for this demonstration, but the thickness used shall
48、be declared. Metallic conductor finishes Manufacturers are permitted to demonstrate conductor finishes other than those detailed in 2.2.1. The finish shall be demonstrated in accordance with Table IIa and detailed in the manufacturers Capability Manual. nominal base material thickness for maximum nu
49、mber of layers minimum drilled hole diameter -CECC23200-801:1998 BSI 05-1999 7 Table I Capability approval test schedule Characteristics Test No. IEC 60326-2 Specimen of Composite Test Pattern Requirements/Material Remarks EN 60249-2- paper glass 2 1 6 7 3 4 5 General examination Visual examination Conformity and identifica
